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    COATED METALLIC PRODUCT
    1.
    发明专利
    COATED METALLIC PRODUCT 失效

    公开(公告)号：JP2001152385A

    公开(公告)日：2001-06-05

    申请号：JP2000286389

    申请日：2000-09-21

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  FAN CHONGLUN

    IPC: C25D5/12 ,  B32B15/01 ,  C23C18/08 ,  C25D5/10 ,  C25D7/00 ,  H01L23/495 ,  H01L23/50 ,  H01R13/03

    Abstract: PROBLEM TO BE SOLVED: To provide a surface finish of a metallic substrate low in porosity and capable of preventing corrosion in every environment. SOLUTION: In this invention, a metallic substrate is coated with a multilayer surface finishing material containing an amorphous metallic lower layer, a corrosion resistant metallic intermediate layer and a one or more noble metal external layer in succession. In one embodiment, the metallic substrate is composed of a copper alloy, the amorphous metal lower layer is composed of Ni-P, the intermediate layer is composed of nickel, and the external layer is composed of palladium, respectively. The structure obtained as a result is particularly useful as an electric connector.

    PROCESS FOR CONTROLLING FLOW-OUT OF RESIN IN INTEGRATED CIRCUIT PACKAGING
    6.
    发明专利
    PROCESS FOR CONTROLLING FLOW-OUT OF RESIN IN INTEGRATED CIRCUIT PACKAGING 失效

    公开(公告)号：JPH11340252A

    公开(公告)日：1999-12-10

    申请号：JP11186199

    申请日：1999-04-20

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  FAN CHONGLUN

    IPC: H01L21/52 ,  H01L23/495

    Abstract: PROBLEM TO BE SOLVED: To prevent a resin from flowing to the surface of a substrate at solidification or a bonding agent, by processing an IC substrate with a material which reduces its interface energy, and decreasing the wettability on the surface of the IC substrate using the material. SOLUTION: A lead frame 100 forms an IC mounting region 110, and the region 110 is provided with a plurality of independent lead members 120 extending away from its adjoining part. An IC unit 125 is bonded to the IC mounting region 110 using a bonding agent 130, and the IC unit 125 is electrically connected to the lead frame 100 using a wire bond 135 formed between the IC unit 125 and the lead member 120. On the IC substrate of the lead frame 100, a material layer 105 which is a lower side interface energy layer is formed, and the material layer 150 decreases the wettability of the surface of the IC substrate.

    Process for controlling resin bleeding in integrated circuit packaging
    8.
    发明专利
    Process for controlling resin bleeding in integrated circuit packaging 未知

    公开(公告)号：SG71204A1

    公开(公告)日：2000-03-21

    申请号：SG1999001692

    申请日：1999-04-20

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： JOSEPH ANTHONY ABYS ,  FAN CHONGLUN

    IPC: H01L23/495 ,  H01L21/52 ,  H01L21/58

    Abstract: A method for controlling resin bleeding on integrated circuit packages (125) is disclosed. Resin bleeding is controlled by lowering the surface energy of an IC substrate (110) to less than or about equal to the surface energy of an adhesive (130) which attaches IC units thereto. The IC substrate is treated with a material (150) that lowers its surface energy. The material layer forms a less wettable surface on the IC substrate which inhibits resin bleeding when the adhesive applied thereto is hardened. The material layer is formed from a solution of a polymer in a solvent. Suitable polymers include polyfluorinated hydrocarbon compounds.

    9.
    发明专利
    未知

    公开(公告)号：DE60200154D1

    公开(公告)日：2004-02-05

    申请号：DE60200154

    申请日：2002-04-10

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  FAN CHONGLUN ,  XU CHEN ,  ZHANG YUN

    IPC: C25D7/00 ,  C23C28/00 ,  C25D3/56 ,  C25D5/10 ,  C25D5/12 ,  C25D5/26 ,  H01L23/50 ,  H01R13/03

    Abstract: In accordance with the invention, a metal substrate (10) is coated with a multilayer finish (11) comprising a layer (13) of tin or tin alloy and one or more outer metal layers (14). An optional metal underlayer (12) may be disposed between the substrate and the tin (13). In an exemplary embodiment the metal substrate comprises copper alloy coated with a nickel underlayer, a layer of tin and an outer metal layer of palladium. The resulting structure is particularly useful as an electrical connector or lead frame.

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