中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

30 records (took 0.023 seconds)

    COATED METALLIC PRODUCT
    3.
    发明专利
    COATED METALLIC PRODUCT 失效

    公开(公告)号：JP2001152385A

    公开(公告)日：2001-06-05

    申请号：JP2000286389

    申请日：2000-09-21

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  FAN CHONGLUN

    IPC: C25D5/12 ,  B32B15/01 ,  C23C18/08 ,  C25D5/10 ,  C25D7/00 ,  H01L23/495 ,  H01L23/50 ,  H01R13/03

    Abstract: PROBLEM TO BE SOLVED: To provide a surface finish of a metallic substrate low in porosity and capable of preventing corrosion in every environment. SOLUTION: In this invention, a metallic substrate is coated with a multilayer surface finishing material containing an amorphous metallic lower layer, a corrosion resistant metallic intermediate layer and a one or more noble metal external layer in succession. In one embodiment, the metallic substrate is composed of a copper alloy, the amorphous metal lower layer is composed of Ni-P, the intermediate layer is composed of nickel, and the external layer is composed of palladium, respectively. The structure obtained as a result is particularly useful as an electric connector.

    LEAD FRAME AND ELECTROPLATING METHOD
    4.
    发明专利
    LEAD FRAME AND ELECTROPLATING METHOD 失效

    公开(公告)号：JPH1060685A

    公开(公告)日：1998-03-03

    申请号：JP14911497

    申请日：1997-06-06

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  CHONGLUN FAN ,  IGOR VELJKO KADI JA

    IPC: C25D3/12 ,  C25D5/12 ,  C25D7/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50

    Abstract: PROBLEM TO BE SOLVED: To provide a nickel coating of a lead frame which is not cracked when applied with a stress corresponding to the packaging of an electronic device. SOLUTION: The metallic lead frame substrate of a lead frame consists of copper, copper alloy or nickel alloy, the lead frame 10 is coated with a conformal nickel coating, and the lead frame substrate is made resistant to cracking when bent through an angle of at least 82 with 150-300μm radius of curvature. When the lead frame 10 is bent by this method, the surface of the lead frame substrate is deformed. Provided that the depth of deformation does not exceed about 5μm, a crack passing through the thickness of the conformal nickel coating is not brought about.

    PROCESS FOR CONTROLLING FLOW-OUT OF RESIN IN INTEGRATED CIRCUIT PACKAGING
    6.
    发明专利
    PROCESS FOR CONTROLLING FLOW-OUT OF RESIN IN INTEGRATED CIRCUIT PACKAGING 失效

    公开(公告)号：JPH11340252A

    公开(公告)日：1999-12-10

    申请号：JP11186199

    申请日：1999-04-20

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  FAN CHONGLUN

    IPC: H01L21/52 ,  H01L23/495

    Abstract: PROBLEM TO BE SOLVED: To prevent a resin from flowing to the surface of a substrate at solidification or a bonding agent, by processing an IC substrate with a material which reduces its interface energy, and decreasing the wettability on the surface of the IC substrate using the material. SOLUTION: A lead frame 100 forms an IC mounting region 110, and the region 110 is provided with a plurality of independent lead members 120 extending away from its adjoining part. An IC unit 125 is bonded to the IC mounting region 110 using a bonding agent 130, and the IC unit 125 is electrically connected to the lead frame 100 using a wire bond 135 formed between the IC unit 125 and the lead member 120. On the IC substrate of the lead frame 100, a material layer 105 which is a lower side interface energy layer is formed, and the material layer 150 decreases the wettability of the surface of the IC substrate.

    PRODUCTION OF PALLADIUM TETRAAMINE SULFATE
    8.
    发明专利
    PRODUCTION OF PALLADIUM TETRAAMINE SULFATE 失效

    公开(公告)号：JP2001026427A

    公开(公告)日：2001-01-30

    申请号：JP2000160159

    申请日：2000-05-30

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  DULLAGHAN CONOR ANTHONY ,  EPSTEIN PETER ,  MAISANO JOSEPH JOHN

    IPC: C25D3/00 ,  C01G55/00 ,  C25D3/50 ,  C25D3/56 ,  C25D21/12 ,  C25D21/18

    Abstract: PROBLEM TO BE SOLVED: To obtain a replenishing agent for electroplating bath, which is low in corrosive properties by distillating a palladium nitrate solution formed from palladium and an excess amount of a nitrate solution at a specified temp. and then adding palladium sulfate and ammonium hydroxide. SOLUTION: A palladium nitrate solution is prepared by washing a prescribed amount of metal palladium with HCl of about 40 to 60 deg.C to activate the palladium and bringing the palladium into contact with an excess amount of a nitrate solution. The nitrate solution is prepared using nitric acid and the nitrate solution is used preferably in the range of about 15 to 50 g/l. The palladium nitrate solution is distilled at a low temp. of

    ELECTROPLATING SOLUTION FOR ELECTROPLATING LEAD AND LEAD-TIN ALLOY
    9.
    发明专利
    ELECTROPLATING SOLUTION FOR ELECTROPLATING LEAD AND LEAD-TIN ALLOY 失效

    公开(公告)号：JP2000226686A

    公开(公告)日：2000-08-15

    申请号：JP2000027522

    申请日：2000-02-04

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  KENNETH J MULSKI ,  ZHANG YUN

    IPC: C25D3/00 ,  C25D3/32 ,  C25D3/36 ,  C25D3/56 ,  C25D3/60 ,  H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To provide an aq. electroplating soln. for electroplating the coating films of bright tin and tin-lead alloy solder at a high speed, especially an electroplating soln. having a simplified chemical action to minimize the effect of org. matter on the solder coating film. SOLUTION: An electroplating soln. for plating coating films of bright tin, lead or tin-lead alloy for use in high-speed electroplating contains an alkane or alkanolsulfonic acid electrolyte, a nonionic surfactant, a grain comminuting agent and two kinds of brighteners, i.e., an aromatic aldehyde and a carboxylic acid. In one way of using the electroplating soln., methanesulfonic acid is used as the sulfonic acid electrolyte, octylphenoxy(10)polyethoxyethanol as the nonioic surfactant, phenolphthalein as the grain comminuting agent, chlorobezaldehyde as the aromatic aldehyde and methacrylic acid as the carboxylic acid.

    ELECTROPLATING PALLADIUM ALLOY COMPOSITION AND ELECTROPLATING METHOD USING THE COMPOSITION
    10.
    发明专利
    ELECTROPLATING PALLADIUM ALLOY COMPOSITION AND ELECTROPLATING METHOD USING THE COMPOSITION 失效

    公开(公告)号：JPH11217690A

    公开(公告)日：1999-08-10

    申请号：JP32872498

    申请日：1998-11-19

    Applicant: LUCENT TECHNOLOGIES INC

    Inventor： ABYS JOSEPH ANTHONY ,  BOGUSLAVSKY IRINA ,  STRASCHIL HEINRICH K

    IPC: C25D3/56

    Abstract: PROBLEM TO BE SOLVED: To obtain an electrochemically stable, lustrous and adhesive deposit by allowing a first ligand to form a Pd salt complex and a second ligand to form the complex of other alloy metal salts, making the electroplating reduction potential of the alloy metal close to that of Pd as compared with the alloy metal electroplating reduction potential using the first ligand only and that of Pd. SOLUTION: The alloy metal salt contains a base metal selected from a group consisting of Co and Fe, and the second ligand contains oxygen. More concretely, the one selected from mono-, di- and polycarboxylic acids or their derivatives, e.g. the acetate, citrate and ethylenediamine tetraacetate, is preferably used. The concn. of the Pd salt is appropriately controlled to >=0.01 mol/l, the first ligand should be ammonia, mono-, di- and polyamine, and the concn. is appropriately controlled to 0.01-2.0 mol/l. The plating bath is preferably controlled to pH3.0-10.0.

Patent Agency Ranking