公开(公告)号：DE69705262T2

公开(公告)日：2002-04-18

申请号：DE69705262

申请日：1997-05-27

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH ANTHONY ,  KADIJA IGOR VELJKO ,  FAN CHONGLUN

IPC: C25D3/12 ,  C25D5/12 ,  C25D7/00 ,  H01L21/48 ,  H01L23/495 ,  H01L23/50

Abstract: The present invention is directed to a lead frame in which the metal lead frame substrate is copper, copper alloy, or nickel alloy. The lead frame substrate is coated with a conformable nickel coating that is crack-resistant when the lead frame is bent to an angle of at least 82 degrees with a bend radius of about 150 mu m to about 300 mu m. Bending the lead frame in this manner causes surface deformations in the lead frame substrate. Cracks do not appear through the thickness of the conformable nickel coating of the present invention when the depth of the deformations that result from this bending do not exceed about 5 mu m.

公开(公告)号：SG77691A1

公开(公告)日：2001-01-16

申请号：SG1999002769

申请日：1999-06-07

Applicant: LUCENT TECHNOLOGIES INC

Inventor： ABYS JOSEPH ANTHONY ,  BLAIR ALAN ,  FAN CHONGLUN

IPC: C23C28/00 ,  C23C28/02 ,  H01L23/50 ,  C25D3/50 ,  C25D3/52 ,  C25D5/12 ,  H01L21/48 ,  H01L21/607 ,  H01L23/495

Abstract: A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN50) while at least one material layer has a hardness that is less than about 250 (KHN50).

公开(公告)号：CA2270303A1

公开(公告)日：1999-12-10

申请号：CA2270303

申请日：1999-04-27

Applicant: LUCENT TECHNOLOGIES INC

Inventor： BLAIR ALAN ,  FAN CHONGLUN ,  ABYS JOSEPH ANTHONY

IPC: H01L23/50 ,  C23C28/00 ,  C23C28/02 ,  C25D3/50 ,  C25D3/52 ,  C25D5/12 ,  H01L21/48 ,  H01L21/607 ,  H01L23/495 ,  C25D7/00 ,  C25D5/10 ,  C25D5/16

Abstract: A surface finish which provides improved wirebonding performance for integrated circuit packages is disclosed. The surface finish which is formed on a substrate includes a palladium layer and one or more material layers. The one or more material layers are interposed between the substrate and the palladium layer. The palladium layer has a hardness that is less than about 500 (KHN50) while at least one material layer has a hardness that is less than about 250 (KHN50).