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公开(公告)号:FR2645348A1
公开(公告)日:1990-10-05
申请号:FR9003885
申请日:1990-03-27
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: SUZUMURA MASAHIKO , KATAOKA KAZUSHI , KOMODA TAKUYA
IPC: H01L21/335 , H01L29/739
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公开(公告)号:DE3842468A1
公开(公告)日:1989-06-29
申请号:DE3842468
申请日:1988-12-16
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: TOMII KAZUSHI , ABE TOSHIROH , KOMODA TAKUYA
Abstract: A semiconductor device is formed with a high specific resistance zone between the anode and cathode zones on each side of the device, with a lattice defect zone in the anode zone in the vicinity of the high specific resistance zone. As a result, the turn-off time for the device can be sufficiently shortened, not only at normal temperatures, but at relatively high temperatures as well.
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公开(公告)号:AU2003292557A1
公开(公告)日:2004-07-29
申请号:AU2003292557
申请日:2003-12-26
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: ICHIHARA TSUTOMU , KOMODA TAKUYA , AIZAWA KOICHI , HONDA YOSHIAKI , BABA TORU
Abstract: A field emission-type electron source has a plurality of electron source elements ( 10 a) formed on the side of one surface (front surface) of an insulative substrate ( 11 ) composed of a glass substrate. Each of electron source elements ( 10 a) includes a lower electrode ( 12 ), a buffer layer ( 14 ) composed of an amorphous silicon layer formed on the lower electrode ( 12 ), a polycrystalline silicon layer ( 3 ) formed on the buffer layer ( 14 ), a strong-field drift layer ( 6 ) formed on the polycrystalline silicon layer ( 3 ), and a surface electrode ( 7 ) formed on the strong-field drift layer ( 6 ). The field emission-type electron source can achieved reduced in-plain variation in electron emission characteristics.
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公开(公告)号:DE69914556D1
公开(公告)日:2004-03-11
申请号:DE69914556
申请日:1999-09-25
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: KOMODA TAKUYA , ICHIHARA TSUTOMU , AIZAWA KOICHI , KOSHIDA NOBUYOSHI
Abstract: There is provided a field emission electron source at a low cost in which electrons can be emitted with a high stability and a high efficiency and a method of producing the same. In the field emission electron source, a strong electric field drift part 106 is formed on the n-type silicon substrate on the principal surface thereof and a surface electrode 107 made of a gold thin film is formed on the strong electric field drift part 106. And the ohmic electrode 2 is formed on the back surface of the n-type silicon substrate 101. In this field emission electron source 110, when the surface electrode 107 is disposed in the vacuum and a DC voltage is applied to the surface electrode 107 which is of a positive polarity with respect to the n-type silicon substrate 101 (ohmic electrode 2), electrons injected from the n-type silicon substrate 101 are drifted in the strong electric field drift part 106 and emitted through the surface electrode 107. The strong electric field drift part 106 comprises a drift region 161 which has a cross section in the structure of mesh at right angles to the direction of thickness of the n-type silicon substrate 1, which is an electrically conductive substrate, and a heat radiation region 162 which is filled in the voids of the mesh and has a heat conduction higher than that of the drift region 161.
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公开(公告)号:AT259097T
公开(公告)日:2004-02-15
申请号:AT99118925
申请日:1999-09-25
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: KOMODA TAKUYA , ICHIHARA TSUTOMU , AIZAWA KOICHI , KOSHIDA NOBUYOSHI
Abstract: There is provided a field emission electron source at a low cost in which electrons can be emitted with a high stability and a high efficiency and a method of producing the same. In the field emission electron source, a strong electric field drift part 106 is formed on the n-type silicon substrate on the principal surface thereof and a surface electrode 107 made of a gold thin film is formed on the strong electric field drift part 106. And the ohmic electrode 2 is formed on the back surface of the n-type silicon substrate 101. In this field emission electron source 110, when the surface electrode 107 is disposed in the vacuum and a DC voltage is applied to the surface electrode 107 which is of a positive polarity with respect to the n-type silicon substrate 101 (ohmic electrode 2), electrons injected from the n-type silicon substrate 101 are drifted in the strong electric field drift part 106 and emitted through the surface electrode 107. The strong electric field drift part 106 comprises a drift region 161 which has a cross section in the structure of mesh at right angles to the direction of thickness of the n-type silicon substrate 1, which is an electrically conductive substrate, and a heat radiation region 162 which is filled in the voids of the mesh and has a heat conduction higher than that of the drift region 161.
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公开(公告)号:SG74751A1
公开(公告)日:2000-08-22
申请号:SG1999004823
申请日:1999-09-24
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: KOMODA TAKUYA , ICHIHARA TSUTOMU , AIZAWA KOICHI , KOSHIDA NOBUYOSHI
Abstract: There is provided a field emission electron source at a low cost in which electrons can be emitted with a high stability and a high efficiency and a method of producing the same. In the field emission electron source, a strong electric field drift part 106 is formed on the n-type silicon substrate on the principal surface thereof and a surface electrode 107 made of a gold thin film is formed on the strong electric field drift part 106. And the ohmic electrode 2 is formed on the back surface of the n-type silicon substrate 101. In this field emission electron source 110, when the surface electrode 107 is disposed in the vacuum and a DC voltage is applied to the surface electrode 107 which is of a positive polarity with respect to the n-type silicon substrate 101 (ohmic electrode 2), electrons injected from the n-type silicon substrate 101 are drifted in the strong electric field drift part 106 and emitted through the surface electrode 107. The strong electric field drift part 106 comprises a drift region 161 which has a cross section in the structure of mesh at right angles to the direction of thickness of the n-type silicon substrate 1, which is an electrically conductive substrate, and a heat radiation region 162 which is filled in the voids of the mesh and has a heat conduction higher than that of the drift region 161.
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公开(公告)号:SG67550A1
公开(公告)日:1999-09-21
申请号:SG1998003332
申请日:1998-08-27
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: KOMODA TAKUYA , KOSHIDA NOBUYOSHI
Abstract: A field emission electron source comprising an electrically conductive substrate 1, an oxidized or nitrided porous polysilicon layer 6 formed on the surface of said electrically conductive substrate on one side thereof and having nano-structures and a thin metal film 7 formed on said oxidized or nitrided porous polysilicon layer. Wherein a voltage is applied to said thin metal film used as a positive electrode with respect to said electrically conductive substrate thereby to emit electron beam through said thin metal film.
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公开(公告)号:DE3842468C3
公开(公告)日:1998-03-26
申请号:DE3842468
申请日:1988-12-16
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: TOMII KAZUSHI , ABE TOSHIROH , KOMODA TAKUYA
IPC: H01L29/08 , H01L29/32 , H01L29/74 , H01L29/73 , H01L29/30 , H01L21/263 , H01L29/423
Abstract: A semiconductor device is formed with a high specific resistance zone between the anode and cathode zones on each side of the device, with a lattice defect zone in the anode zone in the vicinity of the high specific resistance zone. As a result, the turn-off time for the device can be sufficiently shortened, not only at normal temperatures, but at relatively high temperatures as well.
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公开(公告)号:DE4009675C2
公开(公告)日:1995-04-06
申请号:DE4009675
申请日:1990-03-26
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: SUZUMURA MASAHIKO , KATOAKA KAZUSHI , KOMODA TAKUYA
IPC: H01L21/335 , H01L29/739 , H01L21/332 , H01L29/74
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公开(公告)号:GB2213988A
公开(公告)日:1989-08-23
申请号:GB8828659
申请日:1988-12-08
Applicant: MATSUSHITA ELECTRIC WORKS LTD
Inventor: TOMII KAZUSHI , ABE TOSHIROH , KOMODA TAKUYA
Abstract: A semiconductor device is formed with a high specific resistance zone between the anode and cathode zones on each side of the device, with a lattice defect zone in the anode zone in the vicinity of the high specific resistance zone. As a result, the turn-off time for the device can be sufficiently shortened, not only at normal temperatures, but at relatively high temperatures as well.
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