公开(公告)号：JP2009016608A

公开(公告)日：2009-01-22

申请号：JP2007177449

申请日：2007-07-05

Applicant: Mitsui High Tec Inc ,  株式会社三井ハイテック

Inventor： MATSUNAGA KIYOSHI ,  MORI SHUJI

IPC: H01L23/50 ,  H01L23/28

CPC classification number: H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/3511 ,  H01L2924/00014

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device preventing a side surface (stand-off side surface) of a mounted terminal exposed when a mounted terminal adjacent thereto is separated by etching lead frames from a rear surface, from being contaminated because of oxidation, and also to provide a manufacturing method thereof.
SOLUTION: The semiconductor device is manufactured in such a way that the lead frames are etched from the rear surface to form a mounted terminal with stand-off, the side surface of the mounted terminal exposed by etching is subjected to application of a copper decoloration preventing agent or a preflux, or to non-electrolyte plating using Au, Ag as a plating material, and thus a protective film 30 is formed.
COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种半导体器件，其防止当通过从背面蚀刻引线框架而将与其相邻的安装端子分离时安装的端子的侧表面（支撑侧表面）被暴露，从而被污染，因为 的氧化，并且还提供其制造方法。 解决方案：半导体器件制造成使得引线框架从后表面被蚀刻以形成具有支架的安装端子，通过蚀刻暴露的安装端子的侧表面被施加 铜脱色防止剂或预过氧化物，或者使用Au，Ag作为电镀材料进行非电解质电镀，形成保护膜30。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2000210728A

公开(公告)日：2000-08-02

申请号：JP1414699

申请日：1999-01-22

Applicant: MITSUI HIGH TEC

Inventor： MATSUNAGA KIYOSHI

IPC: B21D28/14

Abstract: PROBLEM TO BE SOLVED: To blank a good punched part in high productivity without clogging a die hole with scrap when blanking an extremely small hole or a soft/viscous material and without damaging a punch/die by arranging thermosetting resin on the inner wall of a die hole. SOLUTION: A punch 1 is advanced/retreated in a die hole 3, a small diameter through-hole is blanked to a material 4 to be blanked. A temp. of the punch 1 and the die hole 3 is raised by blanking, but since there is a thermosetting resin 5 in the die hole, a blanked scrap 6 is not seized and is successively slid down in each blanking. The position to arrange the thermosetting resin 5 is lower than the bottom dead center of the punch 1, it is preferable to arrange the thermosetting resin 5 through a sleeve by coating. The thermosetting resin 5 is preferably fluororesin, polyether chloride, cellulose, ester or polyamide.

公开(公告)号：JP2000063019A

公开(公告)日：2000-02-29

申请号：JP24915598

申请日：1998-08-18

Applicant: MITSUI HIGH TEC

Inventor： SHIMAZU HIROSHI ,  MATSUNAGA KIYOSHI

IPC: B65H18/10 ,  B65H23/195

Abstract: PROBLEM TO BE SOLVED: To eliminate a difference of slack in each line without requiring a pit by providing a slip mechanism on a winding part, adjusting tension to be added to each line material for every line material and slipping an arbitrary line material. SOLUTION: A material 6 mounted on an uncoiler 5 is delivered to a cutter part 8 through a pinch roll 7 and a line material 9 slit in this cutter part 8 is wound by a winding part 2 via a tension adding part 3. The tension adding part 3 is constituted of a pad and an air cylinder pressing the line material 9 and controls depressing amount on each line material 9 by the air cylinder. A position sensor 4 detects slack for every line material 9. The winding part 2 mounts line materials 9 corresponding to a plurality of coils 12 mounted on a winding shaft 1 and winds line materials 9 by rotating the winding shaft 1. When tension is applied to the line material 9 and this tension exceeds magnetic force integrating the coil 12 and the winding shaft 1, the coil 12 slips.

公开(公告)号：JPH1076417A

公开(公告)日：1998-03-24

申请号：JP23047496

申请日：1996-08-30

Applicant: MITSUI HIGH TEC

Inventor： MATSUNAGA KIYOSHI

IPC: B23D19/06 ,  B21C47/26

Abstract: PROBLEM TO BE SOLVED: To shorten a line length by rotation-driving a peripheral speed of roll rows substantially to conform it to a peripheral speed of a slitting cutter, and forming a loop respectively in a steel plate strip and a slit material in an in/out side of the slitting cutter. SOLUTION: As a system detecting respective loop height by loop height detecting sensors 7a, 7b, a rotation drive speed of each driving gear 3a, 4a, 5a can be controlled by a controller 6. For instance, when a loop height between a slitting cutter 3 and a deflector roll 5 is decreased, that is, approximated to a linear path, in the case of control with a peripheral speed of the slitting cutter 3 serving as the reference, by decreasing a peripheral speed of the deflector roll 5, a loop is deepened, and a slit material 23 is maintained in a condition with tension left as zero.

公开(公告)号：JP2001056846A

公开(公告)日：2001-02-27

申请号：JP23278399

申请日：1999-08-19

Applicant: MITSUI HIGH TEC

Inventor： MATSUNAGA KIYOSHI

IPC: G06K19/07 ,  B42D15/10 ,  G06K19/077 ,  H01L21/60

Abstract: PROBLEM TO BE SOLVED: To prevent the direct contact of a wire and a spiral pattern by connecting a semiconductor chip and the spiral pattern while using the wire, and interposing an insulating member at a position where the wire crosses the spiral pattern. SOLUTION: On a substrate 10, a spiral pattern 12 is formed and this spiral pattern 12 is spirally arranged from the center of the substrate 10 to the edge and provided with an inner peripheral terminal 20 and an outer peripheral terminal 22 for a connection with a semiconductor chip 14. Then, the semiconductor chip 14 is connected through a wire 16 to the inner peripheral terminal 20 and the outer peripheral terminal 22 of the spiral pattern 12. At such a time, when placing the semiconductor chip 14 on the center of the spiral pattern 12, an insulating member 18 is interposed between the wire 16 connected to the outer peripheral terminal 22 and the spiral pattern 12.

公开(公告)号：JPH10109217A

公开(公告)日：1998-04-28

申请号：JP28172696

申请日：1996-10-02

Applicant: MITSUI HIGH TEC

Inventor： FUKUDA KENICHI ,  MATSUNAGA KIYOSHI

IPC: B23D19/06 ,  B23D33/02

Abstract: PROBLEM TO BE SOLVED: To make a material to be slit move in parallel to a circular cutter and slit the material in a predetermined width by fixing a pressing guide for the material to be slit on a support plate with the horn parts as action shafts and fixing a spring for energizing a support force to one end and fixing a guide roller contacting the material to be slit to the other end. SOLUTION: A DS side guide 2 is fixed to a guide plate 3 with the horn parts of a bifurcated L-shaped stay 16 as action shafts 17 and a spring is fixed to one end of it and a guide roller 4 is fixed to the other end of it. Each guide roller 4 is independently rotated and is being always pressed by the spring to a material to be slit. Since each guide roller 4 independently individually copies and follows the end of the material to be slit without separating therefrom for the changed width of the DS side guide 2 side of the material to be slit, the material to be slit is always pressed to a WS side guide 1 by a uniform force and moved in parallel to a circular cutter 5 and can be slit accurately in a predetermined width.

公开(公告)号：JPH0839334A

公开(公告)日：1996-02-13

申请号：JP19794894

申请日：1994-07-29

Applicant: MITSUI HIGH TEC

Inventor： MATSUBARA TOSHIYA ,  SUEMUNE KENICHIRO ,  SHIRAKI SHIGETOSHI ,  MATSUNAGA KIYOSHI

IPC: B23D19/06 ,  B23D19/04 ,  B23D33/02

Abstract: PURPOSE:To precisely slit a plate width from a material to be slit by cutting with one side perpendicular and the other slant, by providing a cutting device having a round tooth on one side of a material to be slit with a plate passing line between, and providing a rotation bearing roll making contact with the material to be slit on the other side. CONSTITUTION:The space between round teeth 3a, 3b of a cutting device 2 is set to a prescribed plate width. A plate passing line 1 is regulated so that the non-slit side end of the material to be slit passes the set position of rotation bearing rolls 11a, 11b. Thereafter, the material to be slit is passed, and only one side of the material to slit is slit by the round teeth 3a, 3b. Although the material to be slit receives a force for obliquely traveling or snaking it because of cutting with one side perpendicular and the other slant the force directed to other than the passing direction is constrained in the non-slit side end surface by the rotation bearing rolls 11a, 11b, and the material to be slit is linearly traveled and slit to a prescribed plate width.

公开(公告)号：JP2007142050A

公开(公告)日：2007-06-07

申请号：JP2005331937

申请日：2005-11-16

Applicant: Mitsui High Tec Inc ,  株式会社三井ハイテック

Inventor： MATSUNAGA KIYOSHI ,  MIMURA SHINYA ,  SHIOYAMA TAKAO

IPC: H01L23/50

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayered lead frame which can certainly join individual lead frame single plates to be stacked with relatively small load, and also to provide a multilayered lead frame manufactured by the same.
SOLUTION: The multilayered lead frame is manufactured by stacking and joining a plurality of the lead frame single plates 10 and 12 which are processed in individual predetermined shapes. In manufacturing the multilayered lead frame, a plurality of projections 12 are formed on either one of the facing planes of the lead frame single plates 10 and 11 which are going to make an up and down pair. The facing lead frame single plates 10 and 11 are joined via the projections 12.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种制造多层引线框架的方法，该多层引线框架当然可以以相对较小的载荷连接到单个引线框单板以堆叠，并且还提供由其制造的多层引线框架。 解决方案：多层引线框架通过堆叠和接合以各个预定形状加工的多个引线框单板10和12来制造。 在制造多层引线框架时，多个突起12形成在引线框架单板10和11的要上下成对的面对面之一上。 面对的引线框架单板10和11通过突起12连接。版权所有：（C）2007，JPO＆INPIT

公开(公告)号：JP2007134584A

公开(公告)日：2007-05-31

申请号：JP2005327631

申请日：2005-11-11

Applicant: Mitsui High Tec Inc ,  株式会社三井ハイテック

Inventor： MATSUNAGA KIYOSHI ,  MIMURA SHINYA

IPC: H01L23/50

CPC classification number: H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a laminated lead frame having at least two lead frame plates which can be easily stacked, can reduce a manufacturing cost, and in some cases, can be manufactured without forming a pilot hole in the side rail of the finished laminated lead frame, and to provide the laminated lead frame. SOLUTION: The method has a first step of forming a plurality of pairs each having recesses 12 and 13, and a plurality of pairs each having recesses 14 and 15 by half etching or by semi-punching at the same positions of at least two lead frame plates 10 and 11; a second step of stacking the lead frame plates 10 and 11 by fitting projections 14 and 15 in the corresponding recesses 12 and 13; and a third step of joining the stacked lead frame plates 10 and 11 by heating and compressing the plates. COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 解决的问题：为了提供一种具有至少两个易于堆叠的引线框架板的叠层引线框架的制造方法，可以降低制造成本，并且在一些情况下可以在不形成导向孔的情况下制造 在完成的层叠引线框架的侧轨中，并且提供层压引线框架。 解决方案：该方法具有形成多个对的第一步骤，每对具有凹槽12和13，以及多个对，每对具有凹槽14和15半蚀刻或通过在至少相同位置的半冲压 两个引线框架板10和11; 通过将突起14和15嵌合在相应的凹部12和13中来堆叠引线框架板10和11的第二步骤; 以及通过加热和压缩板来连接堆叠的引线框架板10和11的第三步骤。 版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2000151110A

公开(公告)日：2000-05-30

申请号：JP34114198

申请日：1998-11-13

Applicant: MITSUI HIGH TEC

Inventor： KITA MICHIAKI ,  MATSUNAGA KIYOSHI

IPC: H05K3/46 ,  H01L23/12 ,  H05K1/11 ,  H05K3/40

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a via hole in a multilayer wiring board and a multilayer wiring board with high reliability at a low cost by forming a via hole used as a conductor by pressworking. SOLUTION: In this method of forming a via hole in a multilayer wiring board, a conductor 15 for connecting conductive metal foils 11A, 11B on both sides of an insulating member 12 is constituted at a predetermined position of a multilayer wiring board 10 where a plurality of conductive metal foils 11A, 11B are laminated via an insulating member 12. The conductive metal foil 11A on one side of the multilayer wiring board 10 is placed on the side of a backup plate 13. A draw punch 14 is pressed on the conductive metal foil 11B on the other side to form a concave part 16 in a part of the conductive metal foil 11B so that the insulating member 12 is penetrated. The concave part 16 is brought into contact with the conductive metal foil 11A on the other side to constitute the conductor 15.