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公开(公告)号：JPH09205172A
公开(公告)日：1997-08-05
申请号：JP3000796
申请日：1996-01-23
Applicant: MITSUI HIGH TEC
Inventor： KITA MICHIAKI
IPC: H01L23/50
Abstract: PROBLEM TO BE SOLVED: To make it possible to form inner leads without forming a shoe bottom by ensuring a flat width at a wire connector by punching the side of the lead from the reverse direction. SOLUTION: A sheet strip material is set to a first press for first punching, and one surface of the lead side and the part except the lead 8 are machined. A second press for second punching is set so that a sheet strip material is reversely machined, and the surface not punched by the first punching and the part except the lead 8 are machined. Accordingly, the one punched part of the upper and lower surfaces of the lead 8 are formed in sag shape 3, and the other punched part is formed in a bur shape 4. Thus, the flat width can be obtained, and no shoe bottom shape is formed.
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公开(公告)号：JPH0821653B2
公开(公告)日：1996-03-04
申请号：JP30987889
申请日：1989-11-29
Applicant: MITSUI HIGH TEC
Inventor： KITA MICHIAKI , UMEDA KAZUHIKO
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公开(公告)号：JPH0583178B2
公开(公告)日：1993-11-25
申请号：JP10749887
申请日：1987-04-30
Applicant: MITSUI HIGH TEC
Inventor： ISAYAMA MINAO , KITA MICHIAKI
IPC: H01L21/60
Abstract: PURPOSE:To avoid deformations of internal leads and facilitate improving the manufacturing yield and the reliability of a semiconductor device by a method wherein the tip parts of the internal leads are linked and fixed by an insulating film provided so as to keep away from bonding areas. CONSTITUTION:A semiconductor element 3 is mounted on the die pad 2 of a lead frame 1 and, at the same time, the semiconductor element 3 is connected to the internal leads 4 of the lead frame 1 by bonding wires 5 and housed in a sealing package 6. In a semiconductor device like this, an insulating film 7 which is fixed so as to keep away from the bonding areas of the tips of the internal leads 4 and links the respective internal leads 4 is provided. Some 4b of the internal leads 4 of the lead frame 1 extended close to the die pad 2 are extended closer to the die pad 2 with smaller lead widths than the other leads 4a to form widened parts (f) at the tips of the leads 4b.
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公开(公告)号：JPH09205173A
公开(公告)日：1997-08-05
申请号：JP3000896
申请日：1996-01-23
Applicant: MITSUI HIGH TEC
Inventor： TANABE SABURO , KITA MICHIAKI
Abstract: PROBLEM TO BE SOLVED: To provide a lead frame in which inner leads and bus bars have excellent flatness without any twist and tilt and onto which adhesive insulating tape can tightly be stuck with its good flattening without its local peeling off or improper adhesion. SOLUTION: In the method for manufacturing a lead frame having inner leads and bus bars which are intended to have a semiconductor chip mounted on their lower or upper surfaces, a plate is blanked so that at least inner leads 1 or bus bars 2 are connected at their intermediate parts by connecting pieces 9. After the plate is annealed, the connecting pieces 9 are removed from the plate. In this case, the removal of the connecting pieces 9 is carried out after the annealing and before the removal the pieces 9, by applying pressure sensitive adhesive double coated insulating tape onto the inner leads 1 and bus bars 2.
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公开(公告)号：JPH0950776A
公开(公告)日：1997-02-18
申请号：JP19863195
申请日：1995-08-03
Applicant: MITSUI HIGH TEC
Inventor： KITA MICHIAKI
Abstract: PROBLEM TO BE SOLVED: To provide a lead frame having excellent workability, high accuracy and high profitability by connecting an anode lead part which is provided with anode leads respectively having an engagement part, and a cathode lead frame with a cathode lead part made of the material different from the material of the anode lead part. SOLUTION: A first engagement part 13 is provided in both ends of a frame 11 of an anode lead part 10, which is provided with multiple leads 12 in the vertical direction from the anode lead frame 11, and each first engagement part 13 is engaged with each engagement part 23 of a cathode filament 21 forming a cathode part 20 made of the material different from the material of the lead part 10. This filament 21 and a cathode frame 22 are similarly connected to each other, and a lead frame for fluorescent display tube having the excellent workability, high accuracy and high profitability without the necessity of etching and stamping is thereby obtained.
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Patent Agency Ranking
公开(公告)号：JPH08264699A
公开(公告)日：1996-10-11
申请号：JP9138795
申请日：1995-03-23
Applicant: MITSUI HIGH TEC
Inventor： KITA MICHIAKI , HYODO YASUYUKI
IPC: H01L23/50
Abstract: PURPOSE: To improve shape accuracy without deforming an inner lead when simultaneously performing punching along the tip of the inner lead so that the pad side of a tape which is adhered to a support bar is partially cut from the outside of an edge part inner lead. CONSTITUTION: An inner lead 3 with a tape 6 adhered is punched to shorten it to a specific length or is separated from such connection part as a pad 1. Since the punching is made simultaneously wit the tape 6, the adhered tape 6 partially cuts the pad side from the outside of an edge part inner lead 3a to a support bar 2. Therefore, when simultaneously punching the tip of the inner lead 3 and the tape 6, the inner lead 3 cannot be engaged to a punch although the space between the edge part inner lead 3a and the support bar 2 is wider than others, thus preventing the inner lead 3 from being deformed and improving the shape accuracy.
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公开(公告)号：JPH03184639A
公开(公告)日：1991-08-12
申请号：JP32107789
申请日：1989-12-11
Applicant: MITSUI HIGH TEC
Inventor： KITA MICHIAKI , UMEDA KAZUHIKO
Abstract: PURPOSE:To improve the strength and productivity of a punch by providing an area wider than the width of a long groove at a part corresponding to at least one end of the long groove of the punch for a die assembly for punching the long groove. CONSTITUTION:Pressing is carried out with a punch made up so that a punched part in the cavity area C is wide in width, an end part is circular and the lead interval is large. Then, the cavity area C of the inner lead end part left in this forming stage is punched, the die pad is separated from the tip of the inner lead and working for the shape of the lead frame is finished. When the lead frame is formed in such way, the buckling strength is improved, the straight part of the punch can be lengthened, the strength of the punch is improved drastically and a high-accuracy and excellent lead frame can be formed.
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公开(公告)号：JPS63308358A
公开(公告)日：1988-12-15
申请号：JP14478787
申请日：1987-06-10
Applicant: MITSUI HIGH TEC
Inventor： KITA MICHIAKI , OKA MANABU
IPC: H01L23/50
Abstract: PURPOSE:To reduce the occurrence of defects by causing the bonding surface side to become a burr side in the end of the inner lead and causing the upper surface to become a sag side. CONSTITUTION:The cross-sectional shape is different in the outside and inside of a tiebar 13 with a lince C as a boundary, and in the end part of an inner lead 12, a sag side (d) is positioned in the underside and in the upper surface, a deburring side (d) is planarized by coining. On the other hand, in an outer lead part 14, it is constructed so that the upper surface becomes the sag side (d) and the underside becomes the deburring side (b). With this, a sufficient effective plane width can be obtained without affecting the lead spacing and, even in bending the outer lead, a highly reliable semiconductor device can be formed without producing a metallic powder.
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公开(公告)号：JP2005136340A
公开(公告)日：2005-05-26
申请号：JP2003373066
申请日：2003-10-31
Applicant: Mitsui High Tec Inc , 株式会社三井ハイテック
Inventor： KITA MICHIAKI , TSUJIMOTO KEIICHI
IPC: H01L23/50
CPC classification number: H01L2224/48091 , H01L2224/48247 , H01L2224/49109 , H01L2224/73265 , H01L2924/00014
Abstract: PROBLEM TO BE SOLVED: To provide a premolded package capable of reducing inter-lead short-circuiting, by widening intervals between adjacent inner leads and further preventing generation of non-conformity in wire bonding, and to provide a semiconductor device which uses the same.
SOLUTION: The premolded package has a package body 13 which has a mount 16 to be mounted with an electronic component 12 at an inner hollow part 15 and a plurality of inner leads 19 and 20 at a hollow part 15 except the mount 16, and also has an outer lead 21 connecting with the inner leads 19 and 20 outside, and its sealing lid 14. The inner leads 19 and 20 are provided in a plurality of stages, and the tip of the inner lead 20, arranged in the lower stage 18, is arranged closer to the center side than to the tip of the inner lead 19 arranged in the upper stage 17.
COPYRIGHT: (C)2005,JPO&NCIPIAbstract translation: 要解决的问题：为了提供能够减少引线间短路的预成型封装，通过扩大相邻内部引线之间的间隔并进一步防止引线接合中不一致的产生，并提供使用 一样。 解决方案：预成型包装具有包装体13，其具有安装件16，该安装件16在内部中空部分15处安装有电子部件12，并且在除了安装件16之外的中空部分15处具有多个内部引线19和20 并且还具有与内部引线19和外部20连接的外部引线21及其密封盖14.内部引线19和20设置成多个级，并且内部引线20的尖端布置在 下级18布置在靠近中心侧的布置在上级17中的内引线19的尖端。版权所有（C）2005，JPO＆NCIPI
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公开(公告)号：JPH10154785A
公开(公告)日：1998-06-09
申请号：JP32764996
申请日：1996-11-22
Applicant: MITSUI HIGH TEC
Inventor： KITA MICHIAKI , HYODO YASUYUKI
IPC: H01L23/50
Abstract: PROBLEM TO BE SOLVED: To obtain a lead frame which does not cause lead overlap and does not deform outer leads during transportation, succeeding processes, etc., and has excellent mountability and on which the outer leads are bent before a semiconductor chip is mounted on the lead frame. SOLUTION: A lead frame is provided with inner leads 2 around a pad 1 and outer leads 4 on the opposite side of the pad 1 through tie bars 3. The rear end section of each outer lead 4 is connected to a connecting piece 6 having a rounded corner, bent downward at an obtuse angle from the outside of the tie bar 3 and in the opposite direction in the intermediate section, and become horizontal after the intermediate section. The part of the outer lead 4 on the rear side of the connecting piece 6 is bent in a jumping up state.
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