公开(公告)号：CA2001496C

公开(公告)日：1997-10-21

申请号：CA2001496

申请日：1989-10-25

Applicant: MITSUI TOATSU CHEMICALS

Inventor： KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  OHKOSHI KOUJI ,  YAMAGUCHI AKIHIRO ,  OHTA MASAHIRO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI

IPC: C08G73/10

Abstract: The present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carring out condensation of 4,4'- bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a diamine compound and/or tetracarboxylic acid dianhydride. The polyimides have a non-crystalline structure and exhibit excellent thermal resistance and processability.

公开(公告)号：DE3889380T2

公开(公告)日：1994-12-15

申请号：DE3889380

申请日：1988-05-31

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OHTA MASAHIRO ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

IPC: C08L79/08 ,  C08L81/02

Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula: l

公开(公告)号：DE68918397D1

公开(公告)日：1994-10-27

申请号：DE68918397

申请日：1989-10-25

Applicant: MITSUI TOATSU CHEMICALS

Inventor： TAMAI SHOJI ,  KAWASHIMA SABURO ,  OHTA MASAHIRO ,  IIYAMA KATSUAKI ,  OIKAWA HIDEAKI ,  OHKOSHI KOUJI ,  YAMAGUCHI AKIHIRO

IPC: C08G73/10

Abstract: The present invention relates to polyimides having excellent thermal resistance and process for preparing the same comprising carring out condensation of 4,4 min - bis(3-aminophenoxy)biphenyl with pyromellitic dianhydride in the presence of a diamine compound and/or tetracarboxylic acid dianhydride. The polyimides have a non-crystalline structure and exhibit excellent thermal resistance and processability.

公开(公告)号：DE3888869D1

公开(公告)日：1994-05-11

申请号：DE3888869

申请日：1988-05-27

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

IPC: C08L79/08 ,  C08L81/04

Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:

公开(公告)号：DE3788937D1

公开(公告)日：1994-03-10

申请号：DE3788937

申请日：1987-11-12

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OIKAWA HIDEAKI ,  KOGA NOBUHITO ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO

IPC: C08G73/10

Abstract: Polyimide of this invention is almost colorless and has remarkably high light transmittance as well as excellent processability and adhesive properties at high temperatures in addition to its substantial high-temperature stability. The polyimide is a novel polyimide capable of being used for space and aeronautical materials, electric and electronic members, automotive parts, and furthermore for high-temperature adhesives. The polyimide has recurring units of the following formula (I): wherein X is a radical selected from the group consisting of a bond, divalent hydrocarbon radical having from 1 to 10 carbons, hexafluorinated isopropylidene radical, carbonyl radical, sulfonyl radical and thio radical, and each nitrogen atom of imide ring is located simultaneously at meta- or para-position to ether linkage. The polyimide of this invention is prepared by reacting 4,4'-(p-phenylenedioxy)diphthalic dianhydride with an ether diamine having the following general formula (V): and successively imidizing the resultant polyamic acid. e

公开(公告)号：DE68905225D1

公开(公告)日：1993-04-15

申请号：DE68905225

申请日：1989-05-04

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OHTA MASAHIRO ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

IPC: C08L79/08

Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o

公开(公告)号：DE68903181T2

公开(公告)日：1993-03-25

申请号：DE68903181

申请日：1989-03-13

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OHTA MASAHIRO ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

IPC: C08L79/08

Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: y

公开(公告)号：AU597494B2

公开(公告)日：1990-05-31

申请号：AU1736388

申请日：1988-06-03

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO ,  IIYAMA KATSUAKI

IPC: C08L79/08

Abstract: Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide; where X indicates a direct bond or is -S- or and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

公开(公告)号：AU3728689A

公开(公告)日：1990-03-08

申请号：AU3728689

申请日：1989-07-04

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OHTA MASAHIRO ,  YAMAGUCHI AKIHIRO ,  OIKAWA HIDEAKI ,  TAMAI SHOJI ,  IIYAMA KATSUAKI ,  KAWASHIMA SABURO

IPC: C08G73/10 ,  C08G73/14

Abstract: This invention relates to a process for preparing polyimide having good heat-stability and excellent flowability in a molten state. The polyimide is prepared by reacting 3,3 min -diaminobenzophnone or bis(3-aminophenyl)sulfone, tetracarboxylic dianhydrides such as pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride and bis(3,4-dicarboxyphenyl) ether dianhydride; and dicarboxylic anhydrides such as glutaric anhydride, 1,2-hexanedicarboxylic anhydride, phthalic anhydride and 3,4-benzophenonedicarboxylic anhydride. The molar ratio of aromatic diamine : tetracarboxylic dianhydride : dicarboxylic anhydride is 1 :(0.9 to 1.0) : (0.001 to 1.0).

公开(公告)号：AU3073489A

公开(公告)日：1989-11-23

申请号：AU3073489

申请日：1989-02-24

Applicant: MITSUI TOATSU CHEMICALS

Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

IPC: C08G73/10 ,  C08G73/14

Abstract: A process for preparing a polyimide by reaction of a diamine and a tetracarboxylic dianhydride to obtain a polyamide acid and subjecting the polyamide acid to conversion into a polyimide thermally or chemically. The reaction in the process is carried out in the presence of at least one dicarboxylic anhydride selected from the group consisting of aliphatic dicarboxylic anhydrides and aromatic dicarboxylic anhydrides, and the amount of the tetracarboxylic dianhydride is in the range of from 0.9 to 1.0 mole per mole of the diamine and the amount of the dicarboxylic anhydride is in the range of from 0.001 to 1.0 mole per mole of the diamine. The resultant polyimides exhibit good thermal stability at high temperatures and good forming processability even at low temperatures.