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    PROCESS FOR PREPARING POLYMIMIDES
    2.
    发明专利
    PROCESS FOR PREPARING POLYMIMIDES 未知

    公开(公告)号：AU604402B2

    公开(公告)日：1990-12-13

    申请号：AU3073489

    申请日：1989-02-24

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/10 ,  C08G73/14

    Abstract: A process for preparing a polyimide by reaction of a diamine and a tetracarboxylic dianhydride to obtain a polyamide acid and subjecting the polyamide acid to conversion into a polyimide thermally or chemically. The reaction in the process is carried out in the presence of at least one dicarboxylic anhydride selected from the group consisting of aliphatic dicarboxylic anhydrides and aromatic dicarboxylic anhydrides, and the amount of the tetracarboxylic dianhydride is in the range of from 0.9 to 1.0 mole per mole of the diamine and the amount of the dicarboxylic anhydride is in the range of from 0.001 to 1.0 mole per mole of the diamine. The resultant polyimides exhibit good thermal stability at high temperatures and good forming processability even at low temperatures.

    POLYIMIDE RESIN COMPOSITION
    4.
    发明专利
    POLYIMIDE RESIN COMPOSITION 未知

    公开(公告)号：AU592502B2

    公开(公告)日：1990-01-11

    申请号：AU1674388

    申请日：1988-05-27

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08L79/08 ,  C08L81/04

    Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:

    POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE
    5.
    发明专利
    POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE 未知

    公开(公告)号：AU586955B2

    公开(公告)日：1989-07-27

    申请号：AU1856588

    申请日：1988-06-30

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： TAMAI SHOJI ,  OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08G73/10 ,  C08L79/08 ,  C09J179/08 ,  H01J37/317 ,  H01L21/265 ,  C09J3/16

    Abstract: This invention relates to a novel polyimide which is high-temperature resistant and capable of being molded in a fused state. This invention also relates to a high-temperature adhesive using the polyimide. The polyimide consists essentially of recurring units of the formula: where R is a tetra-valent radical selected from the group consisting of an aliphatic radical having 2 or more carbon atoms, alicyclic radical, monoaromatic radical, condensed polyaromatic radical, and non-condensed polyaromatic radical wherein aromatic radicals are linked to one another directly or via a bridge member. The polyimide can be prepared by reacting bis[4-(4-(4-aminophenoxy)phenoxy)phenyl] sulfone with a tetracarboxylic dianhydride in an organic solvent and imidizing the resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and preferred dianhydride are pyromellitic dianhydride, 3,3 min ,4,4 min -benzophenonetetracarboxylic dianhydride, bis(3,4-dicarboxyphenyl) ether dianhydride, 3,3 min ,4,4 min -biphenyltetracarboxylic dianhydride, and 4,4 min -(p-phenylenedioxy)diphthalic dianhydride.

    POLYIMIDE RESIN COMPOSITION
    6.
    发明专利
    POLYIMIDE RESIN COMPOSITION 未知

    公开(公告)号：AU1690288A

    公开(公告)日：1988-12-08

    申请号：AU1690288

    申请日：1988-05-31

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08L79/08 ,  C08L81/02

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin composition of this invention consists of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is a sulfonyl radical or a carbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula: l

    POLYMIDE RESIN COMPOSITION
    7.
    发明专利
    POLYMIDE RESIN COMPOSITION 未知

    公开(公告)号：CA1339823C

    公开(公告)日：1998-04-14

    申请号：CA568192

    申请日：1988-05-31

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08L79/08 ,  C08L81/04

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: (see fig. I) wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, (see figs. II, III, IV and V) The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: (see fig. I) aromatic polysulfone consisting of recurring units of the formula: (see fig. II) or aromatic polyetherimide consisting of recurring units of the formula: (see fig. III)

    POLYIMIDE RESIN COMPOSITION
    8.
    发明专利
    POLYIMIDE RESIN COMPOSITION 未知

    公开(公告)号：CA1338391C

    公开(公告)日：1996-06-11

    申请号：CA568654

    申请日：1988-06-03

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO ,  IIYAMA KATSUAKI

    IPC: C08L79/08

    Abstract: Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide; where X indicates a direct bond or is -S- or , and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

    10.
    发明专利
    未知

    公开(公告)号：DE3888869T2

    公开(公告)日：1994-09-22

    申请号：DE3888869

    申请日：1988-05-27

    Applicant: MITSUI TOATSU CHEMICALS

    Inventor： OHTA MASAHIRO ,  KAWASHIMA SABURO ,  IIYAMA KATSUAKI ,  TAMAI SHOJI ,  OIKAWA HIDEAKI ,  YAMAGUCHI AKIHIRO

    IPC: C08L79/08 ,  C08L81/04

    Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:

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