POLYIMIDE RESIN COMPOSITION
    21.
    发明专利

    公开(公告)号:CA1338391C

    公开(公告)日:1996-06-11

    申请号:CA568654

    申请日:1988-06-03

    Abstract: Resin composition composed of 99.9 to 50 % by weight of a polyimide having a repeating unit of the formula as defined below and 0.1 to 50 % by weight of an aromatic polyamideimide are improved in heat resistance and mechanical strength and have the inherent properties of polyimide; where X indicates a direct bond or is -S- or , and R is a tetravalent radical selected from the group consisting of aliphatic radicals having at least 2 carbon atoms, cycloaliphatic radicals, monocycloaromatic radicals and condensed polycycloaromatic radicals, and uncondensed polycycloaromatic radicals including aromatic radicals interconnected directly or through a cross-linkage.

    23.
    发明专利
    未知

    公开(公告)号:DE3888869T2

    公开(公告)日:1994-09-22

    申请号:DE3888869

    申请日:1988-05-27

    Abstract: The invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention consist of 99.9 to 50% by weight of the polyimide and 0.1 to 50% by weight of high-temperature engineering polymer. The polyimide consists of recurring units of the following formula: wherein X is direct bond, thio radical, or o- or p-phenylene dicarbonyl radical and R is a tetravalent radical selected from an aliphatic radical, alicyclic radical, monoaromatic radical, condensed aromatic radical and non-condensed aromatic radical. R is, for example, The high-temperature engineering polymer is, for example, polyphenylene sulfide consisting of recurring units of the formula: aromatic polysulfone consisting of recurring units of the formula: or aromatic polyetherimide consisting of recurring units of the formula:

    24.
    发明专利
    未知

    公开(公告)号:DE68905225T2

    公开(公告)日:1993-07-01

    申请号:DE68905225

    申请日:1989-05-04

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o

    POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYIMIDE

    公开(公告)号:CA1274938A

    公开(公告)日:1990-10-02

    申请号:CA528830

    申请日:1987-02-03

    Abstract: POLYIMIDE AND HIGH-TEMPERATURE ADHESIVE OF POLYMIDE This invention relates to a novel polyimide and describes method of its preparation, adhesives of the polyimide and the method for their application. The polyimide has recurring units of the formula (where R is a tetra-valent radical selected from the group consisting of aliphatic radical having not less than two carbons, cyclo-aliphatic radical, monoaromatic radical, condensed polyaromatic radical, and non condensed polyaromatic radical wherein aromatic radicals are mutually connected with a bond or a crosslinking function). The polyimide can be prepared by reacting 2,6-bis(3-amino-phenoxy)pyridine with tetracarboxylic dianhydride in an organic solvent and imidizing resultant polyamic acid. Various tetracarboxylic dianhydrides can be used and particularly prefered are pyromellitic dianhydride and 3,3',4,4'benzophenonetetracarboxylic dianhydride.

    POLYIMIDE RESIN COMPOSITION
    27.
    发明专利

    公开(公告)号:AU598972B2

    公开(公告)日:1990-07-05

    申请号:AU3385889

    申请日:1989-04-28

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of aromatic polyamideimide.The polyimide consists essentially of recurring units of the following formula: wherein X is and R is, for example, o

    POLYIMIDE RESIN COMPOSITION
    29.
    发明专利

    公开(公告)号:AU3132389A

    公开(公告)日:1989-09-21

    申请号:AU3132389

    申请日:1989-03-15

    Abstract: This invention relates to molding resin compositions, and more particularly relates to polyimide resin compositions having markedly improved molding ability in addition to excellent high temperature stability, chemical resistance and mechanical strength. The polyimide resin compositions of this invention comprises 99.9 to 50.0% by weight of the polyimide and 0.1 to 50.0% by weight of polyphenylene sulfide and/or aromatic polysulfone and/or aromatic polyetherimide high-temperature engineering polymer. The polyimide consists essentially of recurring units of the following formula: y

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