公开(公告)号：JPH0558678B2

公开(公告)日：1993-08-27

申请号：JP7042589

申请日：1989-03-24

Applicant: NGK INSULATORS LTD

Inventor： MYAMURA KIKUJI ,  ASAI MICHIO

IPC: H01L23/12 ,  H05K1/02 ,  H05K1/09 ,  H05K3/12

公开(公告)号：JPH0348496A

公开(公告)日：1991-03-01

申请号：JP9044390

申请日：1990-04-06

Applicant: NIPPON DENSO CO ,  NGK INSULATORS LTD

Inventor： NAGASAKA TAKASHI ,  MORIMOTO TADAHIKO ,  ASAI MICHIO

IPC: H05K3/46

Abstract: PURPOSE:To achieve a stable electrical conductivity without any defect in an insulating layer by covering an edge part forming an exposed conduction layer with the exposed conductor layer and by covering the edge part of an insulation paste with a conduction paste forming the exposed conductor layer. CONSTITUTION:While a conduction paste M3 was formed first when forming the conduction paste M3 and an insulation paste Z3 which becomes the outermost layer of simultaneously fired multilayer interconnection board in a conventional technology, this invention allows the paste Z3 to be formed first by reversing the order. As a result, the edge part of the formed insulating layer Z3 is completely covered with the high melting-point metal layer M3 which is the outermost layer. Thus, since a part of the insulating layer Z3 which is not covered with the high melting-point metal layer M3 is relatively thick, the lower high melting-point metal layer cannot be oxidized easily due to defect in the insulating layer Z3 even in the firing process in an oxidation environment of paste for forming a thick film element.

公开(公告)号：JPH02252290A

公开(公告)日：1990-10-11

申请号：JP7197989

申请日：1989-03-27

Applicant: NGK INSULATORS LTD

Inventor： MIYATA KEIZO ,  ASAI MICHIO

IPC: H05K3/46

Abstract: PURPOSE:To contrive the manufacture of a multilayer wiring board, which has a fine wiring and is highly reliable, by a method wherein after an oxidation- resistant layer is formed in via holes in the surface of a ceramic multilayer wiring board, a resistor is fired and a pattern is formed by photolitho etching after a copper-plated conductor is provided on the whole surface of the board. CONSTITUTION:An oxidation-resistant layer which is a thick-film metal layer is formed in via holes 4 having a wiring layer, which is easily oxidized, in the interior of the surface of a ceramic multilayer wiring board 1. A resistor 7, which consists of ruthenium oxide or the like and can be fired in an oxidizing atmosphere, is formed at a prescribed position of the board surface and is fired in an oxidizing atmosphere. Then, a copper-plated conductor 8 is provided on the whole surface of the board and a pattern is formed by photolitho etching. Thereby, the manufacturing method of a multilayer wiring board having a highly reliable resistor and a fine conductor pattern is obtained.

公开(公告)号：JPH0238552B2

公开(公告)日：1990-08-30

申请号：JP6739587

申请日：1987-03-20

Applicant: NGK INSULATORS LTD

Inventor： ASANO MASATAKA ,  ASAI MICHIO

IPC: F27B17/00 ,  C04B41/80

公开(公告)号：JPS54131760A

公开(公告)日：1979-10-13

申请号：JP3859578

申请日：1978-04-01

Applicant: NGK INSULATORS LTD

Inventor： SUZUKI TAKESHI ,  MIZUNO FUKUZOU ,  ASAI MICHIO

IPC: H01G4/12 ,  H01G4/255

公开(公告)号：JP2001260216A

公开(公告)日：2001-09-25

申请号：JP2000070830

申请日：2000-03-14

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  ASAI MICHIO

IPC: B29C51/36

Abstract: PROBLEM TO BE SOLVED: To provide a die for vacuum molding, in which in the case of vacuum- molding an integral type luminous tube, even if molding is continuously performed, dispersion of a dimension is not caused without receiving effect of generated steam or the like. SOLUTION: Suction holes 5 are provided in a core 3 to perform vacuum molding and the tip part butting to a body to be molded is formed into 0.5 mm diameter and the rear end part provided with a step part along the way is formed into 2 mm diameter. Further, the whole suction hole 5 is bored in the direction orthogonal to a PL face being the divided face of the core 3.

公开(公告)号：JP2000268774A

公开(公告)日：2000-09-29

申请号：JP7261599

申请日：1999-03-17

Applicant: NGK INSULATORS LTD

Inventor： NIIMI TOKUICHI ,  ASAI MICHIO

IPC: H01J61/073 ,  H01J61/36

Abstract: PROBLEM TO BE SOLVED: To ensure a psuedo-point optical source configuration in a simple manner by providing an electrode consisting of a composite electrode of a current conductor and a discharge electrode, and specifying the diameter and length of an alumina made cylinder. SOLUTION: A current conductor 3 is formed with a metallization layer 6 provided at the whole side part and a tip end face of a cylindrical core 5 made of polycrystalline alumina simillarly with a discharge lamp 1. Since the core 5 is formed out of the same polycrystalline alumina as the discharge tube 1, the thermal expansion characteristic of the conductor 3 is made substantially equal to that of the tube 1. The length of alumina made cylinder being the tube 1 may be 6 mm or more so that a discharge space of a 1 mm or more arc length can be formed inside, and since an electrode is directly mounted to the tube 1, the diameter of the tube 1 can be made small, 1 mm in diameter experimentally. By connecting and sealing the composite electrode directly to the end of the tube 1 in ths way, a compact high pressure discharge lamp can be provided easily.

公开(公告)号：JPH11354021A

公开(公告)日：1999-12-24

申请号：JP15973198

申请日：1998-06-08

Applicant: NGK INSULATORS LTD

Inventor： NIIMI TOKUICHI ,  ASAI MICHIO

IPC: H01J9/02 ,  C03B23/24 ,  H01J9/20 ,  H01J9/24 ,  H01J17/04 ,  H01J17/16 ,  H01J61/32

Abstract: PROBLEM TO BE SOLVED: To provide a display capable of realizing integration and miniaturization of an electric tube at the same time and brightly display the transmission of information. SOLUTION: A display is constituted of a housing 16 formed by bringing a rectangular upper housing member 12 made of a glass material into contact with a rectangular lower housing member 14 on each main surface by press fusion bonding in a specified atmosphere, a cavity 18 formed only in the number of corresponding pixels in the housing 16 is formed, in which at least one of gas and a luminescent substance is sealed wires 20 and 22 (anode and cathode) facing through the cavity 18 at the end of each pixel, a vertical selecting wire 24 connected to an electrode wire 20 constituting each electrode, and a signal line 22 wired in the vertical direction, connected to an electrode wire 22 constituting each cathode. Accordingly to this display, the integration and miniaturization of an electron tube are realized at the same time and display for the transmission of information is conducted with high brightness.

公开(公告)号：JPH11135064A

公开(公告)日：1999-05-21

申请号：JP29840297

申请日：1997-10-30

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  ASAI MICHIO

IPC: H01J61/30

Abstract: PROBLEM TO BE SOLVED: To lessen the runoff of the heat while a high pressure discharge lamp is lighted as much as practicable. SOLUTION: A trunk part 1 is formed so that the ratio of its central part B to the inside diameter of the opening part ranges 3.5 to 8, preferably 4 to 7. In this manner, the inside diameter A of the opening part of the trunk 1 is made largely small, compared with the inside diameter B of the central part of the trunk 1, so that the opening part of the trunk 1, i.e., the heat capacity of the end part of trunk, can be lessened when this is used, for example in a metal halide lamp, which allows lessening of the heat running off while high pressure discharge lamp is lighted.

公开(公告)号：JPH10125230A

公开(公告)日：1998-05-15

申请号：JP23220697

申请日：1997-08-28

Applicant: NGK INSULATORS LTD

Inventor： MIYAZAWA SUGIO ,  ASAI MICHIO

IPC: H01J9/24

Abstract: PROBLEM TO BE SOLVED: To prevent the shrinkage of the inner diameter of an end section member, improve the fitting strength, and prevent a gas leak from a boundary face by inserting an integral molding or a temporarily baked body of an electrode member insertion portion and a circular portion into the inside of a tube main body portion, baking an assembly to form an integrally baked body, and generating the crimping force from the circular portion to the tube main body portion after baking. SOLUTION: The circular portion 1b of the first molding or its calcinated body 1 is inserted into the inside of each end section 3a of the second molding or its temporarily baked body 3 of a tube main body to form an assembly 5. The outer diameter size of the circular portion 1b when the first molding 1 and the second molding 3 are baked without being assembled is set to 1.001-1.010 times the inner diameter size of the second molding 3 of the tube main body, for example, and the adhesiveness of them is improved. The assembly 5 thus formed is baked, and the inner diameter of the end section member for inserting an electrode member is prevented from being shrunk at the contact portion with the circular member 1b.