公开(公告)号：JP2012227351A

公开(公告)日：2012-11-15

申请号：JP2011093581

申请日：2011-04-20

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  HIRAYAMA SATOSHI ,  KITO NAOKI

IPC: H05K1/02 ,  H05K3/00

CPC classification number: H05K1/02 ,  H05K1/0306 ,  H05K3/0029 ,  H05K3/0052 ,  H05K3/10 ,  H05K2201/0909 ,  H05K2201/09154 ,  H05K2203/1476 ,  Y10T29/49162

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic wiring board that allows for sure chucking and hooking on a side surface basis, a multi-cavity wiring board for obtaining a plurality of the wiring boards, and a manufacturing method for surely manufacturing the multi-cavity wiring board.SOLUTION: A wiring board 1a is made of ceramic, and includes: a front surface 2 and a rear surface 3 which have a square shape (rectangular shape) in a plan view; and a side surface 4 located between the front surface 2 and the rear surface 3. The side surface 4 includes: a belt-like uneven surface 5 in which a plurality of projected parts and recessed parts are formed alternately in parallel to each other so as to be arranged along the front surface 2; and a fracture surface 8 located close to the rear surface 3.

Abstract translation: 要解决的问题：为了提供一种能够确保侧面基准地夹紧和钩挂的陶瓷布线板，用于获得多个布线板的多空腔布线板，以及用于可靠地制造 多腔接线板。 解决方案：布线板1a由陶瓷制成，并且包括：在俯视图中具有正方形（矩形）的前表面2和后表面3; 以及位于前表面2和后表面3之间的侧表面4.侧表面4包括：带状凹凸表面5，其中多个突出部分和凹陷部分彼此平行地交替地形成，以便 沿着前表面2布置; 和位于靠近后表面3的断裂面8.版权所有（C）2013，JPO＆INPIT

公开(公告)号：JP2010073712A

公开(公告)日：2010-04-02

申请号：JP2008236002

申请日：2008-09-16

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  MIZUNO ATSUSHI

IPC: H01L23/12 ,  H01G4/12 ,  H05K3/00 ,  H05K3/40 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic component that can surely form a through hole conductor on a wall surface of a through hole. SOLUTION: The present invention relates to the method of manufacturing the ceramic component having a ceramic base part and a conductor part. In a conductor charging stage, an unsintered conductor 49 to become the conductor part after sintering is charged in a first through hole 47 formed penetrating unsintered ceramic moldings 42 and 43 to become the ceramic base part after the sintering along their thickness. In a laser processing stage, a second through hole 48 is formed by removing a center part of the unsintered conductor 49 by laser irradiation. A baking stage is carried out after the unsintered ceramic moldings 41, 42, 43 are laminated, and the unsintered ceramic moldings 41, 42, 43, and the unsintered conductor 49 are baked at the same time to form the through hole conductor in the first through hole 47. Consequently, the ceramic component is manufactured. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可以在通孔的壁表面上可靠地形成通孔导体的陶瓷部件的制造方法。 解决方案：本发明涉及制造具有陶瓷基底部分和导体部分的陶瓷部件的方法。 在导体充电阶段，在烧结后成为导体部分的未烧结导体49被填充到贯穿未烧结陶瓷模制件42和43的第一通孔47中，以沿其厚度烧结成为陶瓷基体部分。 在激光加工阶段，通过激光照射除去未烧结导体49的中心部分，形成第二通孔48。 在未烧结的陶瓷模制件41,42,43层压之后进行烘烤阶段，并且同时烘烤未烧结的陶瓷模制件41,42,43和未烧结的导体49，以在第一工序中形成通孔导体 因此，制造陶瓷部件。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010069620A

公开(公告)日：2010-04-02

申请号：JP2008236001

申请日：2008-09-16

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  MIZUNO ATSUSHI

IPC: B28B11/00 ,  H01L23/08 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing a ceramic component which can form a cavity corresponding to an element and perform miniaturization. SOLUTION: In a laser beam machining process, while unsintered ceramic moldings 41-43 to be a ceramic substrate part after sintering and an unsintered conductor 49 to be a conductor part after sintering are brought in contact with each other and arranged, part of each of the unsintered ceramic moldings 41 and 42 is removed by being irradiated with laser beams L1. In this way, the cavity 20 which is a non-penetrated recess being able to be loaded with the element is formed into the unsintered ceramic moldings 41 and 42. In a sintering process which is carried out after the laser beam machining process, the unsintered ceramic moldings 41-43 and the unsintered conductor 49 are heated/sintered simultaneously. As a result, the ceramic component 10 can be manufactured. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供一种可以形成对应于元件的空腔并执行小型化的陶瓷部件的制造方法。 解决方案：在激光束加工过程中，烧结后作为陶瓷基板部分的未烧结陶瓷模制件41-43和烧结后作为导体部分的未烧结导体49彼此接触并布置， 通过照射激光束L1来除去每个未烧结的陶瓷模制品41和42。 以这种方式，作为能够装载元件的非穿透凹部的空腔20被形成为未烧结的陶瓷模制件41和42.在激光束加工过程之后执行的烧结过程中，未烧结 陶瓷模制品41-43和未烧结的导体49同时被加热/烧结。 结果，可以制造陶瓷部件10。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2007242990A

公开(公告)日：2007-09-20

申请号：JP2006065345

申请日：2006-03-10

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： FUJISHIMA TAKESHI ,  NASU TAKAARI ,  HAYANO HISAO ,  HASEGAWA MASAMI

IPC: H01L23/04 ,  H03H9/02 ,  H03H9/10

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic package which has a pair of pads having an aligned height at a pair of steps located in a cavity, and to provide its manufacturing method for obtaining this reliability.
SOLUTION: The ceramic package P comprises a package body 1 which is composed of ceramics and has a front face 2 and a rear face 3, a cavity 4 open to the front face 2 of the package body 1, a pair of steps 6 located across a groove 9 in the cavity 4, and a pair of pads 10 formed astride an upper face 8 for each of the pair of steps 6 and a side face 7 for each of the pair of steps 6 facing the groove 9. Such the pad 10 comprises a horizontal part 11 located on the upper face 8 of the step 6 and a vertical part 12 located on the side face facing the groove 9.
COPYRIGHT: (C)2007,JPO&INPIT

Abstract translation: 要解决的问题：提供一种陶瓷封装，其具有在位于空腔中的一对台阶处具有对准高度的一对焊盘，并提供其用于获得该可靠性的制造方法。 解决方案：陶瓷封装P包括由陶瓷构成并具有前表面2和后表面3的封装主体1，通向封装体1的前表面2的空腔4，一对工序 6位于空腔4中的槽9上，以及一对垫10，跨过一对台阶6中的每一个的上表面8和面对槽9的一对台阶6中的每一个的侧面7。 垫10包括位于台阶6的上表面8上的水平部分11和位于面向凹槽9的侧面上的垂直部分12.版权所有（C）2007，JPO＆INPIT

公开(公告)号：JP2004303822A

公开(公告)日：2004-10-28

申请号：JP2003092591

申请日：2003-03-28

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： KOARA KAZUHISA ,  HASEGAWA MASAMI

IPC: H01L23/12 ,  H01L23/04 ,  H01L23/08

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic package which is used for an electronic device and equipped with a main surface (second main surface) that is opposite to its other main surface on a cavity side and has a shape suitable for ensuring device characteristics for the electronic device and its manufacturing method capable of ensuring the surface shape of the second main surface. SOLUTION: Provided that the main surface of the ceramic package 1 forming a cavity 2 is defined as a first main surface PF, and the other main surface opposite to the first main surface PF is defined as a second main surface SF, the surface shape of the second main surface SF is set curved or convexed toward the first main surface PF. COPYRIGHT: (C)2005,JPO&NCIPI

公开(公告)号：JP2000252379A

公开(公告)日：2000-09-14

申请号：JP5270399

申请日：1999-03-01

Applicant: NGK SPARK PLUG CO

Inventor： YOSHIDA MAKOTO ,  HASEGAWA MASAMI ,  SOBU KATSUHIRO

IPC: H01L23/12 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To provide a connected ceramic wiring board having a high connection reliability between individual ceramic wiring boards formed with a plated layer evenly on a metallized layer in a recessed section and also provide a method for manufacturing such a wiring board and to provide a method for manufacturing the ceramic wiring board having the plated layer. SOLUTION: This substrate 11 comprises a plurality of ceramic wiring boards 1, each having a first principal plane 1A, and a second principal plane 1B which are connected to each other. On a boundary between adjacent ceramic wiring boards, a first break groove 13 is formed from the first principal plane 1A side, and a bottomed hole 15 which is opened on the second primary plane 1B side and is formed on its inner face 15B with a metallized layer 7 is formed, being stretched over the adjacent ceramic wiring boards 1. Part of the first break groove 13 passes through the bottom 14 of the hole 15 to allow the hole 15 and the first break groove 13 to communication with each other. Therefore, when forming a plated layer 8 on the metallized layer 7, a plating liquid can be easily allowed to follow between the first principal plane 1A and the second principal plane 1B through the hole 15, thereby forming the plated layer 8 evenly.

公开(公告)号：JP2014007235A

公开(公告)日：2014-01-16

申请号：JP2012140940

申请日：2012-06-22

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI ,  KITO NAOKI ,  NAKAJIMA CHIZUO

IPC: H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a ceramic substrate manufacturing method of forming dividing grooves in a multi-piece sheet which becomes a plurality of ceramic substrates in order to inhibit occurrence of burrs and cracks at a corner of a surface and a lateral face of a substrate and avoid melting and charring of a metallized layer and the like.SOLUTION: A ceramic substrate manufacturing method comprises: a first step of forming first grooves 13 in a lattice shape in planar view on at least one surface 3 of a multi-piece sheet 1 which has a plurality of product areas 2 formed adjacent to each other in a matrix to become ceramic substrates and in which a conductive layer 3 is formed across every adjacent product areas 2, by irradiating the conductive layers with a laser along border lines 9 included in the conductive layers 3a for separating the adjacent product areas 2; and a second step of forming second grooves 14 each having a width narrower than the first groove 13 so as to be communicated with bottoms of the first grooves 13 by inserting a dicing blade 19 into an intermediate part in a width direction of the formed first groove 13.

Abstract translation: 要解决的问题：提供一种在成为多个陶瓷基板的多片材中形成分隔槽的陶瓷基板的制造方法，以抑制在表面的侧面和 衬底，避免金属化层等的熔化和烧焦。解决方案：陶瓷衬底制造方法包括：第一步骤，在多片片材的至少一个表面3上平面地形成格子状的第一槽13 1，其具有以矩阵形式彼此相邻形成的多个产品区域2，以成为陶瓷基板，并且其中通过包括沿着边界线9的激光照射导电层，跨越每个相邻产品区域2形成导电层3 在用于分离相邻产品区域2的导电层3a中; 以及形成第二槽14的第二步骤，每个第二槽14的宽度比第一槽13窄，以便通过将切割刀片19插入到形成的第一槽的宽度方向上的中间部分中与第一槽13的底部连通 13。

公开(公告)号：JP2014003188A

公开(公告)日：2014-01-09

申请号：JP2012138258

申请日：2012-06-19

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： SUZUKI ATSUSHI ,  FUKUI RYOTA ,  HASEGAWA MASAMI ,  KITO NAOKI ,  NAKAJIMA CHIZUO

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic multilayer substrate capable of manufacturing a ceramic multilayer substrate of excellent dimensional accuracy, by suppressing deformation of a frame formed around a cavity.SOLUTION: A frame-like ceramic green sheet 43 having through holes 55, 56 formed therein and becoming cavities is laminated on the front and back surfaces of a planar ceramic green sheet 43 with a bonding ceramic sheet 46 interposed therebetween. The bonding ceramic sheet 46 is heated to a temperature equal to or higher than the melting point of an organic compound, so as to express adhesion. An unbaked ceramic laminate 59, where respective ceramic green sheets 43 are integrated with the bonding ceramic sheet 46 interposed therebetween, is formed by pressing the respective ceramic green sheets 43 and the bonding ceramic sheet 46 in the lamination direction by using a heat block 58 in non-contact with the through holes 55, 56.

Abstract translation: 要解决的问题：提供一种通过抑制在空腔周围形成的框架的变形来制造能够制造尺寸精度优异的陶瓷多层基板的陶瓷多层基板的方法。解决方案：一种框状陶瓷生片43，其具有贯穿 形成在其中并成为空腔的孔55,56层压在平面陶瓷生片43的前表面和后表面上，其间插入有接合陶瓷片46。 将粘结陶瓷片46加热到等于或高于有机化合物的熔点的温度，以便表达粘附。 通过使用加热块58在层叠方向上压制各陶瓷生片43和接合陶瓷片46，形成未烘烤的陶瓷层压体59，其中各陶瓷生片43与插入其间的接合陶瓷片46一体化 与通孔55,56不接触。

公开(公告)号：JP2004186276A

公开(公告)日：2004-07-02

申请号：JP2002349273

申请日：2002-11-29

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： HASEGAWA MASAMI

IPC: H01L23/10 ,  H01L23/02 ,  H01L23/08

Abstract: PROBLEM TO BE SOLVED: To eliminate the deterioration of the characteristics of an electronic parts body in a method for manufacturing ceramic electronic parts obtained by housing the electronic body in a ceramic package and sealing the ceramic package with a cover, and to provide the ceramic electronic parts and the ceramic package. SOLUTION: A crystal oscillator 1 is obtained by housing the electronic body of a crystal piece 2, etc. in the ceramic package 7 and connecting by brazing a lid 3 to the peripheral edge 7b of the opening of the ceramic package 7. As the ceramic package 7, a ceramic package having a sag part 7e inclined at the peripheral edge 7b of the opening to its inner peripheral side is used. COPYRIGHT: (C)2004,JPO&NCIPI

公开(公告)号：JP2002057236A

公开(公告)日：2002-02-22

申请号：JP2000243028

申请日：2000-08-10

Applicant: NGK SPARK PLUG CO

Inventor： HASEGAWA MASAMI

IPC: B28B11/10 ,  B28B11/00 ,  H01L23/02 ,  H01L23/08

Abstract: PROBLEM TO BE SOLVED: To readily provide a ceramic package at a low cost by a rational manufacturing method, capable of airtightly fixing by high strength for fixing a lid or a sealing ring with a brazing material, a solder or the like, and to provide a method for manufacturing the same. SOLUTION: The ceramic package 100 comprises a peripheral part 110 which is made of ceramics as a periphery of a component housing recess 120, and an annular metallized layer 131 surrounding the recess 120 on a top surface 111 of the part 110. The surface 11 of the part 110 has a protruding part 112, protruding partly by deformation due to pressing before baking and a protruding part 132 which partly protrudes in the width direction along the part 112 even on the layer 131.