公开(公告)号：JP2000252379A

公开(公告)日：2000-09-14

申请号：JP5270399

申请日：1999-03-01

Applicant: NGK SPARK PLUG CO

Inventor： YOSHIDA MAKOTO ,  HASEGAWA MASAMI ,  SOBU KATSUHIRO

IPC: H01L23/12 ,  H05K1/02

Abstract: PROBLEM TO BE SOLVED: To provide a connected ceramic wiring board having a high connection reliability between individual ceramic wiring boards formed with a plated layer evenly on a metallized layer in a recessed section and also provide a method for manufacturing such a wiring board and to provide a method for manufacturing the ceramic wiring board having the plated layer. SOLUTION: This substrate 11 comprises a plurality of ceramic wiring boards 1, each having a first principal plane 1A, and a second principal plane 1B which are connected to each other. On a boundary between adjacent ceramic wiring boards, a first break groove 13 is formed from the first principal plane 1A side, and a bottomed hole 15 which is opened on the second primary plane 1B side and is formed on its inner face 15B with a metallized layer 7 is formed, being stretched over the adjacent ceramic wiring boards 1. Part of the first break groove 13 passes through the bottom 14 of the hole 15 to allow the hole 15 and the first break groove 13 to communication with each other. Therefore, when forming a plated layer 8 on the metallized layer 7, a plating liquid can be easily allowed to follow between the first principal plane 1A and the second principal plane 1B through the hole 15, thereby forming the plated layer 8 evenly.

公开(公告)号：JP2002016341A

公开(公告)日：2002-01-18

申请号：JP2000198258

申请日：2000-06-30

Applicant: NGK SPARK PLUG CO

Inventor： NAKAJIMA CHIZUO ,  HASEGAWA MASAMI ,  SOBU KATSUHIRO ,  YOSHIDA MAKOTO

IPC: H05K3/00 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a method for producing a joint ceramic wiring board and a method for producing a wiring board in which a plating layer of sufficient thickness can be formed uniformly on a metallize layer in a second major surface side recess. SOLUTION: The method for producing a joint ceramic wiring board comprises a step for forming a first brake groove 28 communicating with a second major surface side recess 27 by inserting a first groove forming cutter 40 from the first major surface 24 side along the outer circumferential boundary line at each product part 21, a step for firing a large unfired ceramic sheet 31 to produce a joint ceramic wiring board 51 having a sealing metallize layer 5 formed along the first brake groove 28 wherein the firing shrinkage rate of a metallize paste forming an unfired metallize layer 25 is set higher than that of a ceramic green sheet forming the large unfired ceramic sheet 31.