公开(公告)号：JPH09312476A

公开(公告)日：1997-12-02

申请号：JP15164996

申请日：1996-05-22

Applicant: NGK SPARK PLUG CO

Inventor： KASHIMA HISATO ,  TAGA SHIGERU

IPC: H05K1/03 ,  H01B1/16 ,  H05K3/12 ,  H05K3/46

Abstract: PROBLEM TO BE SOLVED: To reduce warping and deformation of a backed multilayer wiring board by a method wherein a green sheet laminated body having printed wiring part is baked is baked at a temperatuere within a specific range to be a pre- stage baked body further baked at a load. SOLUTION: Assuming the softening point of a green sheet having printed wiring part to be Ts ( deg.C), this green sheet is baked at the temperature range of (Ts-30) to be a pre-stage baked body. Next, this baked body is further baked with a load. By making this baked body within the temperature range in such a state, notable warping and deformation can be avoided. Furthermore this baked body gains the mechanical strength to some extent since the glass components are fusion-coupled with one another or in the wet state with a filler. Accordingly, the baked body even with a load can avoid the cracking or chipping.

公开(公告)号：JPH09142941A

公开(公告)日：1997-06-03

申请号：JP32838995

申请日：1995-11-21

Applicant: NGK SPARK PLUG CO

Inventor： TAGA SHIGERU ,  BABA MAKOTO ,  MIURA KAZUNORI

IPC: C04B35/622 ,  C04B35/632 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To obtain a ceramic green sheet excellent in suitability to the removal of binder and handleability at the time of working in the green state due to moderate sheet strength and moderate flexibility and excellent especially in property of forming fine via holes at a narrow pitch as a ceramic green sheet used for producing a glass-ceramic circuit board fired at a low temp. with a low m.p. metal such as Ag, Cu or Au as a circuit material. SOLUTION: This ceramic green sheet contains powdery ceramic stock and a binder which is an acrylic resin having an average mol.wt. of >=2.0×10 , an acid value of 2.7-7.2 and 50-90 deg.C glass transition temp. The binder is the acrylic resin derived from ethyl methacrylate. Dioctyl phthalate(DOP) or dibutyl phthalate(DBP) is contained as a plasticizer.

公开(公告)号：JPH06291435A

公开(公告)日：1994-10-18

申请号：JP10510593

申请日：1993-04-05

Applicant: NGK SPARK PLUG CO

Inventor： KODERA EIJI ,  TAGA SHIGERU ,  KIMURA YUKIHIRO

IPC: H01B1/16 ,  H05K1/09 ,  H05K1/11 ,  H05K3/40 ,  H05K3/46

Abstract: PURPOSE:To obtain a conductive paste having the shrinkage factor matching with the baking shrinkage factor of mullite and making low resistance by a method wherein the conductor paste contains the conductor constituent and a bit of mullite particles to be made pasty using a vehicle. CONSTITUTION:A conductive paste containing a conductive constituent and a small amount of mullite powder is to be made pasty using a vehicle. At this time, the mullite content in this conductor paste is specified to be 0.5-10wt.% to the totle amount. Preferably, the mullite has a mean particle diameter less than 3mum while the conductive constituent is tungsten. Through these procedures, the pertinent conductor columns neither protruding from the surface of a mullite ceramic substrate nor becoming hollow thereof can be formed. Accordingly, the title ceramic wiring substrate avoiding any disconnection and defective airtightness as well as forming the surface wiring with high precision can be obtained.

公开(公告)号：JP2013239330A

公开(公告)日：2013-11-28

申请号：JP2012111383

申请日：2012-05-15

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TSUJIMURA TAKETOSHI ,  ITO JUNICHI ,  TAGA SHIGERU

IPC: H01M8/02 ,  H01M8/12

CPC classification number: Y02P70/56

Abstract: PROBLEM TO BE SOLVED: To provide a solid oxide fuel battery which can both prevent the spread of chromium from an interconnector and secure a gas passage in the interconnector and a manufacturing method therefor.SOLUTION: A solid oxide fuel battery comprises: a fuel battery cell body which includes an air electrode layer, a solid electrolyte layer and a fuel electrode layer and has power generation function; and an interconnector which includes a flat shaped flat portion and a plurality of convex portions protruding from a plane on one side of the flat portion and electrically connected to an electrode layer on one side of the air electrode layer and the fuel electrode layer, part of which being pushed into the electrode layer on the one side, and which is formed from a metallic material. The solid oxide fuel battery further includes a coating layer covering the top faces and at least part of the side faces of the convex portions and not covering at least part of the flat portion.

Abstract translation: 要解决的问题：提供一种固体氧化物燃料电池，其可以防止铬从互连器中扩散并确保互连器中的气体通道及其制造方法。解决方案：固体氧化物燃料电池包括：燃料电池单元 具有空气电极层，固体电解质层和燃料极层，具有发电功能; 以及互连器，其包括平坦平坦部分和从平坦部分的一侧上的平面突出并且与空气电极层和燃料电极层的一侧上的电极层电连接的多个凸部， 其被推入一侧的电极层中，并且由金属材料形成。 固体氧化物燃料电池还包括覆盖上表面和凸部的至少一部分侧面的涂层，并且不覆盖平坦部分的至少一部分。

公开(公告)号：JP2013232688A

公开(公告)日：2013-11-14

申请号：JP2013162322

申请日：2013-08-05

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  KATO TATSUYA ,  BABA MAKOTO ,  TAGA SHIGERU

IPC: H05K3/46

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a multilayer ceramic substrate capable of preventing occurrence of cracking around an interlayer connection conductor during mechanical polishing, and not requiring many steps subsequent to mechanical polishing.SOLUTION: At first, surface of a sintered compact 37 is polished by lapping until warpage of a substrate is eliminated, thus ensuring flatness of the substrate. Subsequently, both outer surfaces of the sintered compact 37 thus lapped are polished by polishing. In concrete terms, both outer surfaces of the sintered compact 37 thus lapped are polished using polycrystalline diamond abrasive grains 41 having an average grain diameter (D50) of 9 μm. More specifically, polycrystalline diamond abrasive grains 41 having an average grain diameter (D50) larger than the projection amount are selected, and polishing is performed using a polishing surface plate 43 with fixed polycrystalline diamond abrasive grains 41, thus obtaining a multilayer ceramic substrate 1.

Abstract translation: 要解决的问题：提供一种能够在机械抛光期间防止在层间连接导体周围发生裂纹的多层陶瓷基板的制造方法，并且在机械抛光后不需要许多步骤。首先，烧结体的表面 37通过研磨进行抛光，直到消除基板的翘曲，从而确保基板的平整度。 随后，通过研磨抛光由此研磨的烧结体37的两个外表面。 具体来说，使用平均粒径（D50）为9μm的多晶金刚石磨粒41对由此研磨的烧结体37的外表面进行研磨。 更具体地说，选择具有大于投影量的平均粒径（D50）的多晶金刚石磨粒41，并且使用具有固定多晶金刚石磨粒41的抛光表面板43进行抛光，从而获得多层陶瓷基板1。

公开(公告)号：JP2010271296A

公开(公告)日：2010-12-02

申请号：JP2009155263

申请日：2009-06-30

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  HONDA CHIE ,  KATO TATSUYA ,  YAMADA TOMOHIDE ,  TAGA SHIGERU

IPC: G01R1/073 ,  H01L21/66

CPC classification number: H05K3/4611 ,  G01R1/0491 ,  G01R3/00 ,  G01R31/2863 ,  H05K1/0306 ,  H05K1/113 ,  H05K3/388 ,  H05K3/4629 ,  H05K2201/0347 ,  H05K2203/025 ,  H05K2203/308 ,  Y10T29/49155

Abstract: PROBLEM TO BE SOLVED: To provide an electrical inspection substrate having a sufficient dimensional accuracy as to a connection to a pad on a silicon wafer and capable of connecting the pad on the silicone wafer and connection terminals formed on the substrate without a poor connection even in a test and so on exposed to a big temperature difference, and a method of manufacturing the same. SOLUTION: The electrical inspection substrate 1 includes a multilayer ceramic substrate 4 having mullite and borosilicate glass as major ceramic components. The multilayer ceramic substrate 4 contains an alkali metal oxide in the borosilicate glass by 0.5 to 1.5 mass%. An average thermal expansion coefficient is 3.0 to 4.0 ppm/°C at -50°C to 150°C, and there is a relationship of 0 ppm/°C COPYRIGHT: (C)2011,JPO&INPIT

Abstract translation: 要解决的问题：为了提供一种具有足够的尺寸精度的电检查基板，其与硅晶片上的焊盘的连接能够连接硅树脂晶片上的焊盘和形成在基板上的连接端子，而没有差 连接即使在试验等中暴露于较大的温差，也是制造其的方法。 电检查基板1包括具有莫来石和硼硅酸盐玻璃作为主要陶瓷部件的多层陶瓷基板4。 多层陶瓷基板4在硼硅酸玻璃中含有0.5〜1.5质量％的碱金属氧化物。 在-50℃〜150℃下的平均热膨胀系数为3.0〜4.0ppm /℃，热膨胀系数为0ppm /℃<（α1-α2）≤2.5ppm/℃的关系 在各个温度为-50℃至150℃的系数α1和相同温度下的硅晶片的热膨胀系数α2。 版权所有（C）2011，JPO＆INPIT

公开(公告)号：JP2010177383A

公开(公告)日：2010-08-12

申请号：JP2009017329

申请日：2009-01-28

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  KATO TATSUYA ,  TAGA SHIGERU

IPC: H05K3/46 ,  H01L23/12 ,  H01L23/13

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate which suppresses projection of an inter-layer connection conductor and is superior in dimensional accuracy, to provide a method of manufacturing the same, and to provide a probe card including the multilayer ceramic substrate. SOLUTION: The multilayer ceramic substrate includes a plurality of ceramic layers, a plurality of inner layer conductors disposed between the ceramic layers, and the inter-layer connection conductor connecting the inner layer conductors and is obtained by integrally sintering green sheets to be sintered into the ceramic layers, unsintered inner layer conductor materials to be sintered into the inner layer conductors, and an unsintered inter-layer connection conductor material to be sintered into the inter-layer connection conductor. When sintering shrinkage start temperatures of the green sheets, the unsintered inner layer conductor materials, and the unsintered inter-layer connection conductor material are denoted by T A (°C), T B (°C), and T C (°C), respectively, relations of 100≤T C -T B and 0≤T A -T B ≤200 are satisfied. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：为了提供一种抑制层间连接导体的突出并且尺寸精度优异的多层陶瓷基板，提供其制造方法，并提供包括多层陶瓷的探针卡 基质。 解决方案：多层陶瓷基板包括多个陶瓷层，布置在陶瓷层之间的多个内层导体和连接内层导体的层间连接导体，通过将生片整体烧结得到 烧结到陶瓷层中，将未烧结的内层导体材料烧结到内层导体中，以及将未烧结的层间连接导体材料烧结到层间连接导体中。 当生坯的烧结收缩开始温度，未烧结的内层导体材料和未烧结的层间连接导体材料的烧结收缩开始温度由T A （℃）表示时， SB>（℃）和T C（℃），关系为100≤T -T B ，0≤ 满足T A -T B ≤200。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2010154138A

公开(公告)日：2010-07-08

申请号：JP2008328861

申请日：2008-12-24

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAGI KEIJI ,  ICHIKAWA JUNICHI ,  TAGA SHIGERU

IPC: H01P1/213 ,  H01P1/205 ,  H03H7/46

Abstract: PROBLEM TO BE SOLVED: To provide a layered multiplexer capable of securing an excellent attenuation characteristic in a wide frequency range and downsizing a layered body.
SOLUTION: The layered multiplexer (layered diplexer 10) is provided with a plurality of filters 11, 12 which are composed into a layered body layering a plurality of conductive layers are different in passband width. A first filter 11 having the lowest first frequency as a passband width includes a resonator R1 connected to an input side, a resonator R2 connected to a rear stage of the resonator R1, and a resonator R3 connected to a rear stage of the resonator R2. The respective resonators R1, R2, and R3 are composed of via-conductors penetrating the conductive layers in the layer direction and conductive patterns connected to the via-conductors on the conductive layers, and the respective conductive patterns of the resonators R1 and R2 are placed opposite to the layer direction, and are opposite to respective conductive patterns of the resonators R2 and R3 in the layer direction. Thus, the layered multiplexer becomes small and has an excellent attenuation characteristic.
COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 要解决的问题：提供能够在宽频率范围内确保优异的衰减特性并且使层叠体小型化的分层多路复用器。 解决方案：分层多路复用器（分层双工器10）设置有多个滤波器11,12，它们被组成层叠多个导电层的层叠体的通带宽度不同。 具有最低的第一频率作为通带宽度的第一滤波器11包括连接到输入侧的谐振器R1，连接到谐振器R1的后级的谐振器R2和连接到谐振器R2的后级的谐振器R3。 相应的谐振器R1，R2和R3由沿着层方向穿过导电层的通路导体和与导电层上的导体导体连接的导电图案组成，并且各个谐振器R1和R2的导电图案被放置 与层方向相反，并且与层方向上的谐振器R2和R3的各导电图案相反。 因此，分层复用器变小并具有优良的衰减特性。 版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009158576A

公开(公告)日：2009-07-16

申请号：JP2007332443

申请日：2007-12-25

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  TAGA SHIGERU ,  SATO MANABU

IPC: H05K3/46 ,  C04B35/111 ,  C04B35/18 ,  G01R1/073 ,  H01L21/66 ,  H01L23/12 ,  H05K1/03

Abstract: PROBLEM TO BE SOLVED: To provide a multilayer ceramic substrate for an electronic component inspecting tool, which has high strength and high dimensional precision and is free of substrate cracking etc., due to a heat cycle. SOLUTION: The multilayer ceramic substrate for the electronic component inspecting tool comprises: a first baked substrate 11, and second baked substrates 12A to 12D which are laminated on one primary surface of the first baked substrate 11 in one body and made of materials having lower baking temperature than the first baked substrate 11, and fracture toughness K 1C of the second baked substrates 12A to 12D is ≥2.3 MPa×m 1/2 . COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：提供一种用于电子部件检查工具的多层陶瓷基板，其由于热循环而具有高强度和高尺寸精度并且没有基板裂纹等。 解决方案：用于电子部件检查工具的多层陶瓷基板包括：第一烘烤基板11和第二烘烤基板12A至12D，其在一体中层压在第一烘烤基板11的一个主表面上并由材料制成 具有比第一烘烤基板11低的烘烤温度，并且第二烘烤基板12A〜12D的断裂韧性K 1C ≥2.3MPa×m

公开(公告)号：JP2008288403A

公开(公告)日：2008-11-27

申请号：JP2007132242

申请日：2007-05-18

Applicant: Ngk Spark Plug Co Ltd ,  日本特殊陶業株式会社

Inventor： TAKAHASHI HIROYUKI ,  TAGA SHIGERU

IPC: H05K3/46 ,  B23K26/38 ,  B23K101/42 ,  H05K3/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a ceramic substrate, which includes a perforating step of reliably forming a through hole of a very small diameter for filling a conductor in a green sheet with a good dimensional accuracy and efficiency, while avoiding deposition of a residue on the inner surface of the through hole. SOLUTION: When a through hole 4 for filling a conductor is formed from a front surface 2 to a back surface 3 to pass through a green sheet s, the green sheet having a thickness t corresponding to 1.6-4.2 times an inner diameter a of the through hole 4 in the front surface 2, the method of manufacturing a ceramic substrate 1 includes a perforating step of forming the through hole 4 having the inner diameter a of 60 μm or less in the front surface 2 by applying a YAG laser beam L having a wavelength of 400 nm or less onto the green sheet s from its front side 2. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 解决问题的方案：提供一种陶瓷基板的制造方法，其特征在于，具有能够以良好的尺寸精度和效率可靠地形成用于将导体填充在生片中的非常小直径的贯通孔的穿孔工序， 同时避免残留物沉积在通孔的内表面上。 解决方案：当从前表面2到后表面3形成用于填充导体的通孔4以通过生片时，具有对应于内径的1.6-4.2倍的厚度t的生片 a的前表面2中的通孔4的制造方法，陶瓷基板1的制造方法包括穿孔步骤，通过施加YAG激光器在前表面2中形成内径a为60μm以下的通孔4 具有400nm以下波长的光束L从其前侧2到绿色片材上。版权所有（C）2009，JPO＆INPIT