Abstract:
A two stage powder coating method involves applying relatively large size powder particles (12) to a surface (11) to be coated during a first coating stage, followed by applying relatively small size powder particles (13) to the surface (11) during a second coating stage. The particles (12, 13) may be heated to cause melting after the first and/or the second stages, thereby to level the coating. This two stage powder application method assures a level, uniform and aesthetically pleasing finish for the applied powder coating, even for surfaces (11) with hollow and/or recessed portions (15).
Abstract:
An apparatus (10) for, and method of, spraying an adhesive onto a moving surface (12) with a plurality of gun modules (18) which are attached to a transition plate (16) which in turn is secured to an adhesive and air service manifold (14). The gun modules (18) are secured to movable plates (52) which can be connected to the transition plate (16) in a manner that enables the gun modules (18) to be individually shifted laterally with respect to the transition plate (16) so that the location at which the adhesive is sprayed onto the moving surface (12) is shifted.
Abstract:
A system for applying a vapor barrier coating to a printed circuit board having circuit components mounted thereon, which includes an airless spray gun having a nozzle (7) configured to provide a flat spray pattern, a source (25) of vapor barrier coating liquid connected to the gun for supplying liquid coating to the gun at a pressure which produces a leaf-shaped flat liquid spray pattern emission from the nozzle, the nozzle having an orifice sufficiently large to provide continuous clog-free flow of liquid therefrom when pressurized liquid is supplied thereto at a pressure which produces the leaf-shaped flat liquid spray pattern, valve means (23) connected between the nozzle and the liquid supply for controlling the supply of pressurized liquid to the nozzle, and actuating means operatively opening and closing said valve for relatively short and long intervals, respectively, to effectively decrease the average flow rate per unit time from the nozzle with respect to that resulting were the valve continuously open, thereby permitting relatively thin liquid coatings to be applied to a printed circuit board when the relative speed between the gun and circuit board is sufficiently slow that an unduly thick coating would be applied were the valve continuously open.
Abstract:
An article (25) is wrapped in a shrink film (10) having a longitudinal seal. The longitudinal seal is formed by swirling hot melt fibers onto a longitudinal edge of the film and bringing longitudinal edges together to form an initial pressure-sensitive seal. The shrink film (10) and hot melt are then subjected to the elevated temperature of shrink oven (35) to shrink the film and to form a more complete bond at the longitudinal seam.
Abstract:
An electrostatic spray device (10) having a gun barrel (28, 38) formed with a powder delivery passageway (32, 46) connected to a source of particulate powder material, a nozzle (48) mounted at the forward end of the gun barrel which is formed with a discharge opening (52) for emitting coating particles, a deflector (88) carrying an electrode (90) which produces an electrostatic field in the path of the coating particles emitted from the discharge opening (52) and a pattern adjustment sleeve (54) carried by the gun barrel (28, 38) which is radially outwardly spaced from the deflector (88) and discharge opening (52). Both the deflector (88) and pattern adjustment sleeve (54) are axially movable relative to one another, and relative to the discharge opening (52), to vary the width of the spray pattern of coating particle emitted from the discharge opening (52) while controlling the concentration of the electrostatic field produced by the electrode (90).
Abstract:
A method of applying a uniform thickness layer of hot solder resist on printed circuit board (PP) containing a raised pattern of conductive paths of predetermined thickness having edge surfaces disposed perpendicular to the upper surfaces of the raised conductive paths. The method includes emitting the hot solder resist in a dovetail flat fan liquid film (Fd) pattern from an airless spray gun (2), and locating the printed circuit board below the emitted dovetail liquid film pattern at a distance such that the upper surface of the printed circuit board intersects the dovetail liquid film above the point at which the liquid film starts to brake-up into liquid particles. The hot solder resist has a moderate viscosity and contains both high and low boiling point solvents to allow the coating to even out without unnecessarily thinning at points above the upper edges of the raised printed circuit conductive paths.
Abstract:
A high-integrity closure, sift-proof carton (10), a method and an adhesive dispensing means for producing same. Foamed hot melt adhesive is dispensed in parallel strips from dispensing guns onto the flaps (20), (22), (30), (32) of the carton (10), which are therafter folded down to close the carton (10). The strips can be spaced so that a continuous tight adhesive seal is formed, especially by providing a strip pattern interdigitating when the flaps contact each other. Since all strips are provided in parallel, while the carton is moved with respect to the dispensing means, application of adhesive is fast and reliable.
Abstract:
A system (10) and a process for detecting and controlling ungrounded or inadequately grounded parts (12) prior to subjecting said parts (12) to an electrostatic coating process comprising: a radio-frequency detection system (47) located outside the electrostatic coating area for sensing energy levels radiated by sparking and/or corona discharge resulting from an ungrounded or inadequatelly grounded part (12) under test; and a coincidence detector (49) located within the electrostatic coating area for sensing and discriminating energy levels radiated by spurious sparking and/or corona discharge resulting from an external source other than said ungrounded or inadequately grounded part (12) under test.
Abstract:
Methods and apparatus for producing high quality closed cell foams for use in applications such as coatings, sealant beads, seam filling and gaskets. In a first embodiment an in-line single pass static mixing device (10) containing a very large number of individual mixing elements (12) is used to homogeneously disperse a gas throughout a highly viscous liquid polymeric material such as a plastisol, silicone, butyl or urethane based material. In a second embodiment both a dynamic mixer (3a) and a single pass static mixer (3b) are used in series to form the closed cell foam.
Abstract:
A coupling device (10) comprises a male coupling member (12) and a female coupling member (14), each having outwardly extending ends which carry male (68) and female (144) sealing elements, respectively, formed with mating, spherical-shaped surfaces (70, 148) which are effective to force solvent or coating material which may have collected thereon into passageways formed in each of such sealing elements or onto facing surfaces of the coupling members to substantially prevent contamination of new coating material flowing through the coupling device after a cleaning and/or color change operation has been performed.