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    RADIATION-EMITTING SEMICONDUCTOR CHIP
    22.
    发明申请
    RADIATION-EMITTING SEMICONDUCTOR CHIP 审中-公开
    辐射发射半导体芯片

    公开(公告)号：US20150236070A1

    公开(公告)日：2015-08-20

    申请号：US14702807

    申请日：2015-05-04

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Jürgen Moosburger ,  Norwin von Malm ,  Patrick Rode ,  Lutz Höppel ,  Karl Engl

    IPC: H01L27/15 ,  H01L33/00 ,  H01L33/38

    CPC classification number: H01L27/15 ,  H01L25/167 ,  H01L33/005 ,  H01L33/02 ,  H01L33/08 ,  H01L33/382 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0016 ,  H01L2924/00

    Abstract: A radiation-emitting semiconductor chip includes a carrier and a semiconductor body having a semiconductor layer sequence, wherein an emission region and a protective diode region are formed in the semiconductor body having the semiconductor layer sequence; the semiconductor layer sequence includes an active region that generates radiation and is arranged between a first semiconductor layer and a second semiconductor layer; the first semiconductor layer is arranged on a side of the active region facing away from the carrier; the emission region has a recess extending through the active region; the first semiconductor layer, in the emission region, electrically conductively connects to a first connection layer, wherein the first connection layer extends in the recess from the first semiconductor layer toward the carrier; the second semiconductor layer, in the emission region, electrically conductively connects to a second connection layer.

    Abstract translation: 辐射发射半导体芯片包括具有半导体层序列的载体和半导体本体，其中在具有半导体层序列的半导体主体中形成发光区域和保护二极管区域; 半导体层序列包括产生辐射并且被布置在第一半导体层和第二半导体层之间的有源区; 第一半导体层布置在有源区域背离载体的一侧; 发射区域具有延伸穿过有源区域的凹部; 发射区域中的第一半导体层导电地连接到第一连接层，其中第一连接层在凹部中从第一半导体层向载体延伸; 在发射区域中的第二半导体层导电地连接到第二连接层。

    Optoelectronic Semiconductor Chip
    23.
    发明申请
    Optoelectronic Semiconductor Chip 有权
    光电半导体芯片

    公开(公告)号：US20140197435A1

    公开(公告)日：2014-07-17

    申请号：US14122134

    申请日：2012-04-26

    Applicant: OSRAM OPTO SEMICONDUCTORS GMBH

    Inventor： Markus Maute ,  Karl Engl ,  Sebastian Taeger ,  Robert Walter ,  Johannes Stocker

    IPC: H01L33/42 ,  H01L33/60

    CPC classification number: H01L33/46 ,  H01L33/06 ,  H01L33/20 ,  H01L33/32 ,  H01L33/382 ,  H01L33/405 ,  H01L33/42 ,  H01L33/60 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An optoelectronic semiconductor chip includes a semiconductor body of semiconductor material, a p-contact layer and an n-contact layer. The semiconductor body includes an active layer intended for generating radiation. The semiconductor body includes a p-side and an n-side, between which the active layer is arranged. The p-contact layer is intended for electrical contacting the p-side. The n-contact layer is intended for electrical contacting the n-side 1b. The n-contact layer contains a TCO layer and a minor layer, the TCO-layer being arranged between the n-side of the semiconductor body and the minor layer.

    Abstract translation: 光电半导体芯片包括半导体材料的半导体本体，p接触层和n接触层。 半导体主体包括用于产生辐射的有源层。 半导体本体包括p侧和n侧，其间布置有源层。 p接触层用于电接触p侧。 n接触层用于电接触n侧1b。 n接触层包含TCO层和次层，TCO层布置在半导体主体的n侧和次要层之间。

    Optoelectronic semiconductor body and method for producing the same
    24.
    发明授权
    Optoelectronic semiconductor body and method for producing the same 有权
    光电半导体体及其制造方法

    公开(公告)号：US08653540B2

    公开(公告)日：2014-02-18

    申请号：US13862096

    申请日：2013-04-12

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Karl Engl ,  Patrick Rode ,  Lutz Hoeppel ,  Matthias Sabathil

    IPC: H01L27/15 ,  H01L31/12 ,  H01L33/00

    CPC classification number: H01L33/58 ,  H01L33/0079 ,  H01L33/22 ,  H01L33/382 ,  H01L33/405 ,  H01L33/44 ,  H01L2924/0002 ,  H01L2924/00

    Abstract: An optoelectronic semiconductor body includes a semiconductor layer sequence which has an active layer suitable for generating electromagnetic radiation, and a first and a second electrical connecting layer. The semiconductor body is provided for emitting electromagnetic radiation from a front side. The first and the second electrical connecting layer are arranged at a rear side opposite the front side and are electrically insulated from one another by means of a separating layer. The first electrical connecting layer, the second electrical connecting layer and the separating layer laterally overlap and a partial region of the second electrical connecting layer extends from the rear side through a breakthrough in the active layer in the direction of the front side. Furthermore, a method for producing such an optoelectronic semiconductor body is specified.

    Abstract translation: 光电半导体本体包括具有适于产生电磁辐射的有源层的半导体层序列和第一和第二电连接层。 半导体本体被设置用于从前侧发射电磁辐射。 第一和第二电连接层布置在与前侧相对的后侧，并且通过分离层彼此电绝缘。 第一电连接层，第二电连接层和分离层横向重叠，并且第二电连接层的部分区域从后侧沿着正面的方向通过有源层中的穿透而延伸。 此外，规定了这种光电子半导体体的制造方法。

    MODULE FOR A VIDEO WALL, AND METHOD OF PRODUCING SAME
    26.
    发明申请
    MODULE FOR A VIDEO WALL, AND METHOD OF PRODUCING SAME 审中-公开

    公开(公告)号：US20190237443A1

    公开(公告)日：2019-08-01

    申请号：US16318279

    申请日：2017-07-13

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schwarz ,  Alexander Martin ,  Jürgen Moosburger ,  Karl Engl

    IPC: H01L25/075

    CPC classification number: H01L25/0753 ,  G09F9/00 ,  H01L33/62 ,  H01L2933/0091

    Abstract: A module for a video wall includes a plurality of light-emitting components; and a carrier including conduction regions, wherein the light-emitting components each include a top side including a top-side contact and an underside including an underside contact, the light-emitting components are configured to emit electromagnetic radiation via the top side, the underside contacts of the light-emitting components electrically conductively connect to the conduction regions, the top-side contacts electrically contact a conductive layer, the light-emitting components each include at least four light-emitting semiconductor chips, the light-emitting semiconductor chips within a light-emitting component interconnect in parallel with one another, the light-emitting semiconductor chips within a light-emitting component each electrically conductively connect to the top-side contacts and the underside contacts of the light-emitting component, a plurality of adjacent light-emitting components constitute a cluster, and the light-emitting semiconductor chips of the light-emitting components of a cluster includes an identical nominal wavelength.

    MODULAR MODULE
    27.
    发明申请
    MODULAR MODULE 审中-公开

    公开(公告)号：US20190155564A1

    公开(公告)日：2019-05-23

    申请号：US16314467

    申请日：2017-06-30

    Applicant: OSRAM Opto Semiconductors GmbH

    Inventor： Thomas Schwarz ,  Frank Singer ,  Jürgen Moosburger ,  Karl Engl ,  Alexander Martin

    IPC: G06F3/14 ,  G09G3/32

    Abstract: An arrangement includes at least two modules for a video wall including light-emitting components arranged on a carrier, wherein a drive circuit that selectively drives the component at the carrier is provided for each component, row lines and column lines are provided, each drive circuit connects to a row line and a column line, each drive circuit connects to power supply lines, the carrier includes plated-through holes that guide the row lines and the column lines onto an underside of the carrier, the two modules are arranged on a further carrier, the further carrier includes at least one recess, an electrical connector is arranged in the recess, and the electrical connector connects column lines and/or row lines of the two modules to one another.

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