公开(公告)号：EP2102947A2

公开(公告)日：2009-09-23

申请号：EP07869226.6

申请日：2007-12-13

Applicant: Panduit Corp.

Inventor： CAVENEY, Jack E. ,  PATEL, Satish I.

IPC: H01R24/04

CPC classification number: H01R13/665 ,  H01R13/08 ,  H01R13/46 ,  H01R13/6464 ,  H01R13/6658 ,  H01R24/28 ,  H01R24/64 ,  H01R2107/00 ,  H05K1/0228 ,  H05K1/147 ,  H05K2201/10189 ,  Y10S439/941

Abstract: A communication jack, system using the jack, and method of fabricating the jack are disclosed. The jack includes a cavity configured to accept a communication plug to form a communication connector. The jack includes a plurality of plug interface contacts that extend into the cavity such that a plug inserted into the cavity makes electrical contact with the plug interface contacts at plug/jack interfaces of the plug interface contacts. One or more of the plug interface contacts is formed from multiple conductive layers. The conductive layers are movable relative to each other at at least one end. A dielectric layer or flexible printed circuit board may be disposed between the conductive layers.

公开(公告)号：EP4381569A1

公开(公告)日：2024-06-12

申请号：EP22754224.8

申请日：2022-07-15

Applicant: Panduit Corp.

Inventor： NOVAK, Benjamin S. ,  PATEL, Satish I. ,  CHURNOVIC, Roman J.

IPC: H01R13/506 ,  H01R31/06 ,  H04Q1/00 ,  H01R13/6581

CPC classification number: H01R31/06 ,  H01R13/506 ,  H01R13/6581

公开(公告)号：EP3847720A1

公开(公告)日：2021-07-14

申请号：EP19772929.6

申请日：2019-09-05

Applicant: Panduit Corp.

Inventor： NOVAK, Benjamin S. ,  PATEL, Satish I. ,  LENZ, Sean W.

IPC: H01R4/2433 ,  H01R13/502 ,  H01R13/6592 ,  H01R24/64 ,  H01R107/00 ,  H01R13/58 ,  H01R103/00

公开(公告)号：EP3055906B1

公开(公告)日：2019-05-15

申请号：EP14790920.4

申请日：2014-10-10

Applicant: Panduit Corp.

Inventor： O'YOUNG, Jason ,  FRANSEN, Robert E. ,  MARRS, Samuel M. ,  PATEL, Satish I. ,  WACHTEL, Paul W. ,  CIEZAK, Andrew

IPC: H01R24/64 ,  H01R13/703 ,  H01R27/00 ,  H01R13/66 ,  H01R29/00