公开(公告)号：WO2021101974A1

公开(公告)日：2021-05-27

申请号：PCT/US2020/061026

申请日：2020-11-18

Applicant: PANDUIT CORP.

Inventor： NOVAK, Benjamin S. ,  PATEL, Satish I. ,  LENZ, Sean W. ,  CHURNOVIC, Roman J. ,  FRANSEN, Robert E. ,  FRITZ, Robert L.

IPC: H01R4/2433 ,  H01R13/506 ,  H01R13/6581 ,  H01R13/6592 ,  H01R13/627

Abstract: A communications connector has a main plug assembly and a wire cap that is configured to terminate a pair of conductors to the pair of contacts by being secured to a side of the main plug assembly in a direction perpendicular to a plane defined by a deflection direction of a latch of the connector. In another embodiment, a communications connector has a main plug assembly and two electrical contacts within the main plug assembly wherein each electrical contact has a first end having a forked receptacle and a second end having an IDC that is configured to have a conductor terminated in a direction perpendicular to a direction of mating insertion and parallel to a plane defined by the contact.

公开(公告)号：WO2020051340A1

公开(公告)日：2020-03-12

申请号：PCT/US2019/049764

申请日：2019-09-05

Applicant: PANDUIT CORP.

Inventor： NOVAK, Benjamin S. ,  PATEL, Satish I. ,  LENZ, Sean W.

IPC: H01R4/2433 ,  H01R13/502 ,  H01R13/6592 ,  H01R24/64 ,  H01R107/00 ,  H01R13/58 ,  H01R103/00

Abstract: A communication connector has an outer housing with an opening, a shielding wrap at least partially enclosing the outer housing, and a contact carrier assembly configured to be interested into the opening of the outer housing. The contact carrier assembly at least partially encloses at least two contacts each with an insulation displacement contact (IDC). The contact carrier assembly also has an integrated wire cap that utilizes a hinge feature to press cable conductors of a cable into their respective IDCs.

公开(公告)号：EP3847720A1

公开(公告)日：2021-07-14

申请号：EP19772929.6

申请日：2019-09-05

Applicant: Panduit Corp.

Inventor： NOVAK, Benjamin S. ,  PATEL, Satish I. ,  LENZ, Sean W.

IPC: H01R4/2433 ,  H01R13/502 ,  H01R13/6592 ,  H01R24/64 ,  H01R107/00 ,  H01R13/58 ,  H01R103/00

公开(公告)号：EP4062493A1

公开(公告)日：2022-09-28

申请号：EP20824778.3

申请日：2020-11-18

Applicant: Panduit Corp.

Inventor： NOVAK, Benjamin S. ,  PATEL, Satish I. ,  LENZ, Sean W. ,  CHURNOVIC, Roman J. ,  FRANSEN, Robert E. ,  FRITZ, Robert L.

IPC: H01R4/2433 ,  H01R13/506 ,  H01R13/6581 ,  H01R13/6592 ,  H01R13/627