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    Substrate for Can Package-Type Optical Device and Optical Device using Same
    25.
    发明申请
    Substrate for Can Package-Type Optical Device and Optical Device using Same 审中-公开
    可用于封装型光学器件的基板和使用相同的光学器件

    公开(公告)号：US20160190398A1

    公开(公告)日：2016-06-30

    申请号：US14986092

    申请日：2015-12-31

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/48 ,  H01L33/62

    CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.

    Abstract translation: 本发明涉及一种光学器件的制造方法及其制造的光学器件，其涉及使用基板本身作为散热板，并且采用其上形成有垂直绝缘层的基板，使得电极端子 不必从密封空间挤出，从而能够简化光学装置的整体结构和制造过程。 根据本发明，一种罐封装型光学器件的制造方法包括以下步骤：（a）制备具有垂直绝缘层的金属板和金属基板，其中多于一个垂直绝缘层与 形成其底面的顶面; （b）用垂直绝缘层将金属板与金属基板的顶面接合; （c）在具有预定深度的圆柱形凹坑形式的步骤（b）中形成空腔，该预定深度通过穿过所述金属板并形成的粘合剂层到达所述金属基板的具有垂直绝缘层的表面 通过所述接合，其中所述空腔在其底壁中包含所述垂直绝缘层; （e）将将光学装置和光学装置的电极电连接在一起的导线分别连接到腔的垂直绝缘层的底壁的表面的任一侧; 和（g）通过由透光材料制成的保护板密封空腔; 以及罐盖，其形成为其顶部中心部分和底部打开并且包围保护板的周边的相框。

    High Heat-Radiant Optical Device Substrate
    26.
    发明申请
    High Heat-Radiant Optical Device Substrate 有权
    高热辐射光学器件基板

    公开(公告)号：US20150147580A1

    公开(公告)日：2015-05-28

    申请号：US14609112

    申请日：2015-01-29

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Tae Hwan Song ,  Young Chul Jun

    IPC: H01L33/64

    CPC classification number: H01L33/641 ,  B29C65/4835 ,  B32B15/092 ,  B32B15/20 ,  B32B27/04 ,  B32B2255/06 ,  B32B2255/26 ,  B32B2260/046 ,  H01L24/97 ,  H01L25/50 ,  H01L33/005 ,  H01L33/483 ,  H01L33/486 ,  H01L33/62 ,  H01L33/644 ,  H01L33/647 ,  H01L2224/73265 ,  H01L2924/12041 ,  H01L2933/0066 ,  H01L2933/0075 ,  Y10T428/24612 ,  Y10T428/31522 ,  Y10T428/31678

    Abstract: An optical device substrate includes metal plates and insulating layers formed between the metal plates. Each insulating layer includes a cured insulating layer formed by curing insulating material and an anodized layer merged with each metal plate, the anodized layer formed by anodizing a first metal and a second metal of each metal plate. The first metal and the second metal include a first anodized layer and a second anodized layer, respectively, and are electrically insulated by interfaces including a first interface formed between the first metal and the first anodized layer, a second interface formed between the first anodized layer and the cured insulating layer, a third interface formed between the cured insulating layer and the second metal and a fourth interface formed between the second anodized layer and the second metal.

    Abstract translation: 光学元件基板包括金属板和形成在金属板之间的绝缘层。 每个绝缘层包括通过固化绝缘材料形成的固化绝缘层和与每个金属板合并的阳极氧化层，阳极氧化层通过阳极氧化每个金属板的第一金属和第二金属而形成。 第一金属和第二金属分别包括第一阳极氧化层和第二阳极氧化层，并且通过界面电绝缘，所述界面包括形成在第一阳极氧化层和第一阳极氧化层之间的第一界面，形成在第一阳极氧化层 固化的绝缘层，形成在固化的绝缘层和第二金属之间的第三界面和形成在第二阳极氧化层和第二金属之间的第四界面。

    Micro LED structure and method of manufacturing same
    28.
    发明授权
    Micro LED structure and method of manufacturing same 有权

    公开(公告)号：US10964871B2

    公开(公告)日：2021-03-30

    申请号：US16904102

    申请日：2020-06-17

    Applicant: POINT ENGINEERING CO., LTD.

    Inventor： Bum Mo Ahn ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/62 ,  H01L25/075 ,  H01L27/12 ,  H01L23/00

    Abstract: The present invention relates to a micro LED structure and a method of manufacturing the same. More particularly, the present invention relates to a micro LED structure and a method of manufacturing the same, the micro LED structure including: a micro LED; a circuit board driving the micro LED; and an anisotropic conductive anodic oxide film provided between the micro LED and the circuit board to electrically connect the circuit board and the micro LED. According to the present invention, without applying an external force (thermocompression bonding) to the anisotropic conductive anodic oxide film, it is possible to electrically connect the circuit board and the micro LED. In addition, it is possible to obtain characteristics such as uniform conductivity in a vertical direction and heat dissipation.

    Substrate for can package-type optical device and optical device using same
    30.
    发明授权
    Substrate for can package-type optical device and optical device using same 有权

    公开(公告)号：US10062812B2

    公开(公告)日：2018-08-28

    申请号：US14986092

    申请日：2015-12-31

    Applicant: Point Engineering Co., Ltd.

    Inventor： Ki Myung Nam ,  Seung Ho Park ,  Tae Hwan Song

    IPC: H01L33/48 ,  H01L33/62 ,  H01L33/56 ,  H01L25/075

    CPC classification number: H01L33/483 ,  H01L25/0753 ,  H01L33/486 ,  H01L33/56 ,  H01L33/62 ,  H01L2224/48091 ,  H01L2933/0033 ,  H01L2933/005 ,  H01L2933/0066 ,  H01L2924/00014 ,  H01L2924/00

    Abstract: The present invention relates to a method for manufacturing an optical device, and to an optical device manufactured thereby, which involve using a substrate itself as a heat-dissipating plate, and adopting a substrate with vertical insulation layers formed thereon, such that electrode terminals do not have to be extruded out from a sealed space, and thus enabling the overall structure and manufacturing process for an optical device to be simplified.According to the present invention, a method for manufacturing a can package-type optical device comprises the steps of: (a) preparing a metal plate and a metal substrate with vertical insulation layers, wherein more than one vertical insulation layer crossing the substrate from the top surface to the bottom surface thereof are formed; (b) bonding the metal plate on the top surface of the metal substrate with vertical insulation layers; (c) forming a cavity on an intermediate product that has undergone step (b) in a form of a cylindrical pit having a predetermined depth reaching the surface of said metal substrate with vertical insulation layers by passing through said metal plate and the adhesive layers formed by said bonding, wherein said cavity contains said vertical insulation layer in the bottom wall thereof; (e) connecting a wire, which electrically connects an optical device and an electrode of the optical device together, to either side of the surface of the bottom wall of the vertical insulation layers of the cavity, respectively; and (g) sealing the cavity by means of a protective plate made from a light-transmitting material; and a can cap, formed as a picture frame whose top central portion and the bottom are open and encompassing the perimeter of the protective plate.

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