Polishing slurries and methods for utilizing same

    公开(公告)号:AU2006297240B2

    公开(公告)日:2009-04-09

    申请号:AU2006297240

    申请日:2006-09-29

    Abstract: A polishing slurry includes liquid medium and particulate abrasive. The particulate abrasive includes soft abrasive particles, hard abrasive particles, and colloidal silica particles, wherein the soft abrasive particles have a Mohs hardness of not greater than 8 and the hard abrasive particles have a Mohs hardness of not less than 8, and wherein the soft abrasive particles and the hard abrasive particles are present at a weight ratio of not less than 2:1.

    24.
    发明专利
    未知

    公开(公告)号:NO20082052L

    公开(公告)日:2008-04-29

    申请号:NO20082052

    申请日:2008-04-29

    Abstract: A polishing slurry includes liquid medium and particulate abrasive. The particulate abrasive includes soft abrasive particles, hard abrasive particles, and colloidal silica particles, wherein the soft abrasive particles have a Mohs hardness of not greater than 8 and the hard abrasive particles have a Mohs hardness of not less than 8, and wherein the soft abrasive particles and the hard abrasive particles are present at a weight ratio of not less than 2:1.

    26.
    发明专利
    未知

    公开(公告)号:DK1618163T3

    公开(公告)日:2007-07-02

    申请号:DK04749499

    申请日:2004-03-29

    Abstract: A method for machining a ceramic substrate containing Al, including providing a slurry between a substrate and a machine tool, the slurry containing alumina abrasive and an additive including a phosphorus compound, and moving the substrate relative to the machine tool.

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