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    21.
    发明专利
    未知

    公开(公告)号：FR2763745A1

    公开(公告)日：1998-11-27

    申请号：FR9706333

    申请日：1997-05-23

    Applicant: SEXTANT AVIONIQUE

    Inventor： LEFORT OLIVIER ,  THOMAS ISABELLE

    IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  H01L49/00

    Abstract: The invention concerns the production of machined silicon micro-sensors, in particular accelerometers for assistance to navigation in aircraft, and pressure sensors. In order to improve the production of certain active parts of the sensor, and particularly of a beam (32) forming a resonator, whereof the width and thickness characteristics should be well controlled, the method consists in: producing, by micro-machining the silicon on a first plate (30), a beam with thickness equal to the required final thickness, said beam being coated on its top surface with a mask defining the required final width; assembling the plate (30) with another (10); oxidising the two surfaces of the beam to coat them with a thin protective layer; removing, by vertical directional etching, said thin protective layer on the top surface without removing the mask already there; working on the silicon in the zone exposed by the previous operation, using vertical directional etching on the top surface, until all the part of the beam not protected by the mask is eliminated thereby producing the beam with the required width.

    22.
    发明专利
    未知

    公开(公告)号：DE69305880T2

    公开(公告)日：1997-06-12

    申请号：DE69305880

    申请日：1993-02-16

    Applicant: SEXTANT AVIONIQUE

    Inventor： THOMAS ISABELLE ,  LEFORT PIERRE-OLIVIER

    IPC: G01L9/00

    Abstract: The present invention relates to a pressure microsensor consisting of a stack of three silicon wafers in contact, by their periphery, with the interposition of an insulating layer to define an internal cavity. The lower wafer (2) comprises a thinned region (21) forming a diaphragm, on the side of its inner face. The central wafer (1) comprises a peripheral region (11) forming a frame which is solidly attached to the upper and lower wafers by means of a silicon oxide layer (24, 25), a first contact area (13) mounted on the thinned region of the lower wafer, a second contact area (14) mounted on a thick region of the lower wafer, and a silicon reed (blade) (15) forming a resonator arranged between the upper faces of the first and second contact areas opposite the upper wafer (3). A first electrode (32) is connected to the upper wafer, a second electrode (33) to the frame and a third electrode (31) to the second contact area. … …

    23.
    发明专利
    未知

    公开(公告)号：FR2737610A1

    公开(公告)日：1997-02-07

    申请号：FR9509366

    申请日：1995-08-01

    Applicant: SEXTANT AVIONIQUE

    Inventor： THOMAS ISABELLE ,  GIROUD PIERRE

    IPC: G01L9/00 ,  G01P15/08 ,  H01L49/02

    Abstract: A capacitive microsensor with a sandwich of three silicon wafers (1, 2, 3) where each surface of a frame-like region of the central wafer is attached to the facing surface of each outer wafer via a thin film forming an insulating strip (5, 6). The insulating strips have surface recesses that reduce the stray capacitances of the microsensor. Said microsensor may be used as a pressure sensor or an acceleration sensor.

    25.
    发明专利
    未知

    公开(公告)号：DE69104430D1

    公开(公告)日：1994-11-10

    申请号：DE69104430

    申请日：1991-07-16

    Applicant: SEXTANT AVIONIQUE

    Inventor： THOMAS ISABELLE ,  LEFORT PIERRE OLIVIER

    IPC: G01L19/00 ,  G01L9/00 ,  H01L29/84

    Abstract: The present invention relates to a micro-pressure-sensor comprising, between two plates of insulating material: a lower silicon plate (3) forming a base plate; a middle silicon plate (2) constituting a membrane (11) surrounded by a frame (12), a first part (15) of a stud being formed in an off-centre location of the membrane; and an upper silicon plate (1) comprising a frame (17) corresponding to that of the middle plate, a second part (16) of the stud and a silicon leaf (18) constituting a resonator linking the top of the stud to an upper region of the frame. A measurement gap (13) is formed between the membrane and the lower plate, this gap comprising an access (14, 28), and the two insulating plates (4, 5) interacting with the periphery of the three silicon plates assembled so as to define a closed housing. … …

    27.
    发明专利
    未知

    公开(公告)号：NO995731D0

    公开(公告)日：1999-11-22

    申请号：NO995731

    申请日：1999-11-22

    Applicant: SEXTANT AVIONIQUE

    Inventor： LEFORT OLIVIER ,  THOMAS ISABELLE

    IPC: B81B3/00 ,  B81C1/00 ,  G01P15/08 ,  G01P15/125 ,  H01L

    Abstract: A process for the production of microsensors machined in silicon, and in particular accelerometers for applications of assisting with navigation in aircraft, and pressure sensors. In order to improve the production of certain active parts of the sensor, and in particular of a beam forming a resonator, which needs to have well-controlled width and thickness characteristics, the following procedure is adopted. A beam having a thickness equal to the desired final thickness, and a width greater than the desired final width, is produced by micromachining the silicon on a first plate, the beam being covered on its upper face by a mask defining the desired final width. The plate is assembled with another plate. The two faces of the beam are oxidized in order to cover them with a thin protective layer. The thin protective layer on the upper face is removed, by vertical directional etching, without removing the mask already present. The silicon in the area exposed by the preceding operation is attacked by a vertical directional etch on the upper face, until the entire part of the beam not protected by the mask is eliminated, and the beam having the desired width is thus formed.

    29.
    发明专利
    未知

    公开(公告)号：FR2763694A1

    公开(公告)日：1998-11-27

    申请号：FR9706332

    申请日：1997-05-23

    Applicant: SEXTANT AVIONIQUE

    Inventor： LEFORT OLIVIER ,  THOMAS ISABELLE

    IPC: G01P1/00 ,  G01P1/02 ,  G01P15/097 ,  G01P15/10 ,  G01P15/125

    Abstract: The invention concerns a micro-accelerometer characterised in that: it comprises three micro-machined silicon plates (10, 20, 30), welded superposed with inserted insulating layers (15, 25); the middle plate (30) comprises a subassembly (36) sensitive to accelerations, and a peripheral frame (35) electrically insulated from the subassembly and enclosing it; said frame (35) forms a spacer between a bottom plate (10) and a top plate (20) from which it is likewise electrically insulated; the subassembly comprises a leg (37) fixed on the bottom plate (10) and a protruding seismic weight (31) hanging from the leg, an electrical connection being provided between the bottom plate and the subassembly leg; the suspension of the seismic weight comprises a central vibrating beam (32) connected to the seismic weight and to the leg and substantially located in the seismic weight top surface horizontal plane and two short suspending side arms (33) connected to the leg (37) and located on either side of the central beam (32) but in a horizontal plane substantially passing through the seismic weight centre of gravity. The invention is applicable to an aircraft micro-accelerometer for inertia navigation assistance.

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