公开(公告)号：WO2011059806A1

公开(公告)日：2011-05-19

申请号：PCT/US2010/054682

申请日：2010-10-29

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

Inventor： KOSOWSKY, Lex

IPC: C25D5/48

CPC classification number: C25D5/022 ,  C25D5/54 ,  H05K1/0373 ,  H05K3/07 ,  H05K3/107 ,  H05K3/188 ,  H05K2201/0191 ,  H05K2201/0215 ,  H05K2201/0738 ,  H05K2201/09036 ,  H05K2203/1492

Abstract: Systems and methods include depositing one or more materials on a voltage switchable dielectric material. In certain aspects, a voltage switchable dielectric material is disposed on a conductive backplane. In some embodiments, a voltage switchable dielectric material includes regions having different characteristic voltages associated with deposition thereon. Some embodiments include masking, and may include the use of a removable contact mask. Certain embodiments include electrografting. Some embodiments include an intermediate layer disposed between two layers.

Abstract translation: 系统和方法包括在电压可切换介电材料上沉积一种或多种材料。 在某些方面，电压可切换介电材料设置在导电背板上。 在一些实施例中，电压可切换介电材料包括具有与其上的沉积相关联的不同特征电压的区域。 一些实施例包括掩模，并且可以包括使用可移除的接触掩模。 某些实施例包括电接枝。 一些实施例包括设置在两层之间的中间层。

公开(公告)号：WO2010053846A1

公开(公告)日：2010-05-14

申请号：PCT/US2009/062844

申请日：2009-10-30

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert ,  SHI, Ning

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  SHI, Ning

IPC: H01C7/12

CPC classification number: H01C7/12 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/115 ,  H05K1/167 ,  H05K2201/0738 ,  H05K2201/09736 ,  H05K2201/09781

Abstract: A substrate device includes a layer of non-linear resistive transient protective material and a plurality of conductive elements that form part of a conductive layer. The conductive elements include a pair of electrodes that are spaced by a gap, but which electrically interconnect when the transient protective material is conductive. The substrate includes features to linearize a transient electrical path that is formed across the gap.

Abstract translation: 衬底装置包括形成导电层的一部分的非线性电阻性瞬态保护材料层和多个导电元件。 导电元件包括​​一对间隔开的电极，但当瞬态保护材料是导电的时，它们进行电互连。 衬底包括使跨越间隙形成的瞬态电路线性化的特征。

公开(公告)号：WO2010021998A1

公开(公告)日：2010-02-25

申请号：PCT/US2009/054062

申请日：2009-08-17

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H05K1/02

CPC classification number: H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K3/4688 ,  H05K2201/0738 ,  H05K2201/09318 ,  Y10T428/24802 ,  Y10T428/31504

Abstract: A core layer structure is provided for substrate and packed devices. The core layer structure includes a first layer, a second layer combined with the first layer. A layer of voltage switchable dielectric (VSD) material provided in between the first layer and second layer.

Abstract translation: 为基板和打包装置提供芯层结构。 芯层结构包括第一层，与第一层结合的第二层。 设置在第一层和第二层之间的可变压电介质层（VSD）层。

公开(公告)号：WO2008036423A3

公开(公告)日：2008-03-27

申请号：PCT/US2007/020682

申请日：2007-09-24

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex ,  FLEMING, Robert

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H01L29/12

Abstract: Formulations for voltage switchable dielectric materials include two or more different types of semiconductive materials uniformly dispersed within a dielectric matrix material. The semiconductive materials are selected to have different bandgap energies in order to provide the voltage switchable dielectric material with a stepped voltage response. The semiconductive materials can comprise inorganic particles, organic particles, or an organic material that is soluble in, or miscible with, the dielectric matrix material. Formulations optionally can also include electrically conductive materials. At least one of the conductive or semiconductive materials in a formulation can comprise particles characterized by an aspect ratio of at least 3 or greater.

公开(公告)号：WO2008016859A1

公开(公告)日：2008-02-07

申请号：PCT/US2007/074677

申请日：2007-07-29

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY, Lex ,  FLEMING, Robert

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H01B1/24 ,  H01B1/22

CPC classification number: H01B1/24 ,  H01L51/0037 ,  H01L51/0081

Abstract: A composition of voltage switchable dielectric (VSD) material that utilizes semi-conductive or conductive materials that have a relatively high aspect ratio for purpose of enhancing mechanical and electrical characteristics of the VSD material.

Abstract translation: 使用具有较高纵横比的半导体或导电材料的可变压电介质（VSD）材料的组合物，用于增强VSD材料的机械和电气特性。

公开(公告)号：WO2008016858A1

公开(公告)日：2008-02-07

申请号：PCT/US2007/074676

申请日：2007-07-29

Applicant: SHOCKING TECHNOLOGIES INC ,  KOSOWSKY, Lex ,  FLEMING, Robert

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H01B1/24

CPC classification number: H01B1/24 ,  H01L51/0037 ,  H01L51/0081

Abstract: One or more embodiments provide for a composition that includes (i) organic material that is conductive or semi-conductive, and (ii) conductor and/or semiconductor particles other than the organic material. The organic material and the conductor and/or semiconductor particles are combined to provide the composition with a characteristic of being (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of the voltage exceeding the characteristic voltage level.

Abstract translation: 一种或多种实施方式提供了一种组合物，其包含（i）导电或半导电的有机材料，和（ii）除有机材料以外的导体和/或半导体颗粒。 将有机材料和导体和/或半导体颗粒结合起来，为组合物提供以下特性：（i）在没有超过特征电压电平的电压时为电介质，和（ii）施加超过 特征电压水平。

公开(公告)号：WO2007062122A2

公开(公告)日：2007-05-31

申请号：PCT/US2006/045206

申请日：2006-11-21

Applicant: SHOCKING TECHNOLOGIES, INC. ,  KOSOWSKY, Lex

Inventor： KOSOWSKY, Lex

IPC: H01L23/495

CPC classification number: H01L23/60 ,  H01L21/563 ,  H01L23/3128 ,  H01L23/62 ,  H01L24/11 ,  H01L24/13 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/1132 ,  H01L2224/13099 ,  H01L2224/131 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/274 ,  H01L2224/32013 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73204 ,  H01L2224/73265 ,  H01L2224/81801 ,  H01L2224/83102 ,  H01L2224/8592 ,  H01L2224/92125 ,  H01L2924/0001 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/15183 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: Semiconductor devices are provided that employ voltage switchable materials for over-voltage protection. In various implementations, the voltage switchable materials are substituted for conventional die attach adhesives, underfill layers, and encapsulants. While the voltage switchable material normally functions as a dielectric cmaterial, during an over-voltage event the voltage switchable material becomes electrically conductive and can conduct electricity to ground. Accordingly, the voltage switchable material is in contact with a path to ground such as a grounded trace on a substrate, or a grounded solder ball in a flip-chip package.

Abstract translation: 提供了使用用于过电压保护的可切换电压材料的半导体器件。 在各种实施方案中，电压可切换材料代替常规的芯片附着粘合剂，底部填充层和密封剂。 虽然电压可切换材料通常用作电介质材料，但在过电压事件期间，电压可切换材料变得导电并且可以将电导向地电。 因此，电压可切换材料与衬底上的接地迹线或倒装芯片封装中的接地焊球接地。

公开(公告)号：EP2257979A1

公开(公告)日：2010-12-08

申请号：EP09724188.9

申请日：2009-03-26

Applicant: Shocking Technologies Inc

Inventor： FLEMING, Robert ,  KOSOWSKY, Lex ,  SHI, Ning ,  WU, Junjun

IPC: H01L27/02 ,  H01B1/20

CPC classification number: H01B1/22 ,  H01L23/60 ,  H01L27/0248 ,  H01L27/101 ,  H01L2924/0002 ,  H01L2924/12044 ,  H01L2924/00

Abstract: A composition is provided that includes a polymer binder, and one or more classes of particle constituents. At least one class of particle constituents includes semiconductive particles that individually have a band gap that is no greater than 2 eV. As VSD material, the composition is (i) dielectric in absence of a voltage that exceeds a characteristic voltage level, and (ii) conductive with application of said voltage that exceeds the characteristic voltage level.

公开(公告)号：EP2191043A1

公开(公告)日：2010-06-02

申请号：EP08798196.5

申请日：2008-08-19

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert ,  WU, Junjun

IPC: C25B9/00 ,  G06F19/00

CPC classification number: H01C7/1013 ,  B82Y10/00 ,  H01C7/105 ,  H05K1/0257 ,  H05K1/0259 ,  H05K1/0373 ,  H05K1/167 ,  H05K2201/0218 ,  H05K2201/0248 ,  H05K2201/026 ,  H05K2201/0738 ,  H05K2203/105

Abstract: Embodiments described herein provide for a composition of voltage switchable dielectric (VSD) material that includes a concentration of modified high-aspect ratio (HAR) particles. In an embodiment, at least a portion of the concentration includes HAR particles are surface-modified to provide core-shell HAR particles. As an alternative or addition, a portion of the concentration includes HAR particles that are surface-modified to have activated surfaces.

公开(公告)号：EP2084748A2

公开(公告)日：2009-08-05

申请号：EP07838813.9

申请日：2007-09-24

Applicant: Shocking Technologies Inc

Inventor： KOSOWSKY, Lex ,  FLEMING, Robert

IPC: H01L29/12

CPC classification number: H01L21/02118 ,  B82Y30/00 ,  H01C7/12 ,  H01L21/02112 ,  H01L21/02126 ,  H01L21/02167 ,  H01L21/02175 ,  H01L21/312 ,  H01L21/3148 ,  H01L21/318 ,  Y10S438/90

Abstract: Formulations for voltage switchable dielectric materials include two or more different types of semiconductive materials uniformly dispersed within a dielectric matrix material. The semiconductive materials are selected to have different bandgap energies in order to provide the voltage switchable dielectric material with a stepped voltage response. The semiconductive materials can comprise inorganic particles, organic particles, or an organic material that is soluble in, or miscible with, the dielectric matrix material. Formulations optionally can also include electrically conductive materials. At least one of the conductive or semiconductive materials in a formulation can comprise particles characterized by an aspect ratio of at least 3 or greater.