中科微点-全球专利检索

  1. Login
  2. Sign Up

Search Results

65 records (took 0.024 seconds)

    MIXER
    21.
    发明专利
    MIXER 失效

    公开(公告)号：JPS56166927A

    公开(公告)日：1981-12-22

    申请号：JP6900680

    申请日：1980-05-26

    Applicant: SHOWA DENKO KK

    Inventor： SAEDA SHIGERU ,  SUSAKA YUKINORI

    IPC: B29B7/00 ,  B01F7/08 ,  B29B7/14 ,  B29B7/42 ,  B29B7/80 ,  B29B9/00

    Abstract: PURPOSE:To obtain a mixer capable of uniformly mixing a synthetic resin and a filler, etc., by using a structure in which mixers with a compression part and a throttled part, having a particularly designated maximum opening sectional area to minimum opening sectional area ratio and also the said throttled part whose minimum opening sectional area is designated to less than a given value, are provided in a cut-in manner in the thread of a screw. CONSTITUTION:In the thread 3 of a screw 2 provided in the extruder barrel 1 of a mixer, an adequate number of mixers 4 and 5 consisting of a compression part 8 and a throttled part 9 are provided in a cut-in manner circumferentially. And, the ratio of the sectional area, or maximum opening sectional area S1, of the port of the compression part of the mixers 4 and 5 to the minimum opening sectional area S2 of the throttled part 9 is set up to S1/S2=5 or more, particularly 10 or more, and also the sectional area S2 is set up to 10mm. or less, particularly 3-0.001mm. . Thus, a high-viscous component 6, for example, can be torn and finely divided through the throttled part 9 and then mixed uniformly with a low-viscous component. Also, the mixer can be effectively used even in the mixing of system having low compatibility, i.e., liable to phase separation.

    SOLDER PASTE
    25.
    发明专利
    SOLDER PASTE 失效

    公开(公告)号：JPH11197879A

    公开(公告)日：1999-07-27

    申请号：JP2149798

    申请日：1998-01-19

    Applicant: SHOWA DENKO KK

    Inventor： SAEDA SHIGERU ,  AMITA HITOSHI ,  TAGUCHI ISAMU

    IPC: B23K35/22 ,  B01J27/138 ,  B01J31/02 ,  B01J31/04 ,  B23K35/26 ,  B23K35/363 ,  H05K3/34

    Abstract: PROBLEM TO BE SOLVED: To prevent solder from being oxidized, to suppress the reaction with flux promoting the degradation of the solder powder and to improve the preservation stability by blending, as an activating agent, at least one kind of an organic acid ester generating an acid to be decomposed and an ester decomposing catalyst. SOLUTION: Preservation stability and solderability are made compatible by using a compound as an activating agent which is stable maintaining an ester morphology during the preservation and is decomposed first at the time of reaching a reflow temp. to generate an acid. As one example of such an ester, there are organic acid esters of various aliphatic carboxyl esters and sulfonate esters. Since these decomposable esters are low in decomposability at the reflow temp. for itself, the addition of an ester decomposing catalyst in a small amount is effective for promoting the further decomposition. As the ester decomposing catalyst, a series of compounds of an organic acid, a hydroacid halide salt of an organic base and further, called as well as a Lewis acid are effective.

    SOLDER PASTE
    26.
    发明专利
    SOLDER PASTE 失效

    公开(公告)号：JPH10128573A

    公开(公告)日：1998-05-19

    申请号：JP30086396

    申请日：1996-10-28

    Applicant: SHOWA DENKO KK

    Inventor： SAEDA SHIGERU ,  SAKURAI TETSURO ,  TAGUCHI ISAMU ,  UTSUNOMIYA MASAHIDE

    IPC: B23K35/22 ,  B23K35/363 ,  C09J11/06 ,  C09J201/04

    Abstract: PROBLEM TO BE SOLVED: To provide a solder paste in which the organic halide compound to be blended to improve the solder wettability is sufficiently decomposed under the reflow condition without generating any ionic halogen, the performance as the solder paste is kept, and further the solder wettability is kept in a excellent condition, and the reliability of the product is excellent for a long time even without any cleaning. SOLUTION: In the solder paste in which the organic halide compound is blended as the activator, the flux in which 0.005-2.0wt.% polymer containing at least one of polyethylene glycol, poly-N-vinyl acetamide and poly-acrylic acid having the complex forming ability to the metal is added to the total weight of the flux, is blended.

    OPTICAL ELEMENT MADE OF SYNTHETIC RESIN
    27.
    发明专利
    OPTICAL ELEMENT MADE OF SYNTHETIC RESIN 失效

    公开(公告)号：JPS63234032A

    公开(公告)日：1988-09-29

    申请号：JP6580787

    申请日：1987-03-23

    Applicant: SHOWA DENKO KK

    Inventor： ASUKE TETSUYA ,  SAEDA SHIGERU ,  TAKENOSHITA YOUICHIROU ,  YOSHIDA HARUO

    IPC: G02B1/04 ,  C08G75/02 ,  C08G75/04

    Abstract: PURPOSE:To obtain the titled element having highly balanced optical strain, optical unevenness, light transmittance, refractive index, heat-resistance, impact resistance, etc., by mixing a specific polymerizable monomer with a thiol compound at a specific ratio and hardening the mixture. CONSTITUTION:(A) A polymerizable monomer of formula (A is organic group; R -R are H or 1-8C alkyl; m is 1-7) [e.g. methyl (meth)acrylate] is mixed with (B) a thiol compound of formula (B)-(SH)n (B is organic group; n is 1-7) (e.g. ethanedithiol). The sum of the number (m) of vinyl groups in the component A and the number (n) of mercapto groups in the component B (m+n) is 3-8 and the ratio of the molar number of the vinyl group in the component A to the molar number of the mercapto group in the component B is 1.4-4. The mixture is hardened usually by cast polymerization process to obtain the objective element.

    Preparation of fine thermoplastic resin particle
    28.
    发明专利
    Preparation of fine thermoplastic resin particle 失效
    精细热塑性树脂颗粒的制备

    公开(公告)号：JPS6131435A

    公开(公告)日：1986-02-13

    申请号：JP15048384

    申请日：1984-07-21

    Applicant: Showa Denko Kk

    Inventor： KUSHIBIKI NOBUO ,  KAI TAKASHI ,  SAEDA SHIGERU

    IPC: C08J3/16

    Abstract: PURPOSE: To control the particle diameter and viscosity distribution and obtain dense spherical fine particles, by mixing a specific medium compound with a thermoplastic resin, adding an EO-PO block copolymer thereto, dispersing the copolymer in the melt state, and the cooling and solidifying the dispersion, and separating the particles.
    CONSTITUTION: A compound expressed by the formula R-(OCH
    2 XH
    2 )-OR' (R and R' and H or 1W12C branched chain alkyl; n is ≥20) is used as a medium compound, and a thermoplastic resin is mixed therewith. A kind of block copolymer consisting of ethylene oxide and propylene oxide is added thereto, and the mixture is mixed and agitated at the melting point or the softening point or above of the respective components to form a dispersion system of the respective components in the melt state. The resultant dispersion system is then cooled to the solidifying point of the thermoplastic resin or below, solidified and separated. An EO-Po block copolymer having 50:50W97:3 weight ratio between the ethylene oxide and propylene oxide is used as the EO-PO block copolymer.
    COPYRIGHT: (C)1986,JPO&Japio

    Abstract translation: 目的：为了控制粒径和粘度分布，并获得致密的球形细颗粒，通过将特定介质化合物与热塑性树脂混合，向其中加入EO-PO嵌段共聚物，将共聚物分散在熔融状态，并冷却和固化 分散体，分离颗粒。 构成：将式R-（OCH 2 XH 2）-OR'（R和R'，H或1-12C支链烷基; n = 20）表示的化合物用作介质化合物，并将热塑性树脂混合 随之而来。 向其中加入一种由环氧乙烷和环氧丙烷组成的嵌段共聚物，并将混合物在各组分的熔点或软化点或以上混合并搅拌形成熔融状态的各组分的分散体系 。 然后将得到的分散体系冷却至热塑性树脂的凝固点以下，固化分离。 使用环氧乙烷与环氧丙烷之间的重量比为50:50-97:3的EO-Po嵌段共聚物作为EO-PO嵌段共聚物。

    PREPARATION OF POLYAMIDE RESIN PARTICLES
    29.
    发明专利
    PREPARATION OF POLYAMIDE RESIN PARTICLES 失效

    公开(公告)号：JPS60197734A

    公开(公告)日：1985-10-07

    申请号：JP5235684

    申请日：1984-03-21

    Applicant: SHOWA DENKO KK

    Inventor： KAI TAKASHI ,  KUSHIBIKI NOBUO ,  SAEDA SHIGERU

    IPC: C08J3/16

    Abstract: PURPOSE:To provide the titled resin particles in a perfectly spherical form, having a narrow particle size distribution, by dispersing a polyamide resin in a particular medium contg. an anionic surfactant by heating, followed by separating. CONSTITUTION:A polyamide resin (A) (e.g., nylon 6), a medium (B) of the formula (wherein R, R' are H, 1-12C straight-chain or branched alkyl; R'' is H, CH3, C2H5; n is 20 or more) having a MW of 900-1,000,000 (e.g., polyoxyethylene), and 0.1-40% one or more anionic surfactants (C) based on said polyamide resin are mixed with stirring at a temp. of at least the m.p. or softening point of components A and B to disperse well, and then cooled to a temp. of at most the m.p. of the component A and at least the m.p. or softening point of the component B. Then, the component A is separated from the component B, etc. by procedures such as filtering and, if necessary, the component B is completely removed by washing with water or low-boiling org. compds., yielding the titled resin particles.

Patent Agency Ranking