公开(公告)号：JPH0685227B2

公开(公告)日：1994-10-26

申请号：JP28278392

申请日：1992-10-21

Applicant: SONY CORP

Inventor： ISHIDA TOMOYUKI ,  AIDA YOSHIMASA ,  OOIKAMI HIROSHI

IPC: G11B7/09

公开(公告)号：JPS58140707A

公开(公告)日：1983-08-20

申请号：JP2226782

申请日：1982-02-15

Applicant: SONY CORP

Inventor： HAMADA KENICHI ,  AIDA YOSHIMASA

IPC: G03B5/00 ,  G02B7/105

Abstract: PURPOSE:To make a zoom lens easy to operate by providing engaging means for moving a relay lens group in the position beyond the focusing area with respect to a focusing ring and enabling the focusing operation from infinity to macro by means of the focusing ring. CONSTITUTION:A macro cam groove 22 is provided with respect to a focusing ring 4, and the preceding end of a micro interlocking shaft 23 is engaged therein. The rear end of the shaft 23 is connected to a relay lens frame 15, and is so formed as to move the frame 15 forward and backward. The groove 22 is formed in parallel with a focusing cam groove 21 in a focusing area W3 and the forward and backward movements of a relay lens group 14 by turning of the ring 4 is obviated. The cam 21 does not take a lead in the range of a macro focusing area W2 and a lead is formed in the cam 22; therefore, a focusing lens group 11 does not move back and forth with respect to the turning of the ring 4 in the W2, but the shaft 23 retreats and a relay lens group 14 retreats.

公开(公告)号：JP2005322343A

公开(公告)日：2005-11-17

申请号：JP2004140465

申请日：2004-05-10

Applicant: Sony Corp ,  ソニー株式会社

Inventor： AIDA YOSHIMASA ,  SHIBATA KEIICHI ,  ABE TSUGUHIRO ,  UENO MITSUHIRO

IPC: G11B7/135

Abstract: PROBLEM TO BE SOLVED: To attain the shortening of an optical path length of an optical system while evading an interference with an actuator holding an objective lens. SOLUTION: This optical pickup is provided with: a light emitting element 31 for emitting optical beams in parallel with the face direction of an optical disk 3; an erecting mirror 33 for erecting the optical beams which are emitted from the light emitting element 31, in the direction vertical to the face direction of the optical disk 3; the objective lens 4 for converging the optical beams which are erected at right angle with the face direction of the optical disk 3 by the erecting mirror 33, on a signal recording surface of the optical disk 3 while being supported with the actuator 5 driven to the tracking direction and focusing direction of the optical disk 3; and the collimator lens 34 prepared between the objective lens 4 and the erecting mirror 33 to make the optical beams almost parallel. COPYRIGHT: (C)2006,JPO&NCIPI

Abstract translation: 要解决的问题：为了在避免与保持物镜的致动器的干扰的同时缩短光学系统的光程长度。 解决方案：该光学拾取器设置有：用于发射与光盘3的面方向平行的光束的发光元件31; 在与光盘3的面方向垂直的方向上竖立从发光元件31射出的光束的立体镜33; 用于通过直立镜33将与光盘3的面方向成直角立起的光束会聚在光盘3的信号记录表面上的物镜4，同时被驱动到驱动器5的致动器5支撑 光盘3的跟踪方向和聚焦方向; 准直透镜34准备在物镜4和立体镜33之间，以使光束几乎平行。 版权所有（C）2006，JPO＆NCIPI

公开(公告)号：JP2003308622A

公开(公告)日：2003-10-31

申请号：JP2002107417

申请日：2002-04-10

Applicant: Sony Corp ,  ソニー株式会社

Inventor： AIDA YOSHIMASA ,  KUSANO MIKA

IPC: G11B7/09 ,  G11B7/12 ,  G11B7/22

Abstract: PROBLEM TO BE SOLVED: To provide an optical head advantageous in reducing a size and cost and a recording and reproducing device, and a method for manufacturing the optical head.
SOLUTION: The optical head 104 is provided with a holding member 20, a first lead wire member 30, a second lead wire member 40, and a supporting member 50 in addition to a housing 10 for housing an objective lens 2, half-wave plate 2A, light source 1002, photodetector 1004, light separating means 1006, and processing circuit 1008. The holding member 20 is so supported as to be made movable in a direction parallel with the optical axis of the objective lens 2 and a direction orthogonal with the optical axis while maintaining the parallel state of the optical axis of the objective lens 2 with respect to the housing 10 by means of the first and second lead wire members 30 and 40 and the supporting member 50.
COPYRIGHT: (C)2004,JPO

Abstract translation: 要解决的问题：提供有利于减小尺寸和成本的光学头以及记录和再现装置，以及用于制造光学头的方法。 解决方案：除了用于容纳物镜2的壳体10之外，光学头104还设置有保持构件20，第一引线构件30，第二引线构件40和支撑构件50，半 波片2A，光源1002，光电检测器1004，光分离装置1006和处理电路1008.保持构件20被支撑为能够在与物镜2的光轴平行的方向上移动，并且方向 同时通过第一和第二引线构件30和40以及支撑构件50保持物镜2的光轴相对于壳体10的平行状态。版权所有（（ C）2004，JPO

公开(公告)号：JP2001264667A

公开(公告)日：2001-09-26

申请号：JP2000072576

申请日：2000-03-15

Applicant: SONY CORP

Inventor： AIZAWA HIDEKUNI ,  AIDA YOSHIMASA

IPC: G02B26/10 ,  B60R21/00 ,  G06K7/10 ,  G07G1/00 ,  H01L31/12 ,  H01R4/02 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide the optical scanning device which can realize the miniaturization of the whole device, the weight saving and the low power consumption. SOLUTION: A moving part 14 is supported by an oscillating shaft 13 of a fixing part 12, and a light-emitting part 15 and a light receiving part 16 are disposed along an axis line of the oscillating shaft 13 on an upper surface of the moving part 14. The alternating current is supplied to a coil 20 provided in the moving part 14, the moving part 14 is made to oscillate in a prescribed period around the oscillating shaft 13 by the electromagnetic force which the coil 20 receives from a magnetic circuit consisting of a yoke 18 on the fixing part 12 and a permanent magnet 19. A laser beam L emitted from the light- emitting part 15 scans a bar code 4 and reads the bar code 4 in response to a reflected light L' by the light receiving part. By this configuration, the miniaturization of the device, the weight saving and the low power consumption are realized while preventing deterioration in receiving efficiency.

公开(公告)号：JP2000022046A

公开(公告)日：2000-01-21

申请号：JP18674298

申请日：1998-07-02

Applicant: SONY CORP

Inventor： AIDA YOSHIMASA

IPC: H01L23/28 ,  H01L23/12

Abstract: PROBLEM TO BE SOLVED: To provide a semiconductor device which can be easily and accurately positioned and mounted, and further provide a manufacturing method thereof. SOLUTION: A semiconductor device 1 is equipped with a semiconductor element 10 mounted on one surface of a board 2, ball electrodes 11 formed in an array on the other surface of the board 2, a molding resin 3 which seals up the semiconductor element 10, and positioning pins 4 provided to the other surface of the board 2 in one piece with the molding resin 3. A method of manufacturing a semiconductor device 1 comprises a process where the semiconductor element 10 is mounted on one surface of the board 2 and a process where the semiconductor element 10 is sealed up with molding resin 3 on the one surface of the board 2 and positioning pins 4 are formed on the other surface of the board 2 integrally with the molding resin 3.

公开(公告)号：JPH10214914A

公开(公告)日：1998-08-11

申请号：JP1421697

申请日：1997-01-28

Applicant: SONY CORP

Inventor： AIDA YOSHIMASA

IPC: H01L23/12 ,  H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a BGA package and its manufacture which are not damaged by handling a package in inspecting, cleaning, retrying solder balls and, at the same time, which can make solder balls to be easily mounted on a substrate and easily and accurately positioned on the substrate. SOLUTION: In a BGA package A in which many solder balls 16 are attached to one surface of a substrate 10 carrying a semiconductor device 12 coated with a molding resin 17 on the other surface and electrically connected to the device 12, the solder balls 16 are attached to the surface of the substrate 10 through a ball mounting sheet 15 which integrally mounts the balls 16.

公开(公告)号：JP2576440B2

公开(公告)日：1997-01-29

申请号：JP30500495

申请日：1995-10-30

Applicant: SONY CORP

Inventor： AIDA YOSHIMASA

IPC: G11B7/08 ,  G11B7/09

公开(公告)号：JPH07215566A

公开(公告)日：1995-08-15

申请号：JP3652994

申请日：1994-02-08

Applicant: SONY CORP

Inventor： AIDA YOSHIMASA

IPC: G02F1/13 ,  B65H39/02 ,  G02F1/1335

Abstract: PURPOSE:To reduce the space of a positioning part and align its position accurately for easy handling by supplying a first plate member stacked on a second plate member to the positioning part in positioning while pressurizing for stacking. CONSTITUTION:In positioning operation, a color filter substrate 1 is reversed upside down by a reversal stage 57, stacked on a TFT substrate 3 of a relay stage 55 so that surfaces 101 and 301 are brought in contact with each other, the peripheral surfaces of the stacked color filter substrate 1 and the TFT substrate 3 are held by the holding part 6505 of a supply robot and carried to a lower aligner 65. In this way, a receiving and delivery mechanism of color filter substrates 1 and TFT substrates 3 to a positioning unit can be simplified as compared with the conventional mechanism in which the color filter substrates 1 and TFT substrates 3 are supplied to the upper and lower aligners 67 and 65, respectively.

公开(公告)号：JPH06230363A

公开(公告)日：1994-08-19

申请号：JP3945693

申请日：1993-02-02

Applicant: SONY CORP

Inventor： AIDA YOSHIMASA

IPC: G02F1/13 ,  G02F1/1335

Abstract: PURPOSE:To provide the inclination correction mechanism of the sticking device capable of uniformly and closely sticking two flat plates to each other without damaging these flat plates. CONSTITUTION:This inclination correction mechanism 1 of the sticking device 10 for tightly fitting the flat plate 10a mounted on a stationary base plate 11 side and the other flat plate 10b mounted on a moving base plate 12 side is provided with a stationary frame 2 on the moving base plate 12 and a moving frame 3 is mounted freely rotatably around a shaft 21 on the inner side of this stationary frame 2. A moving plate 4 to mount the flat plate 10b is mounted on the inner side of the moving frame 3 freely rotatably around another shaft 31 provided in a direction orthogonal with the shaft 21. A curshion member 5 such as a magnetic force apparatus, coil spring for maintaining the moving plate 4 approximately parallel with the moving base plate 12 are provided between the moving plate 4 and the moving base plate 12.