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公开(公告)号：JPH05218134A
公开(公告)日：1993-08-27
申请号：JP4024292
申请日：1992-01-30
Applicant: SONY CORP
Inventor： SOGO KEIKO , HAKUTA TATSUO , ASAGI OSAMU , TAWARA HIROKI
Abstract: PURPOSE:To obtain a height of a soldered part of an IC chip from a board and to improve reliability of its connection by providing a control member for controlling an interval between the chip and the board. CONSTITUTION:A plurality of balls 11 each having a predetermined diameter are placed between lands 5 of mounting parts of one IC chip 1 on a board 4, and fixed to the board 4 via adhesive 12. The chip 1 coated with solder bump 3 on electrode pad 2 is positioned on the board 4 in such a manner that the bump 3 is opposed to the land 5, and mounted on the board 4. The bump 3 reflows by heating. The chip 1 is sunk by its own weight, and brought into contact with the ball 11. Thus, the ball 1 is operates as a spacer when the bump 3 reflows, and an interval between the chip 1 and the board 4 can be controlled to a predetermined distance to be decided by the diameter of the ball 11. Accordingly, lateral spread of the soldered part is prevented, and even if a pitch between the lands 4 is narrow, generation of a bridge can be prevented.
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公开(公告)号：JPH05132366A
公开(公告)日：1993-05-28
申请号：JP31989591
申请日：1991-11-07
Applicant: SONY CORP
Inventor： ASAGI OSAMU , HAKUTA TATSUO , TAWARA HIROKI , SOGO KEIKO
IPC: C04B37/00
Abstract: PURPOSE:To enable ready regulation of the thickness of an adhesive layer by mixing solid matters having a shape dimension equal to the regulated thickness of the adhesive. CONSTITUTION:Sphere-, elliptic sphere- or rectangular prism-shaped solid matters 21 having a shape dimension equal to the regulated thickness of an adhesive layer are mixed in an adhesive 12. The adhesive 12 is applied to a space between the adherent, i.e., an IC chip 4 a base 5 and the IC chip 4 is pressed against the base 5 to obtain an adhesive having a thickness equal to the size of the solid matter 21. Thereby, the thickness of the adhesive can be readily regulated without using a spacer, etc., and heat radiation from the IC chip 4 to the base 5 is improved. At the same time, mechanical stress caused by the difference in thermal expansion coefficient can be absorbed.
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公开(公告)号：JPH05129369A
公开(公告)日：1993-05-25
申请号：JP31989691
申请日：1991-11-07
Applicant: SONY CORP
Inventor： ASAGI OSAMU , AOKI YUKIO , MIIKEDA KAORU
Abstract: PURPOSE:To make it possible to control easily the thickness of a bonding agent layer when an electronic component is adhered and mounted on a substrate via a bonding agent by a method wherein protrusion parts, which are abutted on the mounting surface of an IC chip, are formed on parts of a coating layer. CONSTITUTION:When a solder resist layer 21 is formed by a printing method or a photography method, protrusion parts 21a can be simultaneously formed integrally with the layer 21 by making their dimensional and positional accuracies high. Accordingly, a manhour is never increased. After a bonding agent 12 is applied on parts, on which the parts 21a are formed, of a substrate 5, an IC chip 4 is put on the bonding agent 12 and is pressed to the agent 12 until the chip 4 touches the parts 21a, whereby the thickness of the layer of the bonding agent 12 can be controlled in a constant state. Thereby, a heat dissipation property from the chip to the substrate is improved and at the same time, a mechanical stress due to a difference between the thermal expansion coefficients of the chip and the substrate can be absorbed.
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公开(公告)号：JPH10341065A
公开(公告)日：1998-12-22
申请号：JP14906997
申请日：1997-06-06
Applicant: SONY CORP
Inventor： ASAGI OSAMU , SATO NAOKO
Abstract: PROBLEM TO BE SOLVED: To lessen the effects of moisture absorption of a material, of which a flexible printed wiring board having reinforcing plates adhered thereto is made. SOLUTION: A flexible printed wiring board(FPC) 11 has adhesive regions 11c formed with through-holes P11, P12, P13. Rigid printed wiring boards(PWB) 12, 13 are adhered to the region 1c at the both sides of the FPC 11 with an adhesive of the identical material as that of the FPC 11, e.g. a polyimide adhesive 14 coated to sufficiently fill up the through-holes P11-P13, thereby coupling adhesive parts 14a, 14b at the both sides of the adhesive 14 via the through-holes P11-P13.
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公开(公告)号：JPH08255969A
公开(公告)日：1996-10-01
申请号：JP5903595
申请日：1995-03-17
Applicant: SONY CORP
Inventor： ASAGI OSAMU , SHIOZAWA KOICHI
Abstract: PURPOSE: To obtain a printed-circuit board device whose structure is simple and in which two kinds of solder layers in different thicknesses can be formed simultaneously. CONSTITUTION: An auxiliary layer 16 composed of a conductive layer identical to a soldering land 14a is formed around the soldering land 14a on a printed- circuit board 12, and a solder-thickness adjusting layer 20 is formed to nearly surround the soldering land 14a. Since the solder-thickness adjusting layer 20 protruding from the land 14a is formed selectively around the land, a solder layer whose thickness is comparatively thick and a solder layer thinner than that can be formed simultaneously on the same printed-circuit board by the same printing screen treatment. Thereby, since cream solder can be printed by using printing screens whose thickness is identical and which are used usually, low-cost printing screens can be utilized.
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Patent Agency Ranking
公开(公告)号：JPH08186398A
公开(公告)日：1996-07-16
申请号：JP33981194
申请日：1994-12-28
Applicant: SONY CORP
Inventor： KATADA MASAYASU , ASAGI OSAMU , KOBAYASHI KENJI , ICHIKAWA SEIJI
IPC: H05K13/08
Abstract: PURPOSE: To provide a device for collating components fitted to a printed circuit board and a component table list. CONSTITUTION: A comparison device is provided with a synthetic voice generation part 4 which receives such component attribute data as the type, polarity, and rating of components fitted to a printed circuit board based on a component table list 1 read from a component table list database 2 and generates a synthetic voice and a laser pointer 5 for indicating the position of components fitted to the printed circuit board with a visible symbol. Then, a checker 6 compares the component attribute data according to synthetic voice and the attribute data of components located at a position indicated by the laser pointer 5 and operates a sequence control part 7 to collate next components when they match, thus eliminating the need for a personal for reading the list of fitted components, eliminating any erroneous reading, and making efficient the comparison.
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公开(公告)号：JPH0858941A
公开(公告)日：1996-03-05
申请号：JP19071094
申请日：1994-08-12
Applicant: SONY CORP
Inventor： ASAGI OSAMU , ICHIKAWA SEIJI
Abstract: PURPOSE: To provide a conveying device whereby a printed board can be conveyed while maintained in a flat plate shape and also can be conveyed while correcting deformation and distortion due to heat when soldered. CONSTITUTION: A printed board conveying device is provided with a conveyer 1 arranged in a cargo loading surface by vertically providing a group of brushes 3 directed upward formed of a plurality of fine wires properly arranging height. The fine wire displays large resisting force against an axial direction load, to have a characteristics of displaying flexibility against a load having a directional component except an axial direction, and when a printed board 4 mounted with a mounting part is loaded in the group of brushes 3, the brush coming into contact with the mounting part is easily buckled, to convey the printed board 4 while maintained in a plane shape by the brush almost vertically rising to come into contact with a surface of the printed board 4.
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公开(公告)号：JPH0846341A
公开(公告)日：1996-02-16
申请号：JP17465594
申请日：1994-07-27
Applicant: SONY CORP
Inventor： ASAGI OSAMU , ICHIKAWA SEIJI
Abstract: PURPOSE:To reduce the number of working processes by a method wherein an electronic component is temporarily fixed to a circuit board with a prescribed area coated previously with a creams solder by mounting fitments made of a shape memorizing alloy, then, the electronic component is reflow-soldered to the circuit board and after that, is cooled at normal temperatures. CONSTITUTION:An electronic component 14 is mounted on a printed board 11 with a prescribed area coated previously with a cream solder in such a way that the apertures of insertion holes 12 and 16 coinside with each other and spring pins 17 are respectively made to insert in the holes 12 and 16 in the state of normal temperatures. Each spring pin 17 is made of a shape memorizing alloy that even if the alloy is deformed into a shape quite different from its memorized former shape, it is again restored to its former shape at an inverse transformation temperature or higher. After that, the component 14 is reflow-soldered on the board 11 with in a reflow furnace set at a reflow soldering temperature and is cooled at normal temperatures. Thereby, when the component 14 is mounted on the board 11, the number of working processes can be reduced.
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公开(公告)号：JPH07205398A
公开(公告)日：1995-08-08
申请号：JP552894
申请日：1994-01-24
Applicant: SONY CORP
Inventor： ASAGI OSAMU , HIRABAYASHI TSUGIO , SHIOZAWA KOICHI , ICHIKAWA SEIJI
Abstract: PURPOSE:To enhance the productivity of cream solder printing. CONSTITUTION:The squeegee material 25 moved and operated on a mask 27 is formed from an elastically deformable high hardness material having a notch 28. Therefore, when the squeegee material 25 is brought into contact with the mask 27 on a printed circuit board 26 to be pressed thereto, it is elastically deformed so as to be bent into the notch 28 corresponding to the warpage deformation of the printed circuit board 26 and, therefore, the selection of the squeegee material 25 corresponding to the warpage deformation of the printed circuit board 26 or the fine adjustment of the dimension between the squeegee material 25 and the mask 27 becomes unnecesarry in the setting of the film thickness of the cream solder 29 applied to the printed circuit board 26 to an almost uniform dimension.
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公开(公告)号：JPH07131198A
公开(公告)日：1995-05-19
申请号：JP27197693
申请日：1993-10-29
Applicant: SONY CORP
Inventor： ASAGI OSAMU , MATSUNAGA TETSUYOSHI , WATANABE HIROTO , ICHIKAWA SEIJI
Abstract: PURPOSE:To contrive the simplification of a component mounting work or the like and a shortening of a working time by a method wherein a multitude of holding bodies, which press and hold the component mounting part of a circuit board positioned at a position of a prescribed height, are constituted of holding bodies having wire materials which can be buckled. CONSTITUTION:A circuit board 17 mounted with electronic components 23 is pressed by a first back-up brush 13 and a second back-up brush 18. At this time, the board 17 is pushed up by thin wires 16, which make contact to a component mounting part A of the board 1 7, of the brush 13 and thin wires 20, which make contact to the mounting part A, of the brush 18 and these thin wires 16 and 20 are buckled by this concentrated load. In this case, thin wires other than the buckled thin wires 16 and 20 are in a state that they are erected and the load in every thin wire of these erected thin wires 16 and 20 is small. Accordingly, the board 17 can be held by component mounting surfaces 17a and 17b in a state that the surfaces 17a and 17b are parallel to a plate surface 11a.
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