公开(公告)号：JPH07249897A

公开(公告)日：1995-09-26

申请号：JP4102694

申请日：1994-03-11

Applicant: SONY CORP

Inventor： MIIKEDA KAORU ,  ASAGI OSAMU ,  OTSUJI KAZUYA ,  ATSUMI JUN

IPC: H05K13/04 ,  H01L23/36 ,  H05K7/20

Abstract: PURPOSE:To mount with high reliability even if a generated heat amount of an electronic component is increased by always automatically charging a heat dissipating material in a gap between the component and a board without excess and insufficiency irrespective of shapes and sizes of parts of the component. CONSTITUTION:A TCP 28 is sucked by a suction nozzle 25, heights of TCP leads and an IC chip bottom from a board 11 are measured by a displacement sensor 29, and a quantity of the material coating the board 1 by a dispenser 26 is decided based on a difference of the heights. Further, a falling distance of the nozzle 25 is decided according to the height of the TCP leads from the board 11.

公开(公告)号：JPH0738251A

公开(公告)日：1995-02-07

申请号：JP20097193

申请日：1993-07-21

Applicant: SONY CORP

Inventor： ATSUMI JUN ,  MIIKEDA KAORU ,  ASAGI OSAMU ,  ARAI MASATAKA

IPC: B23P21/00 ,  H05K3/30 ,  H05K3/34 ,  H05K13/04

Abstract: PURPOSE:To provide a method for mounting an electronic component on a double-sided printed board in which floating of leads at the time of solder reflowing, dropping of the component can be prevented. CONSTITUTION:QFP type semiconductor components 2, 3 are mounted on a double-sided printed board by a solder reflowing method. Four corners of a resin-molded package of the component 2 of a surface B in which reflow soldering is finished are so coated with thermosetting adhesive 4 as to enclose the four corners over a height of a top 2a of a taper formed at the time of molding. The adhesive 4 is cured at a stage of preheating the component 3 of a surface A at the time of solder reflowing, and the component 3 is held. Drop of the component 2 due to deterioration of draping of adhesive with mold release agent at the time of transfer molding adhered to a surface of a resin mold can be prevented by holding it with the adhesive 4.

公开(公告)号：JPH05129499A

公开(公告)日：1993-05-25

申请号：JP31989491

申请日：1991-11-07

Applicant: SONY CORP

Inventor： ASAGI OSAMU ,  TAWARA HIROKI ,  MIIKEDA KAORU ,  AOKI YUKIO

IPC: H01L21/60 ,  H01L23/50 ,  H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K7/20

Abstract: PURPOSE:To mount electronic components on a board in a reduced thickness and a high density and to improve heat dissipation. CONSTITUTION:An IC chip 1 is connected to a copper pattern 6 for wiring on a board 5 through TCP leads 21 by a TAB mounting method, heat conductive adhesive 32 is charged between the chip 1 and a heat dissipating copper pattern 31 formed on the board 5, and heat generated from the chip 1 is let escape to the board 5 through the adhesive 32.

公开(公告)号：JPH08108519A

公开(公告)日：1996-04-30

申请号：JP27050494

申请日：1994-10-08

Applicant: SONY CORP

Inventor： MIIKEDA KAORU ,  ASAGI OSAMU ,  EBIZUKA MORIYUKI ,  SHIOZAWA KOICHI

IPC: B41F15/44 ,  H05K1/16 ,  H05K3/12

Abstract: PURPOSE: To provide a printing squeegee adapted for solder paste printing on a high-density mounting printed board in which solder paste can be printed to a predetermined thickness to follow up the deflection of the board. CONSTITUTION: A platelike squeegee for a printer has a printing mask 6 having an opening 8 of a pattern to be printed to print solder paste 5 on a printed board 7, and solder paste using the mask arranged with the squeegee 12 on the mask 6. The squeegee 12 has a platelike high hardness elastic unit 12b formed of high hardness elastic material at the part in contact with the mask 6, a squeegee holder 13, and a platelike low hardness elastic unit 12a formed of low hardness elastic material provided between the holder 13 and the unit 12b. The unit 12b having a thickness of 1mm is adhered to the tip face of the unit 12a.

公开(公告)号：JPH03187746A

公开(公告)日：1991-08-15

申请号：JP32755589

申请日：1989-12-18

Applicant: SONY CORP

Inventor： MIIKEDA KAORU

IPC: B41F15/08 ,  B41F15/36 ,  H05K3/12 ,  H05K3/34

Abstract: PURPOSE:To perform precise printing by amending shift in printing by a method wherein a correction part which amends a relative position of a screen to a printing surface by introducing shift data to a printing mechanism according to a transfer direction of a squeegee in printing is provided. CONSTITUTION:A pattern shift detection part 51 detects shift to a copper pattern on the first substrate 10 of the substrate 10 on and after the second one based on image output of a target mark 10 with video cameras 36, 37. A printing shift detection keeping part 53 detects shift in printing of cream solder to be generated principally in a transfer direction of a squeegee 45 in printing based on outputs of the video cameras 36, 37. A correction part 52 receives data of the pattern shift detection part 51 and the printing shift detection keeping part 53 each completion of setting of a substrate 10, and deduces a correction data to be added to an initial value (X,Y,Z) to an adder 54, at that time, a directional signal L/R of the squeegee 45 is bonded to an output data of the pattern shift detection part 51 by selecting the printing shift data in the direction R and the direction L.

公开(公告)号：JPH0946040A

公开(公告)日：1997-02-14

申请号：JP21528795

申请日：1995-08-01

Applicant: SONY CORP

Inventor： ASAGI OSAMU ,  MIIKEDA KAORU ,  SHIOZAWA KOICHI ,  ICHIKAWA SEIJI

IPC: H05K3/34

Abstract: PROBLEM TO BE SOLVED: To provide a reflow soldering method, by which short-circuit defects caused by solder bridges is eliminated. SOLUTION: In reflow soldering process, a step (3), which solidifies the solder paste of a substrate on which the solder paste is printed (1) beforehand before preheating (4), is provided. The surface of the solder paste and even in the inside of the solder paste are solidified. As the method of the solidification, the solder paste is heated at the temperature where the surface of the solder paste is not fluidized and the solder paste is solidified by natural drying. As another method, the solder paste can be heated under the ventilation at the temperature where the solder paste is not fluidized and the solder paste is solidified under the pressure reduced state at the room temperature. The sagging of the solder at the preheating can be prevented by solidifying the solder paste by preheating. Therefore, the short-circuit detects caused by bridges can be prevented even in the reflow soldering of a narrow-pitched part.

公开(公告)号：JPH05129369A

公开(公告)日：1993-05-25

申请号：JP31989691

申请日：1991-11-07

Applicant: SONY CORP

Inventor： ASAGI OSAMU ,  AOKI YUKIO ,  MIIKEDA KAORU

IPC: H01L21/60 ,  H05K3/30 ,  H05K3/34

Abstract: PURPOSE:To make it possible to control easily the thickness of a bonding agent layer when an electronic component is adhered and mounted on a substrate via a bonding agent by a method wherein protrusion parts, which are abutted on the mounting surface of an IC chip, are formed on parts of a coating layer. CONSTITUTION:When a solder resist layer 21 is formed by a printing method or a photography method, protrusion parts 21a can be simultaneously formed integrally with the layer 21 by making their dimensional and positional accuracies high. Accordingly, a manhour is never increased. After a bonding agent 12 is applied on parts, on which the parts 21a are formed, of a substrate 5, an IC chip 4 is put on the bonding agent 12 and is pressed to the agent 12 until the chip 4 touches the parts 21a, whereby the thickness of the layer of the bonding agent 12 can be controlled in a constant state. Thereby, a heat dissipation property from the chip to the substrate is improved and at the same time, a mechanical stress due to a difference between the thermal expansion coefficients of the chip and the substrate can be absorbed.