公开(公告)号：AU7274001A

公开(公告)日：2002-01-30

申请号：AU7274001

申请日：2001-07-18

Applicant: SONY CORP

Inventor： IWAFUCHI TOSHIAKI ,  OOHATA TOYOHARU ,  DOI MASATO

IPC: G09F9/30 ,  G09F9/33 ,  G09F9/35 ,  H01L21/20 ,  H01L21/60 ,  H01L21/68 ,  H01L21/77 ,  H01L25/075 ,  H01L27/12 ,  H01L27/15 ,  H01L33/06 ,  H01L33/24 ,  H01L33/32 ,  H01L33/40 ,  H01L33/48 ,  G09F9/00 ,  G02F1/1362 ,  H01L27/04 ,  H01L29/78 ,  H01L33/00

Abstract: Provided are an image display unit capable of enhancing characteristics such as resolution, image quality, and luminous efficiency, facilitating formation of a large-sized screen, and reducing the production cost, and a method of producing the image display unit. The image display unit includes an array of a plurality of light emitting devices for displaying an image in response to a specific image signal, characterized in that an occupied area of each of the light emitting devices is in a range of 25 µ m 2 or more and 10,000 µ m 2 or less, and the light emitting devices are mounted on a wiring board. In mounting the devices, for example, a two-step enlarged transfer is carried out. The two-step enlarged transfer process includes a first transfer step of transferring the devices arrayed on a first substrate onto a temporarily holding member in such a manner that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, and holding the devices on the temporarily holding member, and a second transfer step of transferring the devices held on the temporarily holding member onto a second board in such a manner that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporarily holding member. Further, a light emitting device is mounted on a wiring board in such a manner that a crystal growth layer of the light emitting device, which is formed by crystal growth, is kept in a posture inverted from a posture thereof at the time of crystal growth in the direction along the normal line of the board principal plane.

公开(公告)号：DE69425050D1

公开(公告)日：2000-08-03

申请号：DE69425050

申请日：1994-12-22

Applicant: SONY CORP

Inventor： DOI MASATO ,  NARUI HIRONOBU ,  SAHARA KENJI ,  MATSUDA OSAMU

IPC: G02B6/12 ,  G02B6/42 ,  G11B7/09 ,  G11B7/12 ,  G11B7/123 ,  G11B7/125 ,  G11B7/127 ,  G11B7/13 ,  G11B7/133 ,  H01S5/026 ,  H01S5/18 ,  G11B7/135 ,  H01S5/02

Abstract: An optical device has an optical element 21 comprising a light-emitting region 1 and a light-detecting region 4 disposed closely to each other on a common substrate 9. Returning light LR from an irradiated medium which is irradiated with light L emitted by the light-emitting region 1 is detected by the light-detecting region 4. The returning light is applied to a light-detecting region 4 at an incident angle alpha in the range of 0 DEG

公开(公告)号：SG67363A1

公开(公告)日：1999-09-21

申请号：SG1996011093

申请日：1996-11-07

Applicant: SONY CORP

Inventor： NARUI HIRONOBU ,  DOI MASATO ,  SABERT HENDRIK

IPC: C30B29/66 ,  H01L21/205 ,  H01L27/15 ,  H01L31/12 ,  H01L31/036 ,  G11B7/135

Abstract: A triangular pyramidal semiconductor structure which precisely splits light is provided by preventing an unnecessary crystal plane from growing on the boundary of side surface crystal planes of the triangular pyramidal semiconductor structure. The triangular pyramidal semiconductor structure is formed of either one of a {111} A crystal plane and a {111} B crystal plane and two {110} crystal planes.

公开(公告)号：ID16077A

公开(公告)日：1997-09-04

申请号：ID963281

申请日：1996-11-11

Applicant: SONY CORP

Inventor： NARUI HIRONOBU ,  DOI MASATO

IPC: C30B29/66 ,  H01L21/205 ,  H01L27/15 ,  H01L31/12

Abstract: A triangular pyramidal semiconductor structure which precisely splits light is provided by preventing an unnecessary crystal plane from growing on the boundary of side surface crystal planes of the triangular pyramidal semiconductor structure. The triangular pyramidal semiconductor structure is formed of either one of a {111} A crystal plane and a {111} B crystal plane and two {110} crystal planes.

公开(公告)号：EP2048704A4

公开(公告)日：2013-08-07

申请号：EP07767530

申请日：2007-06-25

Applicant: SONY CORP

Inventor： TOMODA KATSUHIRO ,  DOI MASATO ,  TAKAGISHI TOSHIYA ,  KANEMITSU TOSHIAKI

IPC: H01L21/52 ,  G09F9/33 ,  H01L23/00 ,  H01L33/00 ,  H01L33/10 ,  H01L33/32 ,  H01L33/52 ,  H01L33/62 ,  H05K3/30

CPC classification number: G09F9/33 ,  H01L24/32 ,  H01L33/52 ,  H01L2224/26175 ,  H01L2224/27013 ,  H01L2224/83051 ,  H01L2224/83143 ,  H01L2224/83385 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01027 ,  H01L2924/01033 ,  H01L2924/01047 ,  H01L2924/01055 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10349 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/12043 ,  H01L2924/14 ,  H01L2924/1461 ,  H01L2924/15156 ,  H01L2924/15788 ,  H05K3/305 ,  H01L2924/00

公开(公告)号：EP1294028A4

公开(公告)日：2009-04-01

申请号：EP02711454

申请日：2002-02-12

Applicant: SONY CORP

Inventor： DOI MASATO ,  OKUYAMA HIROYUKI ,  BIWA GOSHI ,  OOHATA TOYOHARU

IPC: H01L33/10 ,  H01L33/32 ,  H01L33/40 ,  H01L33/00

CPC classification number: H01L33/405 ,  H01L33/32

Abstract: In a semiconductor light emitting device configured to extract light through a substrate thereof, an electrode layer is formed on a p-type semiconductor layer (such as p-type GaN layer) formed on an active layer, and a nickel layer is formed as a contact metal layer between the electrode layer and the p-type semiconductor layer and adjusted in thickness not to exceed the intrusion length of light generated in the active layer. Since the nickel layer is sufficiently thin, reflection efficiency can be enhanced.

公开(公告)号：EP1310934A4

公开(公告)日：2009-03-11

申请号：EP01951901

申请日：2001-07-18

Applicant: SONY CORP

Inventor： IWAFUCHI TOSHIAKI ,  OOHATA TOYOHARU ,  DOI MASATO

IPC: G09F9/30 ,  G09F9/33 ,  G09F9/35 ,  H01L21/20 ,  H01L21/60 ,  H01L21/68 ,  H01L21/77 ,  H01L25/075 ,  H01L27/12 ,  H01L27/15 ,  H01L33/06 ,  H01L33/24 ,  H01L33/32 ,  H01L33/40 ,  H01L33/48 ,  G02F1/1362 ,  G09F9/00 ,  H01L27/04 ,  H01L29/78 ,  H01L33/00

CPC classification number: H01L24/18 ,  G02F2001/13613 ,  H01L21/2007 ,  H01L21/568 ,  H01L21/6835 ,  H01L24/16 ,  H01L24/81 ,  H01L24/82 ,  H01L25/0753 ,  H01L27/12 ,  H01L27/1214 ,  H01L27/1266 ,  H01L27/156 ,  H01L33/0079 ,  H01L33/0095 ,  H01L33/24 ,  H01L2221/6835 ,  H01L2221/68354 ,  H01L2221/68359 ,  H01L2221/68368 ,  H01L2224/04105 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2224/16245 ,  H01L2224/18 ,  H01L2224/32225 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/73267 ,  H01L2224/81001 ,  H01L2224/81136 ,  H01L2224/92244 ,  H01L2924/00014 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01023 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01074 ,  H01L2924/01075 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01087 ,  H01L2924/014 ,  H01L2924/10329 ,  H01L2924/12036 ,  H01L2924/12041 ,  H01L2924/12042 ,  H01L2924/15788 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19043 ,  H01L2924/30105 ,  H01L2924/3025 ,  H01L2924/3512 ,  Y10S438/982 ,  H01L2924/00 ,  H01L2224/05599

Abstract: Provided are an image display unit capable of enhancing characteristics such as resolution, image quality, and luminous efficiency, facilitating formation of a large-sized screen, and reducing the production cost, and a method of producing the image display unit. The image display unit includes an array of a plurality of light emitting devices for displaying an image in response to a specific image signal, characterized in that an occupied area of each of the light emitting devices is in a range of 25 µ m 2 or more and 10,000 µ m 2 or less, and the light emitting devices are mounted on a wiring board. In mounting the devices, for example, a two-step enlarged transfer is carried out. The two-step enlarged transfer process includes a first transfer step of transferring the devices arrayed on a first substrate onto a temporarily holding member in such a manner that the devices are spaced from each other with a pitch larger than a pitch of the devices arrayed on the first substrate, and holding the devices on the temporarily holding member, and a second transfer step of transferring the devices held on the temporarily holding member onto a second board in such a manner that the devices are spaced from each other with a pitch larger than the pitch of the devices held on the temporarily holding member. Further, a light emitting device is mounted on a wiring board in such a manner that a crystal growth layer of the light emitting device, which is formed by crystal growth, is kept in a posture inverted from a posture thereof at the time of crystal growth in the direction along the normal line of the board principal plane.

Abstract translation: 提供能够提高分辨率，图像质量和发光效率等特性的图像显示单元，便于大屏幕的形成和降低生产成本，以及制造图像显示单元的方法。 图像显示单元包括响应于特定图像信号显示图像的多个发光装置的阵列，其特征在于，每个发光装置的占用面积在25μm2以上的范围内 10,000μm2以下，发光装置安装在配线基板上。 在安装设备时，例如，进行两步扩大传送。 两步扩大传送处理包括第一传送步骤，将以第一衬底排列在第一衬底上的器件转移到临时保持构件上，使得器件彼此间隔开，间距大于排列在器件上的器件的间距 所述第一基板，并将所述装置保持在所述临时保持构件上;以及第二传送步骤，将保持在所述暂时保持构件上的装置转印到第二基板上，使得所述装置以间距大于 保持在临时保持构件上的装置的间距。 此外，发光器件安装在布线板上，使得通过晶体生长形成的发光器件的晶体生长层在晶体生长时保持与其姿势相反的姿态 沿着主板主线的法线方向。

公开(公告)号：JP2009272591A

公开(公告)日：2009-11-19

申请号：JP2008124444

申请日：2008-05-12

Applicant: Sony Corp ,  ソニー株式会社

Inventor： WATANABE AKIHIKO ,  DOI MASATO ,  MURAGUCHI SHOICHI

IPC: G09F9/33 ,  H01L33/42 ,  H01L33/48 ,  H01L33/62

CPC classification number: H01L21/6835 ,  H01L24/24 ,  H01L24/82 ,  H01L2221/68363 ,  H01L2224/16 ,  H01L2224/24051 ,  H01L2224/24226 ,  H01L2224/76155 ,  H01L2224/82102 ,  H01L2924/01004 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01032 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01041 ,  H01L2924/01042 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/01056 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/10329 ,  H01L2924/12041 ,  H01L2924/15788 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a manufacturing method of a light emitting diode display device that can manufacture the light emitting diode display device by a simple process. SOLUTION: The manufacturing method of a light emitting diode display device includes: a process of tentatively fixing to a substrate for manufacturing light emitting unit a first light emitting diode 110, a second light emitting diode 210, and a third light emitting diode 310; and a process of obtaining a light emitting diode display device where a plurality of light emitting diodes are disposed like a two-dimensional matrix configuration in a first direction and in a second direction perpendicular to the first direction by transferring and fixing the light emitting unit from the substrate for manufacturing the light emitting unit to a substrate 61 for display device, after a first electrode of each of the first light emitting diode 110, the second emitting diode 210, and the third light emitting diode 310 obtains the light emitting unit connected to a sub common electrode 34. COPYRIGHT: (C)2010,JPO&INPIT

Abstract translation: 解决的问题：提供一种通过简单的工艺制造发光二极管显示装置的发光二极管显示装置的制造方法。 解决方案：发光二极管显示装置的制造方法包括：暂时固定到用于制造发光单元的基板的工艺，第一发光二极管110，第二发光二极管210和第三发光二极管210 310; 以及获得发光二极管显示装置的过程，其中多个发光二极管通过从第一方向和第二方向垂直于第一方向而被布置为类似于二维矩阵构型的发光二极管， 在第一发光二极管110，第二发光二极管210和第三发光二极管310中的每一个的第一电极获得连接到发光单元的发光单元之后，用于将发光单元制造到显示装置用基板61的基板 副公共电极34.版权所有（C）2010，JPO＆INPIT

公开(公告)号：JP2009037164A

公开(公告)日：2009-02-19

申请号：JP2007203530

申请日：2007-08-03

Applicant: Sony Corp ,  ソニー株式会社

Inventor： KAWAGUCHI HIDEHIRO ,  DOI MASATO ,  KANEMITSU TOSHIAKI ,  NATORI MAKOTO

IPC: G09G3/32 ,  G02F1/133 ,  G02F1/1343 ,  G02F1/1345 ,  G09F9/00 ,  G09G3/20 ,  G09G3/36 ,  H01L51/50 ,  H05B33/06

CPC classification number: G09G3/3216 ,  G09G3/3275 ,  G09G3/3622 ,  G09G2300/0426 ,  G09G2300/0452 ,  G09G2310/0205 ,  G09G2310/0218

Abstract: PROBLEM TO BE SOLVED: To secure a distance among electrodes. SOLUTION: Wiring 341-1, 341-4, 341-7 are connected to an electrode pad row 331-3, wiring 341-2, 341-5, 341-8 are connected to an electrode pad row 331-2, and the wiring 341-3, 341-6, 341-9 are connected to an electrode pad row 331-1. At this time, data wiring connected to each of the electrode pad rows 331-1, 331-2, 331-3 is connected to light-emitting elements 21 arranged on the same line. Since the different electrode pad rows 331 need only to be connected to the wiring which is connected to different data drivers, wiring design from a connection part 321 to the corresponding data driver from among a #1 data driver 123, a #2 data driver 124 and a #3 data driver 125 is facilitated. This constitution is applicable to display devices. COPYRIGHT: (C)2009,JPO&INPIT

Abstract translation: 要解决的问题：确保电极之间的距离。

解决方案：接线341-1,341-4,341-7连接到电极焊盘排331-3，布线341-2,341-5,341-8连接到电极焊盘排331-2 ，并且布线341-3,341-6,341-9连接到电极焊盘排331-1。 此时，连接到每个电极焊盘列331-1,331-2,331-3的数据布线连接到布置在同一条线上的发光元件21。 由于不同的电极焊盘列331仅需要连接到连接到不同数据驱动器的布线，所以从＃1数据驱动器123，＃2数据驱动器124的连接部321到相应的数据驱动器的布线设计 并且便利了＃3数据驱动器125。 该结构适用于显示装置。 版权所有（C）2009，JPO＆INPIT

公开(公告)号：JP2008098442A

公开(公告)日：2008-04-24

申请号：JP2006279074

申请日：2006-10-12

Applicant: Sony Corp ,  ソニー株式会社

Inventor： DOI MASATO

IPC: H01L33/06 ,  H01L33/32 ,  H01L33/38 ,  H01L33/54 ,  H01L33/56

CPC classification number: H01L33/62 ,  H01L33/20 ,  H01L33/38 ,  H01L33/42 ,  H01L33/44 ,  H01L33/46 ,  H01L2924/0002 ,  H01L2924/00

Abstract: PROBLEM TO BE SOLVED: To provide a method of forming a wiring of a light-emitting element capable of certainly connecting an electrode on a light-emitting side with the wiring and moreover capable of preventing a variation of a luminance of the light-emitting element resulting from a displacement of the light-emitting element and a displacement of the wiring, even if the displacement of the light-emitting element occurs in case of mounting the light-emitting element on a substrate and the displacement of the wiring occurs in case of forming the wiring.
SOLUTION: In a light-emitting diode 10 in which a light-emitting diode structure is formed by an n-type semiconductor layer 11, a light-emitting layer 12 and a p-type semiconductor layer 13, an n-side electrode 15 is formed at a bottom face used as a light-emitting side of the n-type semiconductor layer 11 in a shape of almost straight with a width narrower than the light-emitting side, and a p-side electrode 14 is formed on the p-type semiconductor layer 13. The light-emitting diode 10 is mounted on a substrate 21 by downwardly locating this p-side electrode 14. A wiring 24 connected with the n-side electrode 15 is formed to a shape of almost straight with a width narrower than the light-emitting side and is intersected and connected with the n-side electrode 15.
COPYRIGHT: (C)2008,JPO&INPIT

Abstract translation: 要解决的问题：提供一种形成能够确定地将发光侧的电极与布线连接的发光元件的布线的方法，并且还能够防止光的亮度的变化 即使在将发光元件安装在基板上并且发生布线的位移的情况下发生发光元件的位移，发光元件的位移和布线的位移导致的发光元件 在形成布线的情况下。 解决方案：在其中通过n型半导体层11，发光层12和p型半导体层13形成发光二极管结构的发光二极管10中，n侧 电极15形成在作为n型半导体层11的发光侧的底面，其宽度比发光侧窄的几乎是直的形状，p侧电极14形成在 p型半导体层13.发光二极管10通过向下定位该p侧电极14而安装在基板21上。与n侧电极15连接的布线24形成为几乎直线的形状，并且 宽度比发光侧窄，并且与n侧电极15相交并连接。版权所有（C）2008，JPO＆INPIT