VARIOUS PARAMETERS MEASURING APPARATUS FOR CRT

    公开(公告)号:JPH07211238A

    公开(公告)日:1995-08-11

    申请号:JP134194

    申请日:1994-01-11

    Applicant: SONY CORP

    Inventor: YAMAMOTO KATSUMI

    Abstract: PURPOSE:To provide measuring method and apparatus to measure various parameters of a CRT at high measurement precision within a short measurement time. CONSTITUTION:Landing measurement of a CRT is carried out by giving warbling from a wobbling signal source 111 of a gun center coil 113 of the CRT 101 to vibrate electron beam of the CRT, detecting the screen brightness at that time, and computing the brightness difference due to the vibration of the electron beam by a differential amplifier 106. The result is returned to the gun center coil 113 from an integrator 109 in the output side and the output 110 of the integrator at the time when the brightness difference is converged to zero is taken out as measured data. That the convergence is completed taken out as a balancing completed signal 118 and an extending apparatus 108 and GCC amplifier 112 are installed to adjust the loop gain.

    FABRICATING APPARATUS FOR HYBRID INTEGRATED CIRCUIT

    公开(公告)号:JPS55151340A

    公开(公告)日:1980-11-25

    申请号:JP5991479

    申请日:1979-05-16

    Applicant: SONY CORP

    Abstract: PURPOSE:To enhance the productivity of an apparatus for fabricating hybrid integrated circuir and to easily improve the disposing accuracy of the apparatus by disposing chip-like parts fed out of a hopper once on a template and then adhering them onto a circuit substrate. CONSTITUTION:Chip-like parts 1 such as capacitor or the like are contained at random in a hopper container 2. The parts 1 are intermittently supplied via a shutter unit 3 through a part feeding pipe 4 into a disposing magazine 5. The parts 1 thus introduced by the magazine 5 to predetermined position are introduced further to a disposing plate 6 and rolled laterally in vertical attitude of the parts via a laterally rolling mechanism 12. When the shutter under the plate is opened, the parts 1 are contained in the part containing recess of the template 7. The parts are adhered as shown to the printed board 10 coated with the adhesive resin 9 thereon and connected thereto via dipped solder.

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