METHOD AND APPARATUS OF MANUFACTURING HYBRID INTEGRATED CIRCUIT

    公开(公告)号:CA1137651A

    公开(公告)日:1982-12-14

    申请号:CA348985

    申请日:1980-04-01

    Applicant: SONY CORP

    Abstract: A method of manufacturing a hybrid integrated circuit comprises the steps of: a) placing chip-type circuit elements on predetermined portions of a template; b) preparing a printed circuit board having adhesive material at given portions thereof; c) piling the printed circuit board on the template so as to bring the circuit elements into contact with the adhesive material; d) turning the template with the circuit board upside down and then transferring the circuit elements to the circuit board by removing the template from the circuit board; e) hardening the adhesive material to temporarily hold the circuit elements on the circuit board; and f) soldering the circuit elements to conductive patterns formed on the circuit board, so as to electrically connect the circuit elements with the conductive patterns. This method of the present invention is well performed with an element-distributing apparatus which will be below explained in details.

    METHOD FOR APPLYING ADHESIVE RESIN ON A CIRCUIT BOARD

    公开(公告)号:CA1137650A

    公开(公告)日:1982-12-14

    申请号:CA350330

    申请日:1980-04-22

    Applicant: SONY CORP

    Abstract: S01295 S80P45 METHOD FOR APPLYING ADHESIVE RESIN ON A CIRCUIT BOARD A printing screen having a pattern of previous printing areas and impervious non-printing areas is angularly displaced to an operative position parallel to, but slightly spaced from a substrate on which a resin pattern is to be printed. A resilient blade or squeegee is wiped across the screen in its operative position for both pressing the screen down against the substrate and squeezing semi-liquid resin through the pervious areas into contact with the substrate. Upon completion of such wiping operation, the resilient blade is lifted from the screen and the screen is maintanied in its operative position parallel to the substrate for a sufficient time to permit the substantially vertical collapse of resin threads bridging the space between the printed pattern and the screen.

    Information processing equipment and method therefor, recording medium and program thereof
    5.
    发明专利
    Information processing equipment and method therefor, recording medium and program thereof 审中-公开
    信息处理设备及其方法,记录介质及其程序

    公开(公告)号:JP2003052060A

    公开(公告)日:2003-02-21

    申请号:JP2002060274

    申请日:2002-03-06

    Abstract: PROBLEM TO BE SOLVED: To simplify processing of formation, change, supply, etc. of a signal for inspection.
    SOLUTION: Images prepared as a signal for inspection to every resolution are displayed en bloc in a signal displaying part 112 by operating resolution switching buttons 111. The images displayed en bloc in the signal displaying part 112 are related to signal data, which are managed as data of a JPEG type or the like. When the image displayed in the signal displaying part 112 is selected, signal data corresponding to the image are read and supplied to an apparatus for inspection which is connected via a graphic board. This can be applied to equipment for inspecting whether defects exist on an image plate of a television receiver.
    COPYRIGHT: (C)2003,JPO

    Abstract translation: 要解决的问题:简化检查信号的形成,更换,供应等的处理。 解决方案:通过操作分辨率切换按钮111,准备作为用于检查每个分辨率的信号的图像被整体地显示在信号显示部分112中。整体显示在信号显示部分112中的图像与信号数据相关,信号数据被管理为 JPEG类型的数据等。 当选择显示在信号显示部分112中的图像时,与图像对应的信号数据被读取并提供给经由图形板连接的检查装置。 这可以应用于用于检查电视接收机的图像板上是否存在缺陷的设备。

    ELECTRONIC PACKAGE COMPONENT AND MANUFACTURE THEREOF

    公开(公告)号:JPH11307664A

    公开(公告)日:1999-11-05

    申请号:JP11389098

    申请日:1998-04-23

    Applicant: SONY CORP

    Abstract: PROBLEM TO BE SOLVED: To provide an electronic package component which is high in reliability and mounting workability, lessened in mounting floor area, small in size, and suitable for an enhancement in frequency and a manufacturing method thereof. SOLUTION: A ceramic board 1 is provided with cavities which are laterally and longitudinally arranged in lines to house electronic parts, and connection terminals are provided to the cavities so as to electrically connect the electronic components to the outside of the ceramic board 1. The electronic parts 4 are fixed inside the cavities as being electrically connected to the connection terminals, then the open upside of the ceramic board 1 where the electronic components are housed is covered with a metal sealing board 5, and the metal sealing board 5 is fixed. Then, after the sealing bord 5 and the ceramic board 1 are brought into close contact with each other, the ceramic board 1 and the sealing board 5 are cut off along lateral and longitudinal lines with a cutter 6 into unit electronic package components.

    CARRIER TAPE PERFORMANCE TESTING MACHINE

    公开(公告)号:JPH06201532A

    公开(公告)日:1994-07-19

    申请号:JP198693

    申请日:1993-01-08

    Abstract: PURPOSE:To accurately capture a parts suction position and at the same time observe parts-mounting state by providing a camera for observing suction of parts, a camera, etc., for observing cavity at a parts supply position. CONSTITUTION:A carrier tape inspection mechanism part consists of a parts suction state observation camera 33. a camera 34 for observing cavity. and a testing machine control box. The parts suction state observation camera 33 observes the behavior of a carrier tape when parts are supplied, that of electronic parts. suction state of a suction nozzle 12, deficiency, etc., in electronic parts of carrier tape. The camera 34 for observing cavity observes the state of feed of the carrier tape at a position for sucking the electronic parts from the carrier tape, namely at the cavity part, and measures dimensions of the accuracy for feeding the carrier tape, the accuracy, etc., of a parts supply position E. Data whose image is picked up by the cameras 33 and 34 are properly recorded on a video tape and are reproduced at the display part.

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