公开(公告)号：KR850000216Y1

公开(公告)日：1985-02-15

申请号：KR810005023

申请日：1981-07-15

Applicant: SONY CORP

Inventor： TAKAHASHI TOSHIO ,  OHSAWA MITSUO

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/38

公开(公告)号：FR2487153A1

公开(公告)日：1982-01-22

申请号：FR8114005

申请日：1981-07-17

Applicant: SONY CORP ,  SONY CORP

Inventor： TAKAHASHI TOSHIO ,  TOSHIO TAKAHASHI ET MITSUO OHSAWA ,  OHSAWA MITSUO

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/38

Abstract: A.PANNEAU DE CIRCUIT IMPRIME, B.PANNEAU DE CIRCUIT IMPRIME CARACTERISE EN CE QU'IL COMPORTE EN OUTRE UN TRACE PILOTE 7 RELIANT LES ZONES 2 ET 3 POUR CANALISER DE LA SOUDURE FONDUE 13 ENTRE CES ZONES. C.L'INVENTION S'APPLIQUE NOTAMMENT A DES CIRCUITS COMPORTANT UN PLUS PETIT NOMBRE DE COMPOSANTS SANS CONDUCTEUR QUE DE COMPOSANTS AVEC CONDUCTEURS.

公开(公告)号：FR2456059B1

公开(公告)日：1985-12-20

申请号：FR8010632

申请日：1980-05-12

Applicant: SONY CORP

Inventor： NODA TERUYOSHI ,  ICHIKAWA IWAO ,  TAKAHASHI TOSHIO

IPC: B65G11/10 ,  B29C67/00 ,  B65G11/02 ,  B65G11/16 ,  B65G11/18 ,  B65G11/20 ,  B65G51/18 ,  H05K13/04 ,  B65G47/14 ,  B65G47/24 ,  B65G51/02 ,  H05K13/02

Abstract: Leadless electronic parts or the like are transferred from hoppers under the influence of gravity or by forced air through tubes of polygonal cross-section to a prepositioning template. The polygonal cross sections of the transferring tubes tend to damp out oscillatory motion of the parts and to speed their travel through the tubes. Each polygonal, preferably triangular, tube is preferably obtained by deforming a tube of circular cross-section in a forming machine including a plurality of discs arranged so that their peripheries define a polygonal space therebetween through which the tube of circular cross section is driven.

公开(公告)号：PH18592A

公开(公告)日：1985-08-12

申请号：PH23050

申请日：1979-09-20

Applicant: SONY CORP

Inventor： OHSAWA MITSUO ,  YAMAMURA MASATO ,  TAKAHASHI TOSHIO

IPC: H05K3/34 ,  H01R12/00 ,  H05K1/02 ,  H05K1/18 ,  H05K3/30

Abstract: A printed circuit board includes an insulating board; at least one pair of conductive patterns arranged on the insulating board and spaced from each other by a predetermined length; and a paint layer formed in the space between the conductive patterns within a predetermined range.

公开(公告)号：CA1162574A

公开(公告)日：1984-02-21

申请号：CA351255

申请日：1980-05-05

Applicant: SONY CORP

Inventor： NODA TERUYOSHI ,  ICHIKAWA IWAO ,  TAKAHASHI TOSHIO

IPC: B65G11/10 ,  B29C67/00 ,  B65G11/02 ,  B65G11/16 ,  B65G11/18 ,  B65G11/20 ,  B65G51/18 ,  H05K13/04 ,  B65G47/12

Abstract: Leadless electronic parts or the like are transferred from hoppers under the influence of gravity or by forced air through tubes of polygonal cross-section to a propositioning template. The polygonal cross sections of the transferring tubes tend to damp out oscillatory motion of the parts and to speed their travel through the tubes. Each polygonal, preferably triangular, tube is preferably obtained by deforming a tube of circular cross-section in a forming machine including a plurality of discs arranged so that their peripheries define a polygonal space therebetween through which the tube of circular cross section is driven.

公开(公告)号：FR2456458A1

公开(公告)日：1980-12-05

申请号：FR8010219

申请日：1980-05-07

Applicant: SONY CORP

Inventor： TAKAHASHI TOSHIO ,  YAMAMOTO KATSUMI

IPC: H05K3/34 ,  B41F15/46 ,  H05K3/12

公开(公告)号：AU543036B2

公开(公告)日：1985-03-28

申请号：AU7280381

申请日：1981-07-13

Applicant: SONY CORP

Inventor： TAKAHASHI TOSHIO ,  OHSAWA MITSUO

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/38 ,  H05K1/18

Abstract: A printed circuit board substrate is mounted with electric circuit components to form an electric circuit thereon. The printed circuit board is provided with a land without a piercing hole for electrical connection with an electrode of a chip-shaped leadless element, and a land with an aperture for the insertion of the lead wire of a component or element with a lead, and further a pilot pattern for leading melted solder in spite of the presence of evaporated solder flux gas or air during a solder dipping operation. The pilot pattern may comprise a conductive pattern connecting the land for the leadless element and the land for the element with lead. At least elimination of the solder resist layer on a portion of the conductive pattern to form the pilot pattern.

公开(公告)号：CA1145061A

公开(公告)日：1983-04-19

申请号：CA341424

申请日：1979-12-07

Applicant: SONY CORP

Inventor： OHSAWA MITSUO ,  TAKAHASHI TOSHIO

IPC: H05K1/11 ,  H01B5/14 ,  H05K3/22 ,  H01L23/00

Abstract: An electronic shorting device such as a device designed for a leadless mounting on a printed circuit board is provided. The shorting device includes a cylindrical porcelain body which is plated with an electrically conducting metal. Electrically conductive caps are fitted to each end of the plated body and a layer of non-conducting material is applied to the cylinder body between the two end caps. The use of a porcelain material for the body generates a shorting device having a heat capacity close to other leadless components, such as resistors.

公开(公告)号：DE3128409A1

公开(公告)日：1982-03-25

申请号：DE3128409

申请日：1981-07-17

Applicant: SONY CORP

Inventor： TAKAHASHI TOSHIO ,  OHSAWA MITSUO

IPC: H05K1/02 ,  H05K3/30 ,  H05K3/34 ,  H05K3/38 ,  H05K7/08

Abstract: A printed circuit board substrate is mounted with electric circuit components to form an electric circuit thereon. The printed circuit board is provided with a land without a piercing hole for electrical connection with an electrode of a chip-shaped leadless element, and a land with an aperture for the insertion of the lead wire of a component or element with a lead, and further a pilot pattern for leading melted solder in spite of the presence of evaporated solder flux gas or air during a solder dipping operation. The pilot pattern may comprise a conductive pattern connecting the land for the leadless element and the land for the element with lead. At least elimination of the solder resist layer on a portion of the conductive pattern to form the pilot pattern.

公开(公告)号：FR2456059A1

公开(公告)日：1980-12-05

申请号：FR8010632

申请日：1980-05-12

Applicant: SONY CORP

Inventor： NODA TERUYOSHI ,  ICHIKAWA IWAO ,  TAKAHASHI TOSHIO

IPC: B65G11/10 ,  B29C67/00 ,  B65G11/02 ,  B65G11/16 ,  B65G11/18 ,  B65G11/20 ,  B65G51/18 ,  H05K13/04 ,  B65G47/14 ,  B65G47/24 ,  B65G51/02 ,  B29C17/02 ,  H05K13/02

Abstract: Leadless electronic parts or the like are transferred from hoppers under the influence of gravity or by forced air through tubes of polygonal cross-section to a prepositioning template. The polygonal cross sections of the transferring tubes tend to damp out oscillatory motion of the parts and to speed their travel through the tubes. Each polygonal, preferably triangular, tube is preferably obtained by deforming a tube of circular cross-section in a forming machine including a plurality of discs arranged so that their peripheries define a polygonal space therebetween through which the tube of circular cross section is driven.