Abstract:
A voltage regulator (150I) integrated in a chip of semiconductor material is proposed. The regulator has a first input terminal for receiving a first voltage (Vhv) and an output terminal for providing a regulated voltage (Vreg) being obtained from the first voltage, the regulator including: a differential amplifier (205I) for receiving a comparison voltage (Vref) and a feedback signal (Vfb) being a function of the regulated voltage, and for proving a regulation signal (Vr) according to a comparison between the comparison voltage and the feedback signal, the differential amplifier having a first supply terminal being coupled with a reference terminal for receiving a reference voltage and a second supply terminal, a regulation transistor (MS) having a control terminal for receiving the regulation signal, and a conduction first terminal and a conduction second terminal being coupled through loading means (Rpup) between the reference terminal and the first input terminal of the regulator, the second terminal of the regulation transistor being coupled with the output terminal of the regulator, wherein the second supply terminal of the differential amplifier is coupled with a second input terminal of the regulator for receiving a second voltage (Vdd) being lower than the first voltage in absolute value, and wherein the regulator further includes a set of auxiliary transistors (MS1-MS5) being connected in series between the second terminal of the regulation transistor and the output terminal of the regulator, and control means (155) for controlling the auxiliary transistors according to the regulated voltage.
Abstract:
A method of electrically programming a memory cell, comprising: applying at least one electrical programming pulse to the memory cell; verifying the reaching of a target programming state by the memory cell; repeating the acts of applying and verifying until the reaching of a target programming state by the memory cell is assessed. After the reaching of a target programming state by the memory cells is assessed, at least one further electrical programming pulse is applied thereto, and the memory cell is verified at least one more time after applying the further programming pulse. In case, as a result of said further verifying, the reaching of the target programming state by the memory cell is not assessed, the method provides for applying a still further programming pulse to the memory cell.
Abstract:
When the threshold voltage of a cell of a four-level FLASH memory device, that includes an array of singularly addressable preliminarily erased memory cells each capable of storing a two-bit datum, is verified to have reached the desired distribution, the cell is read using a test read voltage smaller than or equal to the program voltage. In this situation the voltage V S on the source node is surely negligible and the programmed state of the cell may be correctly verified. A novel architecture of a page buffer is also provided.
Abstract:
A method for programming an electrically programmable memory (100) is provided. The electrically programmable memory includes a plurality of memory cells (110) arranged in individually-selectable memory cell sets each including at least one memory cell, a plurality of distinct memory cell programming states (201, 202, 203, 204) corresponding to a number N >=2 of data bits storable in each memory cell. The data bits include at least a first data bits group (LSB) and a second data bits group (MSB); the first data bits groups and, respectively, the second data bits groups stored in the memory cells of one of said individually-selectable memory cell sets form at least a first memory page and a second memory page, respectively, the first and second memory pages being individually addressable. The programming method comprises: - causing the memory cells of a selected memory cells set to be brought into a predetermined, starting programming state (201); - receiving a target value for the first data bits groups of the memory cells of the selected memory cells set; - receiving a target value for the second data bits groups of the memory cells of the selected memory cells set; - after having received the target values of both the first and the second data bits groups, applying to the memory cells of the selected memory cells set a programming sequence (350) adapted to cause the memory cells of the selected memory cells sets to be brought into a target programming state (201,202,203,204) jointly determined by the target values of the first and second data bits groups.
Abstract:
A memory device (100) is provided. The memory device includes a matrix (105) of memory cells (110) adapted to store data and arranged in a plurality of bit lines (BLe, BLo), the bit lines extending along a first direction (Y); a page buffer (130) adapted to interface the matrix with a downstream circuitry (125c, 140), the page buffer comprising a plurality of read/program units (205(i)). Each read/program unit is associated with and operatively couplable to at least one bit line. The memory device further includes at least two groups each including at least two respective read/program units, wherein the read/program units of a generic one of said groups are generically aligned along the first direction. The at least two groups are generically aligned along a second direction (X) transversal to the first direction. The memory device further includes at least one signal track (BITOUT) associated with each one of said groups for conveying signals corresponding to data read from the memory cells to the downstream circuitry are provided. Said at least one signal track is shared by the at least two read/program units of the corresponding group. The memory device further includes means (410) for selectively assigning the at least one signal track to one of the associated read/program unit at a time among the at least two read/program units of the group associated with said signal track.
Abstract:
A reading method of a NAND memory device including the steps of: first connecting a first end terminal (12a) of a stack (12) of cells (3, 3', 3") to a reference line (13); second connecting a second end terminal (12b) of the stack (12) of cells (3, 3', 3") to a respective bitline (10); charging the bitline (10) to a predetermined bitline read voltage (V DR ), wherein one of the steps of first connecting and second connecting is carried out before charging the bitline (10) and the other of the steps of first connecting and second connecting is carried out after charging the bitline (10). An order of carrying out the steps of first connecting and second connecting is determined based on an address (MSB; AL2) of a selected cell (3', 3") .