Abstract:
A semiconductor memory comprises a plurality of memory cells (MC), for example Flash memory cells, arranged in a plurality of lines (LBL), and a plurality of memory cell access signal lines (MBL), each one associated with at least one respective line of memory cells, for accessing the memory cells of the at least one respective line of memory cells; each signal line has a capacitance (CMBL) intrinsically associated therewith. A plurality of volatile memory cells is provided, each having a capacitive storage element. Each volatile memory cell is associated with a respective signal line, and the respective capacitive storage element formed by the capacitance intrinsically associated with the respective signal lines. In particular, the parasitic capacitances associated with bit lines of a matrix of memory cells can be exploited as capacitive storage elements.
Abstract:
The invention relates to a power supply circuit structure useful with a row decoder for reading/writing data from/into memory cells of an integrated electrically programmable/erasable non-volatile memory device incorporating an array of multilevel memory cells. Advantageously, multiple supply voltages to the row decoder and switching means for transferring said voltages over hierarchic-mode enabled conduction paths are provided.
Abstract:
The integrated electronic device (10) with reduced internal connections comprises a first memory device (11), having signal pins (11a, 11d), data pins (11b 1 ), and an enabling pin (11c) receiving a first enabling signal (CE1), and a second memory device (12) having signal pins (12a, 12d), data pins (12b 1 ), and an enabling terminal (12c) receiving a second enabling signal (CE2). The signal pins (12a, 12d) of the second memory device (12) are connected directly to corresponding data pins (11b 1 ) of the first memory device (11). In addition, the first memory device (11) comprises first connecting means (19), which can be activated selectively in order to define a current path between each signal pin (11a, 11d) and each data pin (11b 1 ), and the second memory device (12) comprises second connecting means (22), which can be activated selectively in order to define a current path between each signal pin (12a, 12d) and each data pin (12b 1 ).