Abstract:
A MEMS resonator system (20) has a micromechanical resonant structure (22) and an electronic processing circuit (24), which has: a first resonant loop (24a), which excites a first vibrational mode of the structure and generates a first signal (S(f ΔT,1 )) at a first resonance frequency (f ΔT,1 ); and a compensation module (32), which compensates, as a function of a measurement of temperature variation (ΔT), a first variation (Δf 1 ) of the first resonance frequency caused by the temperature variation so as to generate a clock signal (CLK) at a desired frequency that is stable in regard to temperature. The electronic processing circuit further has: a second resonant loop (24b), which excites a second vibrational mode of the structure and generates a second signal (S(f ΔT,2 )) at a second resonance frequency (f ΔT,2 ); and a temperature-sensing module (30), which receives the first and second signals and generates the measurement of temperature variation as a function of the first variation of the first resonance frequency and of a second variation (Δf 2 ) of the second resonance frequency caused by the same temperature variation.
Abstract:
The accelerometric sensor has a suspended region (21), mobile with respect to a supporting structure (24), and a sensing assembly (37) coupled to the suspended region and configured to detect a movement of the suspended region with respect to the supporting structure. The suspended region (21) has a geometry variable between at least two configurations associated with respective centroids, different from each other. The suspended region (21) is formed by a first region (22) rotatably anchored to the supporting structure (24) and by a second region (23) coupled to the first region (22) through elastic connection elements (25) configured to allow a relative movement of the second region (23) with respect to the first region (22). A driving assembly (40) is coupled to the second region (23) so as to control the relative movement of the latter with respect to the first region.
Abstract:
A micromechanical detection structure (20) comprises: a substrate (2) of semiconductor material; a driving-mass arrangement (4a-4c), coupled to a set of driving electrodes (7a-7c) and driven in a driving movement following upon biasing of the set of driving electrodes; a first anchorage unit (5a-5c, 6a-6c), coupled to the driving-mass arrangement for elastically coupling the driving-mass arrangement to the substrate (2) at first anchorages (5a-5c); a driven-mass arrangement (10, 30), elastically coupled to the driving-mass arrangement by a coupling unit (22a-22b) and designed to be driven by the driving movement; and a second anchorage unit (14, 34), coupled to the driven-mass arrangement for elastically coupling the driven-mass arrangement to the substrate (2) at second anchorages (17, 37). Following upon the driving movement, the resultant of the forces and of the torques exerted on the substrate (2) at the first and second anchorages is substantially zero.
Abstract:
A MEMS device including a main die (22) that may be coupled to a secondary die (2), which forms a frame (4), and at least one first mobile mass (6) elastically coupled to the frame, the main die (22) forming: a driving stage (20, 24) that drives the first mobile mass so that it oscillates, parallel to a first direction, with frequency-modulated displacements; and a processing stage (35), which generates an output signal indicating an angular velocity of the MEMS device (100) as a function of displacements parallel to a second direction that are made by the first mobile mass, when driven by the driving stage, on account of a Coriolis force.
Abstract:
A multi-axis MEMS gyroscope (42) is provided with a micromechanical detection structure (10) having: a substrate (12); a driving-mass arrangement (14a-14b); a driven-mass arrangement (20) with a central window (22); a sensing-mass arrangement (20; 35a-35b, 37a-37b), which undergoes sensing movements in the presence of angular velocities about a first horizontal axis (x) and a second horizontal axis (x); a sensing-electrode arrangement (29a-29b, 30a-30b), which is fixed with respect to the substrate and is set underneath the sensing-mass arrangement; and an anchorage assembly (24), set within the central window (22), for constraining the driven-mass arrangement to the substrate at anchorage elements (27). The anchorage assembly comprises a rigid structure (25a-25b), suspended above the substrate, elastically connected to the driven mass by elastic connection elements (26a-26b) at a central portion, and to the anchorage elements by elastic decoupling elements (28) at end portions thereof.
Abstract:
A micromechanical detection structure (20) comprises: a substrate (2) of semiconductor material; a driving-mass arrangement (4a-4c), coupled to a set of driving electrodes (7a-7c) and driven in a driving movement following upon biasing of the set of driving electrodes; a first anchorage unit (5a-5c, 6a-6c), coupled to the driving-mass arrangement for elastically coupling the driving-mass arrangement to the substrate (2) at first anchorages (5a-5c); a driven-mass arrangement (10, 30), elastically coupled to the driving-mass arrangement by a coupling unit (22a-22b) and designed to be driven by the driving movement; and a second anchorage unit (14, 34), coupled to the driven-mass arrangement for elastically coupling the driven-mass arrangement to the substrate (2) at second anchorages (17, 37). Following upon the driving movement, the resultant of the forces and of the torques exerted on the substrate (2) at the first and second anchorages is substantially zero.