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公开(公告)号:US10243100B2
公开(公告)日:2019-03-26
申请号:US15687606
申请日:2017-08-28
Applicant: Sensor Electronic Technology, Inc.
Inventor: Michael Shur , Rakesh Jain , Maxim S. Shatalov , Alexander Dobrinsky , Jinwei Yang , Remigijus Gaska , Mikhail Gaevski
IPC: H01L33/06 , H01L33/00 , H01L33/18 , H01L33/38 , H01S5/022 , H01L33/30 , H01S5/343 , H01S5/32 , H01S5/34
Abstract: A device comprising a semiconductor layer including a plurality of compositional inhomogeneous regions is provided. The difference between an average band gap for the plurality of compositional inhomogeneous regions and an average band gap for a remaining portion of the semiconductor layer can be at least thermal energy. Additionally, a characteristic size of the plurality of compositional inhomogeneous regions can be smaller than an inverse of a dislocation density for the semiconductor layer.
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公开(公告)号:US10158044B2
公开(公告)日:2018-12-18
申请号:US15391922
申请日:2016-12-28
Applicant: Sensor Electronic Technology, Inc.
Inventor: Rakesh Jain , Wenhong Sun , Jinwei Yang , Maxim S. Shatalov , Alexander Dobrinsky , Remigijus Gaska , Michael Shur
IPC: H01L31/072 , H01L33/32 , H01L33/00 , H01L33/12 , H01L33/06 , H01L21/02 , H01L29/15 , H01L33/02 , H01L33/04 , H01L33/20
Abstract: A solution for fabricating a semiconductor structure is provided. The semiconductor structure includes a plurality of semiconductor layers grown over a substrate using a set of epitaxial growth periods. During each epitaxial growth period, a first semiconductor layer having one of: a tensile stress or a compressive stress is grown followed by growth of a second semiconductor layer having the other of: the tensile stress or the compressive stress directly on the first semiconductor layer.
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公开(公告)号:US10153396B2
公开(公告)日:2018-12-11
申请号:US15857853
申请日:2017-12-29
Applicant: Sensor Electronic Technology, Inc.
Inventor: Rakesh Jain , Wenhong Sun , Jinwei Yang , Maxim S. Shatalov , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
IPC: H01L27/15 , H01L31/0336 , H01L33/06 , H01L21/02 , H01L29/778 , H01L33/12 , H01L33/24 , H01L33/32 , H01L29/20 , H01L29/51 , H01L33/22
Abstract: A device having a layer with a patterned surface for improving the growth of semiconductor layers, such as group III nitride-based semiconductor layers with a high concentration of aluminum, is provided. The patterned surface can include a substantially flat top surface and a plurality of stress reducing regions, such as openings. The substantially flat top surface can have a root mean square roughness less than approximately 0.5 nanometers, and the stress reducing regions can have a characteristic size between approximately 0.1 microns and approximately five microns and a depth of at least 0.2 microns. A layer of group-III nitride material can be grown on the first layer and have a thickness at least twice the characteristic size of the stress reducing regions.
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公开(公告)号:US10032956B2
公开(公告)日:2018-07-24
申请号:US15495192
申请日:2017-04-24
Applicant: Sensor Electronic Technology, Inc.
Inventor: Maxim S. Shatalov , Rakesh Jain , Jinwei Yang , Michael Shur , Remigijus Gaska
CPC classification number: H01L33/22 , G06F17/5068 , G06F2217/12 , H01L21/0242 , H01L21/0243 , H01L21/02458 , H01L21/0254 , H01L21/02617 , H01L21/02639 , H01L21/0265 , H01L33/007 , H01L33/06 , H01L33/10 , H01L33/12 , H01L33/24 , H01L33/32 , H01L2224/16225 , Y02P90/265
Abstract: A patterned surface for improving the growth of semiconductor layers, such as group III nitride-based semiconductor layers, is provided. The patterned surface can include a set of substantially flat top surfaces and a plurality of openings. Each substantially flat top surface can have a root mean square roughness less than approximately 0.5 nanometers, and the openings can have a characteristic size between approximately 0.1 micron and five microns. One or more of the substantially flat top surfaces can be patterned based on target radiation.
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公开(公告)号:US09923118B2
公开(公告)日:2018-03-20
申请号:US15225403
申请日:2016-08-01
Applicant: Sensor Electronic Technology, Inc.
Inventor: Maxim S. Shatalov , Alexander Dobrinsky , Rakesh Jain , Michael Shur
CPC classification number: H01L33/10 , H01L33/007 , H01L33/0079 , H01L33/12 , H01L33/32 , H01L33/46 , H01S5/0224
Abstract: A semiconductor layer including a plurality of inhomogeneous regions is provided. Each inhomogeneous region has one or more attributes that differ from a material forming the semiconductor layer. The inhomogeneous regions can include one or more regions configured based on radiation having a target wavelength. These regions can include transparent and/or reflective regions. The inhomogeneous regions also can include one or more regions having a higher conductivity than a conductivity of the radiation-based regions, e.g., at least ten percent higher. In one embodiment, the semiconductor layer is used to form an optoelectronic device.
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公开(公告)号:US20170373222A1
公开(公告)日:2017-12-28
申请号:US15687606
申请日:2017-08-28
Applicant: Sensor Electronic Technology, Inc.
Inventor: Michael Shur , Rakesh Jain , Maxim S. Shatalov , Alexander Dobrinsky , Jinwei Yang , Remigijus Gaska , Mikhail Gaevski
IPC: H01L33/06 , H01S5/022 , H01L33/38 , H01L33/18 , H01L33/00 , H01S5/343 , H01L33/30 , H01S5/32 , H01S5/34
CPC classification number: H01L33/06 , H01L33/007 , H01L33/18 , H01L33/30 , H01L33/382 , H01L2224/14 , H01S5/0224 , H01S5/3209 , H01S5/3413 , H01S5/34333
Abstract: A device comprising a semiconductor layer including a plurality of compositional inhomogeneous regions is provided. The difference between an average band gap for the plurality of compositional inhomogeneous regions and an average band gap for a remaining portion of the semiconductor layer can be at least thermal energy. Additionally, a characteristic size of the plurality of compositional inhomogeneous regions can be smaller than an inverse of a dislocation density for the semiconductor layer.
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公开(公告)号:US20170263805A1
公开(公告)日:2017-09-14
申请号:US15588896
申请日:2017-05-08
Applicant: Sensor Electronic Technology, Inc.
Inventor: Rakesh Jain , Maxim S. Shatalov , Jinwei Yang , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
IPC: H01L33/00 , H01L31/0224 , H01L31/0352 , H01L31/105 , H01L33/04 , H01L33/14 , H01L33/32
CPC classification number: H01L33/002 , H01L31/022408 , H01L31/035236 , H01L31/105 , H01L33/0062 , H01L33/025 , H01L33/04 , H01L33/145 , H01L33/32 , H01L2933/0008
Abstract: An improved heterostructure for an optoelectronic device is provided. The heterostructure includes an active region, an electron blocking layer, and a p-type contact layer. The p-type contact layer and electron blocking layer can be doped with a p-type dopant. The dopant concentration for the electron blocking layer can be at most ten percent the dopant concentration of the p-type contact layer. A method of designing such a heterostructure is also described.
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公开(公告)号:US09653631B2
公开(公告)日:2017-05-16
申请号:US14475638
申请日:2014-09-03
Applicant: Sensor Electronic Technology, Inc.
Inventor: Rakesh Jain , Maxim S. Shatalov , Jinwei Yang , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
IPC: H01L33/00 , H01L31/0352 , H01L33/04 , H01L33/32
CPC classification number: H01L31/035272 , H01L33/04 , H01L33/32
Abstract: An improved heterostructure for an optoelectronic device is provided. The heterostructure includes an active region, an electron blocking layer, and a p-type contact layer. The p-type contact layer and electron blocking layer can be doped with a p-type dopant. The dopant concentration for the electron blocking layer can be at most ten percent the dopant concentration of the p-type contact layer. A method of designing such a heterostructure is also described.
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公开(公告)号:US09647168B2
公开(公告)日:2017-05-09
申请号:US14944538
申请日:2015-11-18
Applicant: Sensor Electronic Technology, Inc.
Inventor: Rakesh Jain , Maxim S. Shatalov , Jinwei Yang , Alexander Dobrinsky , Michael Shur , Remigijus Gaska
CPC classification number: H01L33/002 , H01L31/022408 , H01L31/035236 , H01L31/105 , H01L33/0062 , H01L33/025 , H01L33/04 , H01L33/145 , H01L33/32 , H01L2933/0008
Abstract: An improved heterostructure for an optoelectronic device is provided. The heterostructure includes an active region, an electron blocking layer, and a p-type contact layer. The p-type contact layer and electron blocking layer can be doped with a p-type dopant. The dopant concentration for the electron blocking layer can be at most ten percent the dopant concentration of the p-type contact layer. A method of designing such a heterostructure is also described.
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公开(公告)号:US09634189B2
公开(公告)日:2017-04-25
申请号:US15138415
申请日:2016-04-26
Applicant: Sensor Electronic Technology, Inc.
Inventor: Maxim S. Shatalov , Rakesh Jain , Jinwei Yang , Michael Shur , Remigijus Gaska
CPC classification number: H01L33/22 , G06F17/5068 , G06F2217/12 , H01L21/0237 , H01L21/0242 , H01L21/0243 , H01L21/02458 , H01L21/0254 , H01L21/02617 , H01L21/02639 , H01L21/0265 , H01L33/007 , H01L33/0075 , H01L33/06 , H01L33/12 , H01L33/32 , H01L2224/16225
Abstract: A patterned surface for improving the growth of semiconductor layers, such as group III nitride-based semiconductor layers, is provided. The patterned surface can include a set of substantially flat top surfaces and a plurality of openings. Each substantially flat top surface can have a root mean square roughness less than approximately 0.5 nanometers, and the openings can have a characteristic size between approximately 0.1 micron and five microns. One or more of the substantially flat top surfaces can be patterned based on target radiation.
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