公开(公告)号：WO1995008856A1

公开(公告)日：1995-03-30

申请号：PCT/US1994008812

申请日：1994-08-05

Applicant: TESSERA, INC.

Inventor： TESSERA, INC. ,  SWEIS, Jason ,  GILLEO, Kenneth, Burton

IPC: H01R43/00

CPC classification number: G06K19/07745 ,  H01L21/54 ,  H01L23/24 ,  H01L2924/0002 ,  Y10T29/49144 ,  H01L2924/00

Abstract: A method for creating an interface between a chip (10) and chip carrier (26) includes spacing the chip (10) a given distance above the chip carrier (26), and then introducing a liquid (50) in the gap (34) between the chip (10) and carrier (26). Preferably, the liquid (50) is an elastomer which is hardened into a resilient layer after its introduction into the gap (34). In another preferred embodiment, the terminals (331-34) on a chip carrier (326) are planarized or otherwise vertically positioned by deforming the terminals (331-34) into set vertical locations with a plate (380), and then hardening a liquid (350) between the chip carrier (326) and chip (310).

Abstract translation: 一种用于在芯片（10）和芯片载体（26）之间创建界面的方法包括将芯片（10）与芯片载体（26）上方给定的距离间隔开，然后将液体（50）引入间隙（34） 在芯片（10）和载体（26）之间。 优选地，液体（50）是在其引入间隙（34）之后被硬化成弹性层的弹性体。 在另一优选实施例中，芯片载体（326）上的端子（331-34）通过使端子（331-34）变形成具有板（380）的设定垂直位置而被平坦化或以其它方式垂直定位，然后使液体 （350）在芯片载体（326）和芯片（310）之间。