SEMICONDUCTOR CHIP ASSEMBLIES AND COMPONENTS WITH PRESSURE CONTACT
    2.
    发明申请
    SEMICONDUCTOR CHIP ASSEMBLIES AND COMPONENTS WITH PRESSURE CONTACT 审中-公开
    半导体芯片组件和组件与压力接触

    公开(公告)号:WO1994023451A1

    公开(公告)日:1994-10-13

    申请号:PCT/US1994003346

    申请日:1994-03-28

    Applicant: TESSERA, INC.

    Abstract: A semiconductor chip assembly includes a chip (20), terminals (34) permanently electrically connected to the chip by flexible leads (36) and a resilient element (48) or elements for biasing the terminals away from the chip. The chip is permanently engaged with a substrate (52) having contact pads (58) so that the terminals are disposed between the chip and the substrate and the terminals engage the contact pads under the influence of the force applied by the resilient element. The terminals typically are provided on a flexible sheet-like dielectric interposer (28) and the resilient element is disposed between the interposer and the chip. The assembly of the chip and the terminals can be tested prior to engagement with the substrate. Engagement of this assembly with the substrate does not involve soldering or other complex bonding processes. The assembly may occupy an area only slightly larger than the area of the chip itself.

    Abstract translation: 半导体芯片组件包括芯片(20),通过柔性引线(36)和弹性元件(48)永久地电连接到芯片的端子(34)或用于将端子偏压离开芯片的元件。 芯片与具有接触焊盘(58)的基板(52)永久地接合,使得端子设置在芯片和基板之间,并且端子在由弹性元件施加的力的影响下接合接触焊盘。 端子通常设置在柔性片状电介质插入件(28)上,并且弹性元件设置在插入件和芯片之间。 可以在与基板接合之前测试芯片和端子的组件。 该组件与衬底的接合不涉及焊接或其它复杂的结合工艺。 组件可以占据仅稍大于芯片本身的面积的区域。

    FABRICATION OF LEADS ON SEMICONDUCTOR CONNECTION COMPONENTS
    3.
    发明申请
    FABRICATION OF LEADS ON SEMICONDUCTOR CONNECTION COMPONENTS 审中-公开
    半导体连接部件引线的制造

    公开(公告)号:WO1996034744A1

    公开(公告)日:1996-11-07

    申请号:PCT/US1996006228

    申请日:1996-05-03

    Applicant: TESSERA, INC.

    Abstract: A substantially continuous layer of a first metal (137) such as copper is provided with strips of a second metal (147) such as gold by selective electroplating of the second metal, or by applying separately formed strips such as lengths of wire. A dielectric support layer (132) is provided in contact with the first metal layer, and the first metal layer is etched to leave strips of the first metal continuous with the strips of the second metal, thereby providing composite leads with the first and second metal strips connected in series. The process provides simple and economical methods of making microelectronic connection components with leads having a flexible, fatigue resistant lead portion formed from a precious metal. The leads may incorporate sections of round cross-sectional shape to facilitate engagement by a bonding tool during use of the component.

    Abstract translation: 第一金属(137)如铜的基本上连续的层通过第二金属的选择性电镀或通过施加单独形成的条(例如一段电线)而设置有诸如金的第二金属(147)的条。 提供与第一金属层接触的电介质支撑层(132),并且蚀刻第一金属层以留下与第二金属的条带连续的第一金属的条带,由此提供具有第一和第二金属的复合引线 条带串联连接。 该方法提供了简单和经济的方法来制造具有由贵金属形成的柔性耐疲劳导线部分的引线的微电子连接部件。 引线可以包括圆形横截面形状的部分,以便于在部件的使用期间通过焊接工具的接合。

    SHAPED LEAD STRUCTURE AND METHOD
    7.
    发明申请
    SHAPED LEAD STRUCTURE AND METHOD 审中-公开
    形状铅结构和方法

    公开(公告)号:WO1995003152A1

    公开(公告)日:1995-02-02

    申请号:PCT/US1994008234

    申请日:1994-07-21

    Applicant: TESSERA, INC.

    Abstract: In a semiconductor inner lead bonding process, a connection component having leads is disposed on a chip surface so that leads lie above contacts (54). A bond region (62) of each lead is forced downwardly by a tool (60) into engagement with a contact (54) on the chip while a first or proximal end (38) of the lead remains attached to a dielectric support structure. The lead is deformed into an S-shaped configuration by moving the bonding tool (60) horizontally towards the proximal or first end (38) of the lead, thereby forcing the bonding region (62) towards the first end (38) and bending or buckling the lead. Alternatively, the lead is bent downwardly by a tool and the tool may then be disengaged from the lead, shifted away from the proximal end (38) of the lead and again advanced downwardly to secure the lead to the chip contact (54).

    Abstract translation: 在半导体内引线接合工艺中,具有引线的连接部件设置在芯片表面上,使得引线位于触点(54)上方。 每个引线的接合区域(62)被工具(60)向下推动成与芯片上的触点(54)接合,同时引线的第一或近端(38)保持附接到电介质支撑结构。 通过将接合工具(60)水平地朝向引线的近端或第一端(38)移动,引线变形为S形构造,从而迫使接合区域(62)朝向第一端(38)并弯曲或 屈服领先。 或者,引线通过工具向下弯曲,然后工具可以从引线脱离,从引线的近端(38)移开,并再次向前推进以将引线固定到芯片接触(54)。

    SEMICONDUCTOR CONNECTION COMPONENTS AND METHODS WITH RELEASABLE LEAD SUPPORT
    8.
    发明申请
    SEMICONDUCTOR CONNECTION COMPONENTS AND METHODS WITH RELEASABLE LEAD SUPPORT 审中-公开
    半导体连接组件和方法与可释放的引线支持

    公开(公告)号:WO1994003036A1

    公开(公告)日:1994-02-03

    申请号:PCT/US1993006930

    申请日:1993-07-23

    Inventor: TESSERA, INC.

    Abstract: A connection component for electrically connecting a semiconductor chip to support substrate incorporates a preferably dielectric supporting structure (70) defining gaps (40). Leads extend across these gaps so that the leads are supported on both sides of the gap (66, 70). The leads therefore can be positioned approximately in registration to contacts on the chip by aligning the connection component with the chip. Each lead is arranged so that one end can be displaced relative to the supporting structure when a downward force is applied to the lead. This allows the leads to be connected to the contacts on the chip by engaging each lead with a tool and forcing the lead downwardly against the contact. Preferably, each lead incorporates a frangible section (72) adjacent one side of the gap and the frangible section is broken when the lead is engaged with the contact. Final alignment of the leads with the contacts on the chip is provided by the bonding tool which has features adapted to control the position of the lead.

    Abstract translation: 用于将半导体芯片电连接到支撑衬底的连接部件包含限定间隙(40)的优选电介质支撑结构(70)。 引线延伸穿过这些间隙,使得引线被支撑在间隙(66,70)的两侧。 因此,引线可以通过将连接部件与芯片对准而大致对准芯片上的触点。 每个引线被布置成使得当向引线施加向下的力时,一端可相对于支撑结构移位。 这允许引线通过使每个引线与工具接合并将引线向下抵靠接触件而连接到芯片上的触点。 优选地,每个引线包括与间隙的一侧相邻的易碎部分(72),并且当引线与触点接合时,易碎部分断裂。 引线与芯片上的触点的最终对准由具有适于控制引线位置的特征的焊接工具提供。

    ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACTS
    9.
    发明申请
    ELECTRICAL CONNECTION WITH INWARDLY DEFORMABLE CONTACTS 审中-公开
    与连接不牢固的电气连接

    公开(公告)号:WO1998026476A1

    公开(公告)日:1998-06-18

    申请号:PCT/US1997023948

    申请日:1997-12-12

    Applicant: TESSERA, INC.

    Abstract: An interposer (50) for interconnection between microelectronic circuit panels (80, 92) has contacts (70, 90) at its surfaces (63, 64). Each contact extends from a central conductor (72), and has a peripheral portion adapted to contract radially inwardly toward the central conductor (72) in response to a force applied by a contact pad (81, 95) defining a central hole (83) on the engaged circuit panel. Thus, when the circuit panels are compressed with the interposers, the contacts (70, 90) contract radially inwardly and wipe across the pads (81, 95). The wiping action facilitates bonding of the contacts to the pads, as by friction welding, or by a conductive bonding material carried on the contacts themselves.

    Abstract translation: 用于微电子电路板(80,92)之间的互连的插入器(50)在其表面(63,64)处具有触点(70,90)。 每个接触件从中心导体(72)延伸,并且响应由限定中心孔(83)的接触垫(81,95)施加的力,具有适于径向向内朝向中心导体(72)收缩的周边部分, 在接合的电路板上。 因此,当电路板被内插件压缩时,触头(70,90)径向向内收缩并擦拭穿过焊盘(81,95)。 擦拭动作有助于通过摩擦焊接将接触件接合到焊盘,或者通过接触件本身承载的导电接合材料。

Patent Agency Ranking