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公开(公告)号：JP2008311316A
公开(公告)日：2008-12-25
申请号：JP2007155706
申请日：2007-06-12
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： IMAI TETSUO , YATABE OSAMU , MAEDA MASAKATSU
IPC: H01L23/14
CPC classification number: H01L23/498 , B22F7/04 , B22F2998/00 , C22C5/02 , C22C5/04 , C22C19/03 , C22C27/04 , C22C32/0047 , C23C18/32 , C23C18/54 , C25D5/48 , C25D5/50 , H01L21/4853 , H01L23/15 , H01L23/49811 , H01L24/45 , H01L24/48 , H01L24/85 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48227 , H01L2224/48599 , H01L2224/48644 , H01L2224/48699 , H01L2224/48744 , H01L2224/85444 , H01L2924/01005 , H01L2924/01006 , H01L2924/01007 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01027 , H01L2924/01028 , H01L2924/01033 , H01L2924/01042 , H01L2924/01046 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/09701 , H01L2924/15787 , H01L2924/20752 , Y10T428/12889 , H01L2924/00014 , B22F9/04 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To provide a metalized substrate having a new structure, and capable of improving connection strength of wire bonding even after heating in mounting a semiconductor chip. SOLUTION: This metalized substrate has, on a high-melting-point metal layer formed on a ceramic substrate, a base nickel plated layer, a layered nickel-phosphorus plated metal layer, a diffusion prevention plated layer and a gold plated layer in this order; any of a nickel plated layer, a nickel-boron plated layer and a nickel-cobalt plated layer is used for the base nickel plated layer; and any of a columnar nickel-boron plated layer, a palladium-phosphorus plated layer and a palladium plated layer is used for the diffusion prevention plated layer. COPYRIGHT: (C)2009,JPO&INPIT
Abstract translation: 要解决的问题：提供具有新结构的金属化基板，并且即使在安装半导体芯片的加热之后也能够提高引线接合的连接强度。 解决方案：该金属化基板在形成在陶瓷基板上的高熔点金属层上具有基底镀镍层，层状镍 - 磷电镀金属层，扩散防止镀层和镀金层 按此顺序 镀镍层中使用镍镀层，镍 - 硼镀层和镍钴镀层中的任一种， 并且使用任何柱状镍 - 硼电镀层，钯 - 磷镀层和镀钯层作为防扩散镀层。 版权所有（C）2009，JPO＆INPIT
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公开(公告)号：JP2007150050A
公开(公告)日：2007-06-14
申请号：JP2005343724
申请日：2005-11-29
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： YOKOYAMA HIROKI , MAEDA MASAKATSU
IPC: H05K3/12
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board by which a metal wiring pattern for large current can be formed on an aluminum nitride substrate superior in heat dissipation in a manner that it is rigidly adhered to the substrate, and of which workability is very appropriate.
SOLUTION: A first base film 22 is made of at least one kind of metal or compound selected from a group including titanium, nickel-chromium alloy, tantalum nitride, aluminum, molybdenum, and tungusten, and is formed on the surface of a ceramic substrate 10 made mainly of aluminum nitride; and a second base film 24 made of at least one kind of metal selected from a group including gold, silver, platinum, and copper is formed in an atmosphere containing substantially no oxygen. Then, its surface is cleaned and a wiring pattern 30 is formed by printing method, and the substrate is baked. Finally, the first base film 22 and the second base film 24 are removed so that the respective wirings of the wiring patterns may not be electrically connected.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供一种制造印刷线路板的方法，通过该印刷线路板，能够以高度散热的氮化铝基板形成用于大电流的金属布线图案，使其刚性地附着于基板 ，其可操作性非常合适。 解决方案：第一基膜22由至少一种选自钛，镍 - 铬合金，氮化钽，铝，钼和钨石的金属或化合物制成，并且形成在 主要由氮化铝制成的陶瓷基板10; 并且在基本上不含氧的气氛中形成由选自金，银，铂和铜的组中的至少一种金属制成的第二基膜24。 然后，其表面被清洁，并且通过印刷方法形成布线图案30，并且烘烤基板。 最后，去除第一基膜22和第二基膜24，使得布线图案的各个布线可能不电连接。 版权所有（C）2007，JPO＆INPIT
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23.发明专利Tungsten fine wiring and forming method therefor tungsten fine wiring 审中-公开TUNGSTEN FINE接线和形成方法，其中TUNGSTEN FINE WIRING
公开(公告)号：JP2006332173A
公开(公告)日：2006-12-07
申请号：JP2005150802
申请日：2005-05-24
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： YAMAMOTO YASUYUKI , MAEDA MASAKATSU
IPC: H01S5/022
Abstract: PROBLEM TO BE SOLVED: To provide a method for efficiently forming a tungsten conductive pattern of a thick film by using photo lithography.
SOLUTION: In the tungsten fine wiring forming method, an opening corresponding to a wiring pattern is formed in photoresist formed on a ceramic substrate, the opening is filled with paste comprising tungsten and binder resin, and tungsten in paste is sintered. The method comprises a process for performing heating at not less than a temperature with which photoresist and binder resin burn/burn down in gas atmosphere comprising steam after the opening is filled with paste, and a process for performing heating at not less than a temperature with which tungsten sinters in a reducing atmosphere.
COPYRIGHT: (C)2007,JPO&INPITAbstract translation: 要解决的问题：提供通过使用光刻法有效地形成厚膜的钨导电图案的方法。 解决方案：在钨精细布线形成方法中，在陶瓷基板上形成的光致抗蚀剂中形成对应于布线图案的开口，该开口填充有包含钨和粘合剂树脂的浆料，并且烧结钨浆。 该方法包括在不低于在开口充满浆料之后不低于光致抗蚀剂和粘合剂树脂在包括蒸汽的气体气氛中燃烧/燃烧的温度下进行加热的方法，以及在不低于温度下进行加热的方法， 该钨在还原气氛中烧结。 版权所有（C）2007，JPO＆INPIT
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公开(公告)号：JP2006196854A
公开(公告)日：2006-07-27
申请号：JP2005123616
申请日：2005-04-21
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： YAMAMOTO YASUYUKI , MAEDA MASAKATSU , GOTO KUNIHIRO
CPC classification number: H05K3/4667 , C04B41/009 , C04B41/52 , C04B41/90 , C04B2111/00844 , H05K1/092 , C04B41/4539 , C04B41/4572 , C04B41/5063 , C04B41/0072 , C04B41/5133 , C04B41/4578 , C04B41/51 , C04B35/581
Abstract: PROBLEM TO BE SOLVED: To prevent a conductive paste from flowing or spreading in the manufacturing method of a metallized ceramic substrate by forming and sintering a conductive paste layer on a ceramic substrate.
SOLUTION: The manufacturing method of the metallized ceramic substrate includes a process (A) that prepares a raw material substrate comprising the ceramic substrate which may have a conductive layer or conductive paste layer on the surface of the substrate, a metallized ceramics substrate precursor adjusting process (B) including a process that forms the ceramic paste layer on the raw material substrate and a process that forms the conductive paste layer on the ceramic paste layer, and a process (C) that sinters a metallized ceramic substrate precursor obtained in the afore-mentioned process. In the process (B), the formation of the ceramic layer and that of the conductive past layer may be alternately repeated a plurality of times. This allows the multilayer of the conductive layers to be easily realized.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：通过在陶瓷基板上形成和烧结导电浆料层，防止导电浆料在金属化陶瓷基板的制造方法中流动或扩展。 解决方案：金属化陶瓷基板的制造方法包括制备包括陶瓷基板的原料基板的工艺（A），该基板在基板的表面上可以具有导电层或导电浆料层，金属化陶瓷基板 包括在原料基板上形成陶瓷浆料层的工序和在陶瓷浆料层上形成导电浆料层的工序的前体调整工序（B）以及烧结金属化陶瓷基板前体的方法（C） 上述过程。 在工序（B）中，陶瓷层的形成和导电性过渡层的形成可以交替重复多次。 这允许容易地实现导电层的多层。 版权所有（C）2006，JPO＆NCIPI
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公开(公告)号：JP2006156470A
公开(公告)日：2006-06-15
申请号：JP2004340773
申请日：2004-11-25
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： MAEDA MASAKATSU , YAMAMOTO YASUYUKI , GOTO KUNIHIRO
CPC classification number: H01L23/49822 , H01L21/4857 , H01L33/486 , H01L2924/0002 , H01L2924/09701 , H05K1/0306 , H05K3/28 , H05K3/3452 , H05K2201/017 , H01L2924/00
Abstract: PROBLEM TO BE SOLVED: To prevent defective mounting of an element due to the thickness of a ceramic coating layer at the time of mounting the element, and to prevent delamination and cracking of an electrode layer due to a shock at the time of dicing, in a substrate for mounting an element wherein part of the electrode layer is coated with ceramic.
SOLUTION: The substrate for mounting an element consists of a ceramic substrate, the electrode layer formed on the ceramic substrate, and the ceramic coating layer having a thickness of 5-50 μm which is formed on part of the electrode layer. A method of manufacturing the substrate for mounting an element comprises processes of forming an electrode precursor layer to the pattern of the electrode layer on a ceramic board or green sheet having a large diameter, forming a ceramic coating precursor layer on part of the electrode precursor layer, and baking the obtained precursor. It is preferred that the ceramic coating layer is so formed as to coat the electrode layer on the lines of the baked object along which the baked object is to be cut.
COPYRIGHT: (C)2006,JPO&NCIPIAbstract translation: 要解决的问题：为了防止在安装元件时由于陶瓷涂层的厚度而导致的元件的安装不良，并且防止由于在时间上的冲击而导致的电极层的分层和破裂 在用于安装其中电极层的一部分被陶瓷涂覆的元件的基板中进行切割。 解决方案：用于安装元件的基板由陶瓷基板，形成在陶瓷基板上的电极层和形成在电极层的一部分上的厚度为5-50μm的陶瓷涂层组成。 制造用于安装元件的基板的方法包括在具有大直径的陶瓷板或生片上形成电极前体层到电极层的图案的步骤，在电极前体层的一部分上形成陶瓷涂层前体层 ，并烘烤得到的前体。 优选的是，陶瓷涂层形成为涂覆被烘焙物体沿着烘烤物体的切割线的电极层。 版权所有（C）2006，JPO＆NCIPI
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Patent Agency Ranking
公开(公告)号：JP2003017837A
公开(公告)日：2003-01-17
申请号：JP2001196422
申请日：2001-06-28
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： AZUMA MASANOBU , MAEDA MASAKATSU
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed wiring board with high efficiency, where the printed wiring board is composed of a board whose main component is AlN and a copper wiring pattern formed on the board, and the adhesion of the wiring pattern to the board material is sufficiently high in strength.
SOLUTION: A first primary film of Ti or the like, superior in adhesion to a board whose main component is AlN, is formed on the board a second primary film of copper is formed on the first primary film, through a method such as a sputtering method in which a film can be formed in a substantially oxygen-free atmosphere, copper wiring patterns are formed thereon through a plating method, and lastly the first primary film and the second primary film are removed, so as not to electrically connect the wiring patterns of wiring.
COPYRIGHT: (C)2003,JPOAbstract translation: 要解决的问题：为了提供一种高效率地制造印刷电路板的方法，其中印刷电路板由主要成分为AlN的基板和形成在基板上的铜布线图案组成，并且布线的粘合 板材的图案强度足够高。 解决方案：通过诸如溅射的方法在第一初级膜上形成第一初级膜，在基板上形成第二初级膜，在基板上形成具有优异的主要成分为AlN的板的粘合性优异的Ti等的第一主膜， 可以在基本上无氧气氛中形成膜的方法，通过电镀法在其上形成铜布线图案，最后去除第一初级膜和第二初级膜，以便不将布线图案 的接线。
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公开(公告)号：JPH11322455A
公开(公告)日：1999-11-24
申请号：JP13174998
申请日：1998-05-14
Applicant: TOKUYAMA CORP
Inventor： IMAI TETSUO , MAEDA MASAKATSU , KAMIYAMA YOSHIHIDE
Abstract: PROBLEM TO BE SOLVED: To inexpensively produce a ceramics/metal bonded body high in reliability to cryogenic cycle and excellent in thermal impact resistance. SOLUTION: This bonded body is formed by laminating a ceramic board and a metal board, wherein an edge face of the metal board is inclined as approaching to side of the ceramic board along to an edge line of the metal board, and further the shape of an end face cut by a vertical plane to the metal board is convex to the side of the ceramic board. The bonded body is prepared by etching the metal board using an etching solution having a liq. viscosity of m sec after binding the ceramics board to the metal board.
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公开(公告)号：JPH07153866A
公开(公告)日：1995-06-16
申请号：JP29564293
申请日：1993-11-25
Applicant: TOKUYAMA CORP
Inventor： MAEDA MASAKATSU , MIYAHARA KENICHIRO
Abstract: PURPOSE:To prevent the oxidation of Cu of a conductor during package sealing in an oxidized atmosphere by applying a film containing Ag as main component on the surface of the conductor of a ceramic circuit substrate constituted by joining a ceramic body to a conductor with Cu as a main component. CONSTITUTION:A Cu conductor 2 made of metal foil is joined to part of a single surface of an AlN substrate 1, and AlN member 1' is joined to the Cu conductor 2. As a Cu conductor, a Cu-based thick film paste or a Cu thin film may be used instead of metal foil. And a film 4 containing Ag as a main component is applied to part of the surface of a Cu conductor 2. The region where a film is formed is not specially limited. Moreover, a lead frame 7 is fixed to the AlN member 1' by using borosilicate lead glass. On this ceramic circuit substrate, the oxidation of the conductor with Cu of circuit substrate as main component does not occur normally even during the fixation of lead frame performed in oxidation atmosphere at about 480 deg.C.
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公开(公告)号：JP2008218905A
公开(公告)日：2008-09-18
申请号：JP2007057528
申请日：2007-03-07
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： YAMAMOTO YASUYUKI , MAEDA MASAKATSU , YATABE OSAMU
IPC: H05K3/24
Abstract: PROBLEM TO BE SOLVED: To provide a method of manufacturing a wiring substrate capable of easily forming wiring patterns made of a plurality of metals.
SOLUTION: A method of manufacturing a wiring substrate includes a step of forming wiring patterns whose surface is at least partly formed with a first metal on an insulating substrate, and a step of contacting a second metal with the surface formed by the first metal of wiring patterns, heating it above the melting point of the second metal to coat the surface formed by the first metal of wiring patterns by the second metal. In the method, the melting point of the second metal is set to be lower than that of the first metal. A contact angle of the melted second metal to the solid first metal is set to be 10 degrees or less, and a contact angle of the melted second metal to the insulating substrate is set to be 100 degrees or more.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种能够容易地形成由多种金属制成的布线图案的布线基板的制造方法。 解决方案：一种制造布线基板的方法包括在绝缘基板上形成表面至少部分地形成有第一金属的布线图案的步骤，以及使第二金属与由第一金属形成的表面接触的步骤 金属的布线图案，将其加热到第二金属的熔点以上以由第二金属涂覆由第一金属布线图形形成的表面。 在该方法中，将第二金属的熔点设定为低于第一金属的熔点。 将熔融的第二金属与固体第一金属的接触角设定为10度以下，将熔融的第二金属与绝缘性基板的接触角设定为100度以上。 版权所有（C）2008，JPO＆INPIT
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公开(公告)号：JP2008047604A
公开(公告)日：2008-02-28
申请号：JP2006219533
申请日：2006-08-11
Applicant: Tokuyama Corp , 株式会社トクヤマ
Inventor： MAEDA MASAKATSU , YAMAMOTO YASUYUKI , SUGAWARA KEN
Abstract: PROBLEM TO BE SOLVED: To provide a metallized substrate that enhances light-emission efficiency while efficiently discharging light, emitted from a semiconductor light-emitting element, to the outside; maintains a thickness of a solder layer when the semiconductor light-emitting element is bonded; improves bonding strength of a semiconductor device while improving adhesion between the solder layer and an electrode of the metallized substrate; and minimizes resistance between a device terminal and a substrate electrode.
SOLUTION: The metallized substrate is composed of a ceramic substrate, a first active metal layer formed on the ceramic substrate, an aluminum electrode formed on the first active metal layer, a barrier layer formed on at least a part of the surface of the aluminum electrode, and the solder layer formed on the barrier layer.
COPYRIGHT: (C)2008,JPO&INPITAbstract translation: 要解决的问题：提供一种有效地从半导体发光元件发射的光向外部放电的提高发光效率的金属化基板; 当半导体发光元件接合时，保持焊料层的厚度; 提高半导体器件的接合强度，同时提高焊料层与金属化基板的电极之间的粘附性; 并且最小化器件端子和衬底电极之间的电阻。 解决方案：金属化衬底由陶瓷衬底，形成在陶瓷衬底上的第一有源金属层，形成在第一有源金属层上的铝电极，形成在至少一部分表面上的阻挡层 铝电极和形成在阻挡层上的焊料层。 版权所有（C）2008，JPO＆INPIT
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