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    BONDED STRUCTURE
    3.
    发明专利
    BONDED STRUCTURE 失效

    公开(公告)号：JPH08293569A

    公开(公告)日：1996-11-05

    申请号：JP10844495

    申请日：1995-05-02

    Applicant: TOKUYAMA CORP

    Inventor： MIYAHARA KENICHIRO

    IPC: H01L23/12 ,  H01L23/08 ,  H01L23/10

    Abstract: PURPOSE: To provide a semiconductor element mounting package excellent in heat dissipating properties, electrical properties, thermal shock resistance, moisture resistance, and heat resistance by a method wherein the semiconductor element mounting package is formed of a bonded structure which is excellent in thermal shock resistance, moisture resistance, thermal resistance, and reliability and composed of two boards, a frame-like circuit board and a heat dissipating board. CONSTITUTION: A heat dissipating board 1 and a circuit board 2 are bonded into a laminated structure through the intermediary of an adhesive agent layer 4 such as silicone rubber adhesive agent whose elastic modulus is less than 10kg/mm at a temperature of 25 deg.C, and a semiconductor element mounting package is formed of the above laminated structure.

    SEMICONDUCTOR CHIP MOUNTING PACKAGE
    4.
    发明专利
    SEMICONDUCTOR CHIP MOUNTING PACKAGE 失效

    公开(公告)号：JPH08115996A

    公开(公告)日：1996-05-07

    申请号：JP24941294

    申请日：1994-10-14

    Applicant: TOKUYAMA CORP

    Inventor： KATOU YUKA ,  MIYAHARA KENICHIRO

    IPC: H01L23/12

    Abstract: PURPOSE: To provide a novel semiconductor mounting package whose die- bondability and sealability are improved by reducing the warp of the semiconductor chip mounting package, on which a metal sheet power supply layer and a metal sheet ground layer are laminated with an adhesive layer in between. CONSTITUTION: The semiconductor chip mounting pakage on the board of which a metal sheet power supply layer 5 and a metal sheet ground layer 8 are laminated with an adhesive layer 6 in between. The Vickers hardness of one of the metal sheet power supply layer 5 or the metal sheet ground layer 8 that is joined to the board with the adhesive layer in between is not more than 130.

    MANUFACTURE OF SEMICONDUCTOR CHIP MOUNTING PACKAGE
    5.
    发明专利
    MANUFACTURE OF SEMICONDUCTOR CHIP MOUNTING PACKAGE 失效

    公开(公告)号：JPH0897343A

    公开(公告)日：1996-04-12

    申请号：JP23328394

    申请日：1994-09-28

    Applicant: TOKUYAMA CORP

    Inventor： MAEDA MASAKATSU ,  MIYAHARA KENICHIRO

    IPC: H01L23/50

    Abstract: PURPOSE: To provide package manufacture which allows easy removal of unnecessary lead parts and improves shear position accuracy by connecting some leads of a lead frame for a signal layer with the leads for forming the outer lead of a power source layer plane and the outer lead of a grounding layer plane. CONSTITUTION: A power source layer plane 3a and a grounding layer plane 4a have a metal strip-shaped outer lead 6, whose edge is held by a tie-bar 8, on the outer circumference. A signal layer lead frame 5 is formed of a plurality of strip-shaped leads 7, which include a lead held by a tie-bar 10 at the edge and is to be the connecting terminal to the outer leads of the power source layer plane and the grounding layer plane. The power source layer plane 3a, the grounding layer plane 4a and the signal layer lead frame 5 are stacked, and the outer leads 6 of the power source layer plane and the grounding layer plane are connected with the lead to be the connecting terminal for the signal layer lead frame 5. Then the tie-bar 8 for the power source layer plane and the grounding layer plane is moved to and fro, using the connecting part as a supporting point and the joint 11 is bent. Then, unnecessary outer leads are removed by shearing and a package is manufactured.

    CERAMIC HEATER
    6.
    发明专利
    CERAMIC HEATER 失效

    公开(公告)号：JPH07211437A

    公开(公告)日：1995-08-11

    申请号：JP120594

    申请日：1994-01-11

    Applicant: TOKUYAMA CORP

    Inventor： NAKAO KOJI ,  MIYAHARA KENICHIRO

    IPC: H05B3/20

    Abstract: PURPOSE:To provide a ceramic heater excellent also in durability to the repeat of temperature rise and temperature drop by improving the temperature rise and temperature drop of the whole heater corresponding to the turn on and turn off of the power source of a heating element. CONSTITUTION:This is a ceramic heater of such structure that an aluminum nitride sintered substance is joined across the current application part consisting of a heating element pattern 4. The joining of the aluminum nitride sintered substance 1 is made by interposing a metallized layer 5 of at least one kind of metal being selected from among gold, silver, and copper into the non-current- application part of the joining face.

    PACKAGE FOR MOUNTING SEMICONDUCTOR ELEMENT
    7.
    发明专利
    PACKAGE FOR MOUNTING SEMICONDUCTOR ELEMENT 失效

    公开(公告)号：JPH07335792A

    公开(公告)日：1995-12-22

    申请号：JP12664094

    申请日：1994-06-08

    Applicant: TOKUYAMA CORP

    Inventor： OGOSHI TOKIO ,  MIYAHARA KENICHIRO

    IPC: H01L23/34

    Abstract: PURPOSE:To prevent warps and the like in a crack package with a ceramic frame by bonding a copper plate to one side of the ceramic frame to form a cavity, and forming at the bottom of the cavity a stress absorbing region to absorb part of thermal stress. CONSTITUTION:A copper plate 1 is bonded to one side of a ceramic frame 2 to form a cavity 7. A stress absorbing region G is formed on the periphery of the copper plate 1 that constitutes the bottom of the cavity 7; the stress absorbing region G absorbs thermal stress on the ceramic frame 2 and the copper plate 1 through deformation in the copper plate 1. A stress fixing member 4 that prevents the copper plate 1 from being deformed is placed at the central portion of the copper plate 1 to form a semiconductor mounting region D. The thickness of the copper plate 1 is set to 0.05-1.1mm in the stress absorbing region G. The thickness of the stress fixing region E, the width d of the stress absorbing region G, and so on are properly selected according to the thickness of the copper plate 1 and the area of the bottom of the cavity. Part or all of the height h of the projection in the copper plate 1, forming the stress absorbing region G, may be ground for higher flatness.

    CERAMIC HEATER
    8.
    发明专利
    CERAMIC HEATER 失效

    公开(公告)号：JPH07201459A

    公开(公告)日：1995-08-04

    申请号：JP33816793

    申请日：1993-12-28

    Applicant: TOKUYAMA CORP

    Inventor： YAMAMOTO TAMAO ,  MIYAHARA KENICHIRO

    IPC: H05B3/20

    Abstract: PURPOSE:To provide temperature control in high accurate and further to improve a follow-up property relating to setting a temperature by providing a metal heating unit layer of high electric conductivity, having high adhesive strength, in an aluminum nitride sintered base body surface of good heat conductivity. CONSTITUTION:By using a metal heating unit mainly composed of Ag-Pd alloy containing palladium in a specific range, even when repeated a heating/cooling cycle, adhesive strength to an aluminum nitride base body is not decreased, and further high accurate and quick temperature control can be attained. That is, by forming a metal heating unit layer, mainly composed of alloy with 0.3:99.7 to 40:60 weight ratio of palladium to silver by consisting of palladium and silver, in a surface of the aluminum nitride sintered body, a high accurate further quick increasing/decreasing temperature speed is obtained, and further temperature distribution can be uniformly obtained.

    Method for manufacturing optical waveguide
    9.
    发明专利
    Method for manufacturing optical waveguide 审中-公开
    制造光波导的方法

    公开(公告)号：JP2003014966A

    公开(公告)日：2003-01-15

    申请号：JP2001201911

    申请日：2001-07-03

    Applicant: Takashi Matsuura ,  Tokuyama Corp ,  孝 松浦 ,  株式会社トクヤマ

    Inventor： MATSUURA TAKASHI ,  MUROTA JUNICHI ,  MIYAHARA KENICHIRO ,  NONAKA TORU ,  MITSUNABE YUICHIRO

    IPC: G02B6/13 ,  G02B6/12

    Abstract: PROBLEM TO BE SOLVED: To provide a method for manufacturing an optical waveguide by which an optical waveguide having a core pattern formed on a substrate and suitable to be used as an optical integrated circuit having large difference in the refractive index between the clad and core can be easily manufactured without performing complicated processes of forming and removing a resist pattern and etching. SOLUTION: After a film of a photosensitive material, for example, consisting of a mixture of polymethyl silazane and a photoacid producing agent is formed on a substrate of quartz or the like, the film is exposed by using a photomask having the core pattern of the optical waveguide and then developed to form the core pattern consisting of a photosensitive material on the substrate. Then the photosensitive material constituting the core pattern is heat-treated, for example, at about 900 deg.C in an argon atmosphere to stabilize and increase the refractive index to form the optical waveguide.

    Abstract translation: 要解决的问题：提供一种制造光波导的方法，其中具有形成在基板上的芯图案的光波导适合用作包层和芯之间的折射率差大的光集成电路 容易地制造而不执行形成和去除抗蚀剂图案和蚀刻的复杂工艺。 解决方案：在石英等的基板上形成感光材料膜，例如由聚甲基硅氮烷和光致酸产生剂的混合物组成的薄膜，通过使用具有核心图案的光掩模来曝光该膜 光波导，然后显影以形成由基底上的感光材料组成的芯图案。 然后将构成芯图案的感光材料在氩气气氛中例如在约900℃下进行热处理，以稳定和增加折射率以形成光波导。

    NON-AQUEOUS ELECTROLYTE SECONDARY CELL
    10.
    发明专利
    NON-AQUEOUS ELECTROLYTE SECONDARY CELL 失效

    公开(公告)号：JP2000228223A

    公开(公告)日：2000-08-15

    申请号：JP2928999

    申请日：1999-02-05

    Applicant: TOKUYAMA CORP

    Inventor： OKANO CHISUI ,  MIYAHARA KENICHIRO

    IPC: H01M4/13 ,  H01M10/05 ,  H01M10/0566 ,  H01M10/058 ,  H01M10/40 ,  H01M4/02

    Abstract: PROBLEM TO BE SOLVED: To improve conductivity between the electrodes, lower the internal resistance, and improve output density while high energy density is kept by interposing electron non-conductive particles between the positive electrode and the negative electrode, and filling the gap with an electrolytic solution. SOLUTION: Electron non-conductive particles are interposed between the opposite positive and negative electrodes, and a gap therebetween is filled with an electrolytic solution. It will be sufficient that the electron non-conductive particle is a material for inhibiting self-discharging, and as the particles, used are inorganic compound particles such as a carbide containing designated elements, a nitride or the like, or high polymer compound particles such as fluororesin, silicone resin. The particles structure is not especially limited, it may be one of polycrystalline, monocrystalline, and amorphous material, the shape is such that it is uniform spherical with a particle diameter of 1-100 μm to eliminate variation, and the particle diameter distribution is a particle layer where particles are uniformly distributed in two dimensions with a deviation within 50% of the average particle diameter, and fixed in parallel between the positive and negative electrodes. When electron non-conductive particles are interposed between the positive and negative electrodes, a short circuit between the electrodes is prevented so as to ensure conductivity.

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