公开(公告)号：JP2002256147A

公开(公告)日：2002-09-11

申请号：JP2001059874

申请日：2001-03-05

Applicant: TORAY INDUSTRIES

Inventor： MIYAMOTO KAZUKI ,  ISHIO ATSUSHI

IPC: C08L81/02 ,  C08K3/22 ,  C08K3/34 ,  C08K3/40 ,  C08K7/00

Abstract: PROBLEM TO BE SOLVED: To provide a polyphenylene sulfide resin composition excellent in thermal conductivity, dimensional stability, heat resistance, low gas property, and melt flowability. SOLUTION: This heat conductive resin composition is prepared by compounding a polyphenylene sulfide (a), alumina (b), and a flaky filler (c).

公开(公告)号：JP2002038009A

公开(公告)日：2002-02-06

申请号：JP2000220394

申请日：2000-07-21

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  MIYAMOTO KAZUKI ,  YAMANAKA TORU

IPC: G02B1/04 ,  C08J5/00 ,  C08K3/00 ,  C08K5/54 ,  C08K5/541 ,  C08K7/02 ,  C08K9/04 ,  C08L81/02

Abstract: PROBLEM TO BE SOLVED: To obtain a polyphenylene sulfide resin composition having a small size change by heat and high rigidity, and to provide an injection-molding product. SOLUTION: A polyphenylene sulfide resin composition comprises comprising (B) 0.1-100 pts.wt. of a swelling lamellar silicate and (C) 10-400 pts.wt. of a non-fibrous filler to (A) 100 pts.wt. of a polyphenylene sulfide resin.

公开(公告)号：JP2001348478A

公开(公告)日：2001-12-18

申请号：JP2000171617

申请日：2000-06-08

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  MIYAMOTO KAZUKI

IPC: G02B1/04 ,  B29C45/00 ,  C08J5/00 ,  C08J5/04 ,  C08K3/04 ,  C08K7/02 ,  C08L81/02

Abstract: PROBLEM TO BE SOLVED: To provide a polyphenylene sulfide resin composition having little dimension change by heat and a high rigidity, and an injection molding therefrom. SOLUTION: This polyphenylene sulfide resin composition is provided by compounding 0.5-15 pts.wt. carbon black (B) and 50-200 pts.wt. non-fibrous filler (C) to 100 pts.wt. polyphenylene sulfide resin (A), and the carbon black (B) has a pH value of not lower than 8.

公开(公告)号：JP2001247767A

公开(公告)日：2001-09-11

申请号：JP2000061418

申请日：2000-03-07

Applicant: TORAY INDUSTRIES

Inventor： MIYAMOTO KAZUKI ,  ISHIO ATSUSHI

IPC: C08L81/02 ,  C08K3/22 ,  C08K7/18 ,  C08K9/04 ,  C08K9/06 ,  C08K13/04 ,  C08K13/06

Abstract: PROBLEM TO BE SOLVED: To provide a polyphenylene sulfide resin composition excellent in thermal conductivity without impairing its flowability. SOLUTION: This resin composition is characterized by including (a) 10-80 wt.% of a polyphenylene sulfide resin, (b) 20-85 wt.% of α-alumina =5 μm in α-crystal grain size.

公开(公告)号：JP2000281786A

公开(公告)日：2000-10-10

申请号：JP8898499

申请日：1999-03-30

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  KOBAYASHI KAZUHIKO

IPC: C08G75/02 ,  C08G75/0277 ,  C08K3/00 ,  C08K3/013 ,  C08L81/02

Abstract: PROBLEM TO BE SOLVED: To improve the color the tone and mechanical strengths of a polyphenylene sulfide resin or a composition comprising a polyphenylene sulfide resin and additives and/or fillers by supplying the resin or the composition to a thin-film evaporator of a vertical agitation type to cause the resin or the composition to pass through the evaporator to thereby decrease the volatile content. SOLUTION: The polyphenylene sulfide resin treated as above-mentioned is introduced into an extruder and is mixed with additives and/or filers to give the polyphenylene sulfide resin composition. The treated resin or the composition can be melt extruded and pelletized. Preferably, the ratio (B)/(A) of the wt. loss (B) on heating of thus prepared resin pellets to the sum (A) of the wt. losses of all the raw materials is lower than 0.9. The pellets are molded to give molded articles such as electric and electronic parts, precision machinery components and automotive parts.

公开(公告)号：JP2000265059A

公开(公告)日：2000-09-26

申请号：JP6592999

申请日：1999-03-12

Applicant: TORAY INDUSTRIES ,  MITSUI CHEMICALS INC

Inventor： ISHIO ATSUSHI ,  SHIMASAKI NORIO ,  KOBAYASHI KAZUHIKO ,  TODO AKIRA ,  MATSUNAGA SHINYA

IPC: C08K7/14 ,  C08L23/26 ,  C08L51/06 ,  C08L81/02

Abstract: PROBLEM TO BE SOLVED: To obtain a polyphenylene sulfide(PPS) resin composition which has a balance in a higher level with respect to impact resistance, low temperature impact resistance, moldability and the like, as compared to those of conventional PPS resin materials, is well-balanced and excellent with respect to characteristics inherent to PPS resins such as mechanical properties other than impact resistance and hot-water resistance, and is excellent also with respect to the productivity and economy in commercial production. SOLUTION: The composition is prepared by compounding (A) 100 pts.wt. of PPS and (B) 1-100 pts.wt. of a modified polyolefin which is obtained by modifying an ethylene α-olefin copolymer, which comprises ethylene and a 3-20C α-olefin and has a weight average molecular weight (Mw)/number average molecular weight (Mn) ratio of 3.0 or less, as calculated by the gel permeation chromatography(GPC), with an olefin compound having at least one functional group selected from epoxy group, acid anhydride group, carboxy group and salts thereof, and carboxylates.

公开(公告)号：JPH11156970A

公开(公告)日：1999-06-15

申请号：JP32466597

申请日：1997-11-26

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  SHIMASAKI NORIO ,  KOBAYASHI SADAYUKI

IPC: F16L9/12 ,  B32B1/08 ,  B32B27/00

Abstract: PROBLEM TO BE SOLVED: To provide a multi-layer hollow molding made of thermoplastic resin which shows outstanding heat resistance, hot water resistance, chemical resistance, antigas hole permeability, tenacity, interlayer adhesive properties or the like, all of these being well-balanced, and further, conductivity. SOLUTION: This multilayer hollow molding is made up of at least, two or more thermoplastic resin layers and at least, one or more adhesive layer, and at least, one layer among the other thermoplastic resin layers is formed of a composition which is composed mainly of a polyphenylene sulfide resin, and at least, one layer of the thermoplastic resin layers is formed of a thermoplastic resin composition which is composed mainly of a thermoplastic resin other than the polyphenylene sulfide resin. In addition, between (A) layer and (B) layer, an adhesive layer which has adhesive properties with the (A) layer and the (B) layer (provided, however, that the main constituent components of the adhesive layer are different from those of the (A) layer and the (B) layer), is present.

公开(公告)号：JPH11106647A

公开(公告)日：1999-04-20

申请号：JP27622697

申请日：1997-10-08

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  SHIMAZAKI NORIO ,  KOBAYASHI KAZUHIKO

IPC: C08K13/02 ,  C08L53/00 ,  C08L77/00

Abstract: PROBLEM TO BE SOLVED: To obtain the subject composition having surface smoothness, toughness, extrusion formability, electrostatic property, etc., which are excellent and well balanced with each other, and useful as a composition for blow molding by compounding a polyamide resin, a carboxylic acid-modified or carboxylic anhydride-modified elastomer, an electroconductive filler and a plasticizer each in a specific amount. SOLUTION: This composition is obtained by compounding 100 pts.wt. of a polyamide resin (preferably, polyamide 11), 1-100 pts.wt. of a carboxylic acid- modified or carboxylic anhydride-modified elastomer (preferably, it consists of a vinyl aromatic compound polymer block and an olefinic compound polymer block, and the block copolymer is modified with a carboxylic acid or a carboxylic anhydride), 1-100 pts.wt. of an electroconductive filter (preferably, a filler of powdery, granular, tabular or flaky shape, or of fibrous shape having a length/diameter ratio of

公开(公告)号：JPH10298430A

公开(公告)日：1998-11-10

申请号：JP10989797

申请日：1997-04-25

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  SHIMASAKI NORIO ,  KOBAYASHI KAZUHIKO

IPC: C08K3/34 ,  C08L81/02 ,  H01B3/30

Abstract: PROBLEM TO BE SOLVED: To obtain a resin compsn. excellent in tracking resistance by compounding a polyphenylene sulfide resin with kaolin and talc or magnesium hydroxide in a specified wt. ratio. SOLUTION: This compsn. contains 100 pts.wt. resin component comprising a polyphenylene sulfide resin having a melt viscosity (310 deg.C, a shear rate of 1,000 sec ) of 1,000 P or lower alone or together with 0.5-50 wt.% other resin, 15-300 pts.wt. kaolin, and 5-275 pts.wt. talc or magnesium hydroxide, the sum of kaolin and talc or magnesium hydroxide being 30-300 pts.wt., and further contains 10-300 pts.wt. other filler and 0.05-5 pts.wt. alkoxysilane compd. having at least one kind of functional group selected from among epoxy. amino, isocyanate, and hydroxyl groups, etc. Kaolin having an Al content (in terms of Al2 O3 ) of 35-42 wt.% and a wt. loss caused by heating from room temp. to 750 deg.C (in an air stream, at a temp. rise rate of 20 deg.C/min) of 3 wt.% or higher is used.

公开(公告)号：JPH10296889A

公开(公告)日：1998-11-10

申请号：JP4002498

申请日：1998-02-23

Applicant: TORAY INDUSTRIES

Inventor： ISHIO ATSUSHI ,  SHIMASAKI NORIO ,  TATEYAMA MASARU

IPC: B65D1/00 ,  B29C47/06 ,  B29K81/00 ,  B29K101/12 ,  B29K105/16 ,  B29L9/00 ,  B29L23/00 ,  B32B1/08 ,  B32B27/00 ,  B32B27/18 ,  B65D1/09 ,  C08K3/00 ,  C08K3/04 ,  C08K5/00 ,  C08L23/00 ,  C08L81/04 ,  C08L101/00

Abstract: PROBLEM TO BE SOLVED: To provide a thermoplastic resin multi-layered hollow formed body, which is balanced and excellent in heat resistance, resistance to hot water, resistance to chemicals, resistance to permeation of alcohol and gasoline, tenacity, surface smoothness, interlaminar adhesion, and the like, and has electrical conductivity. SOLUTION: A multi-layered hollow formed body is composed of at least three-layered thermoplastic resin layers, where at least one layer is composed of polyphenylene sulfide resin composition, at least one layer is composed of thermoplastic resin excluding polyphenylene sulfide resin or thermoplastic resin composition containing, as an ingredient, thermoplastic resin excluding polyphenylene sulfide resin, and at least one layer is composed of electrical conductivity thermoplastic resin composition containing, as an essential ingredient, electrical conductivity filler and/or electrical conductivity polymer.