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公开(公告)号：DE69736426T2
公开(公告)日：2007-08-02
申请号：DE69736426
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
IPC: B32B27/00 , B29C49/00 , B29C49/22 , B32B1/08 , B32B27/08 , C08K3/04 , C08L81/04 , F16L11/118 , H01B1/20 , H01B1/22 , H01B1/24
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers, in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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公开(公告)号：SG166665A1
公开(公告)日：2010-12-29
申请号：SG2000033761
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers,in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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公开(公告)号：MY159043A
公开(公告)日：2016-12-15
申请号：MYPI2010002089
申请日：2007-11-08
Applicant: TORAY INDUSTRIES
Inventor： UNOHARA TAKESHI , MAKABE YOSHIKI , NAKAMURA NAOYA , SAITOH KEI , ISHIO ATSUSHI , INOHARA MASAHIRO
IPC: C08G75/02 , C08G75/0213 , C08G75/0259
Abstract: A PROCESS FOR PRODUCING A POLYPHENYLENE SULFIDE RESIN WITH PROPERTIES OF (1) 0.3 WT% OR LESS IN THE AMOUNT OF THE VOLATILE GAS GENERATED WHEN HEATED AND MELTED AT 320°C IN VACUUM FOR 2 HOURS, (2) 0.3 WT% OR LESS IN THE ASH CONTENT ACHIEVED WHEN INCINERATED AT 550°C, (3) 4.0 WT% OR LESS IN THE RESIDUE AMOUNT ACHIEVED WHEN A SOLUTION WITH 1 PART BY WEIGHT OF THE POLYPHENYLENE SULFIDE RESIN DISSOLVED IN 20 PARTS BY WEIGHT OF 1-CHLORONAPHTHALENE IS PRESSURE-FILTERED BY A PTFE MEMBRANE FILTER WITH A PORE SIZE OF 1 µM AT 250°C FOR 5 MINUTES, AND (4) HIGHER THAN 500 G/10 MIN IN MELT FLOW RATE (ACCORDING TO ASTM D-1238-70: MEASURED AT A TEMPERATURE OF 315.5°C AND AT A LOAD OF 5000 G), BY ACID-TREATING A POLYPHENYLENE SULFIDE RESIN IN AN ACID TREATMENT STEP AND SUBSEQUENTLY TREATING IT FOR THERMAL OXIDATION, IN A THERMAL OXIDATION STEP, WHEREIN IN THE ACID TREATMENT STEP, THE POLYPHENYLENE SULFIDE RESIN IS IMMERSED IN AN ACID OR AN AQUEOUS SOLUTION OF THE ACID FOR TREATMENT AT PH 2 TO 8 AND 80 TO 200 ᵒC . THIS PROCESS CAN PROVIDE A POLYPHENYLENE SULFIDE RESIN EXCELLENT IN MELT FLOWABILITY, SMALL IN METAL CONTENT AND IN THE AMOUNT OF THE VOLATILE COMPONENT GENERATED DURING MELTING AND EXCELLENT IN MOLDING STABILITY AND WET HEAT RESISTANCE.
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公开(公告)号：CA2232837A1
公开(公告)日：1998-01-29
申请号：CA2232837
申请日：1997-07-17
Applicant: TORAY INDUSTRIES
Inventor： KOBAYASHI SADAYUKI , KOBAYASHI KAZUHIKO , ISHIO ATSUSHI
Abstract: A polyphenylene sulfide resin composition comprising 99.9 to 80 % by weight of a polyphenylene sulfide resin and 0.1 to 20 % by weight of an oligomer having aromatic groups and exhibiting a peak temperature in heating crystallization of 125 ~C or below. The composition is suppressed in flash formation and is excellent in fluidity and crystallization characteristics, thus being suitable for the production of molded articles such as small-sized precision parts.
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公开(公告)号：CA2586364A1
公开(公告)日：2006-05-18
申请号：CA2586364
申请日：2005-10-04
Applicant: TORAY INDUSTRIES
Inventor： YAMADA MEGUMI , OHKURA MASATOSHI , IMANISHI YASUYUKI , MACHIDA TETSUYA , ISHIO ATSUSHI , HIGASHIOJI TAKUJI
IPC: C08J5/18 , C08L81/02 , C08L101/00
Abstract: A biaxially oriented polyarylene sulfide film excellent in molding processability and a laminated polyarylene sulfide sheet comprising the same can be provided by improving the tensile elongation at break of a biaxially oriented polyarylene sulfide film having excellent heat resistance, dimensional stability, electrical properties and chemical resistance. Disclosed is a biaxially oriented polyarylene sulfide film comprising polyarylene sulfide and other thermoplastic resin A different from the polyarylene sulfide, wherein the contents of the polyarylene sulfide and the thermoplastic resin A are 70 to 99 parts by weight and 1 to 30 parts by weight respectively when the total amount of the polyarylene sulfide and the thermoplastic resin A is taken as 100 parts by weight and the resin thermoplastic A forms a dispersed phase with an average particle diameter of 10 to 500 nm and the biaxially oriented polyarylene sulfide film exhibits a tensile elongation at break of 110 to 250% in at least one of the longitudinal direction and width direction and a tensile fracture elongation of 80 to 250% in the other direction.
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Patent Agency Ranking
公开(公告)号：CA2224948A1
公开(公告)日：1998-06-16
申请号：CA2224948
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： TATEYAMA MASARU , KOBAYASHI KAZUHIKO , SHIMASAKI NORIO , ISHIO ATSUSHI
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers, in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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公开(公告)号：CA2220449A1
公开(公告)日：1998-05-08
申请号：CA2220449
申请日：1997-11-07
Applicant: TORAY INDUSTRIES
Inventor： OHNO KATSUYA , KOBAYASHI KAZUHIKO , ISHIO ATSUSHI , TATEYAMA MASARU , SHIMASAKI NORIO , MATSUI KAZUFUMI , SHIMIZU SACHIO
Abstract: Multilayered moldings, which comprise a laminate structure of (A) a layer of a polyphenylene sulfide resin (hereinafter referred to as PPS resin) composition and (B) a layer of a thermoplastic resin except PPS resins and which are characterized in that the PPS resin composition constituting the layer (A) comprises (A1) 100 parts by weight of a PPS resin, (A2) from 1 to 80 parts by weight of a thermoplastic resin having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, and (A3) from 5 to 80 parts by weight of a thermoplastic resin that is similar in kind to the thermoplastic resin constituting the layer (B), have good hot water resistance, antifreeze resistance, chemical resistance, heat resistance, abrasion resistance, gas permeation resistance and interlayer adhesion.
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公开(公告)号：SG166666A1
公开(公告)日：2010-12-29
申请号：SG2000033779
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers,in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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公开(公告)号：DE69736426D1
公开(公告)日：2006-09-14
申请号：DE69736426
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
IPC: B32B27/00 , B29C49/00 , B29C49/22 , B32B1/08 , B32B27/08 , C08K3/04 , C08L81/04 , F16L11/118 , H01B1/20 , H01B1/22 , H01B1/24
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers, in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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10.发明专利
公开(公告)号：MY120010A
公开(公告)日：2005-08-30
申请号：MYPI9705258
申请日：1997-11-06
Applicant: TORAY INDUSTRIES
Inventor： TATEYAMA MASARU , MATSUI KAZUFUMI , SHIMIZU SACHIO , OHNO KATSUYA , SHIMASAKI NORIO , ISHIO ATSUSHI , KOBAYASHI KAZUHIKO
Abstract: MULTILAYERED MOLDINGS, WHICH COMPRISE A LAMINATE STRUCTURE OF (A) A LAYER OF A POLYPHENYLENE SULFIDE RESIN (HEREINAFTER REFERRED TO AS PPS RESIN) COMPOSITION AND (B) A LAYER OF A THERMOPLASTIC RESIN EXCEPT PPS RESINS AND WHICH ARE CHARACTERIZED IN THAT THE PPS RESIN COMPOSITION CONSTITUTING THE LAYER (A) COMPRISES (A1) 100 PARTS BY WEIGHT OF A PPS RESIN, (A2) FROM 1 TO 80 PARTS BY WEIGHT OF A THERMOPLASTIC RESIN HAVING AT LEAST ONE FUNCTIONAL GROUP SELECTED FROM EPOXY GROUPS, ACID ANHYDRIDE GROUPS, CARBOXYL GROUP AND ITS SALTS, AND CARBOXYLATE GROUPS, AND (A3) FROM 5 TO 80 PARTS BY WEIGHT OF A THERMOPLASTIC RESIN THAT IS SIMILAR IN KIND TO THE THERMOPLASTIC RESIN CONSTITUTING THE LAYER (B), HAVE GOOD HOT WATER RESISTANCE, ANTIFREEZE RESISTANCE, CHEMICAL RESISTANCE, HEAT RESISTANCE, ABRASION RESISTANCE, GAS PERMEATION RESISTANCE AND INTERLATER ADHESION.
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