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公开(公告)号：DE69736426T2
公开(公告)日：2007-08-02
申请号：DE69736426
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
IPC: B32B27/00 , B29C49/00 , B29C49/22 , B32B1/08 , B32B27/08 , C08K3/04 , C08L81/04 , F16L11/118 , H01B1/20 , H01B1/22 , H01B1/24
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers, in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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公开(公告)号：DE68923583D1
公开(公告)日：1995-08-31
申请号：DE68923583
申请日：1989-06-02
Applicant: TORAY INDUSTRIES
Inventor： KADOI SHO , SHIMASAKI NORIO
IPC: C08G59/00 , C08G59/18 , C08G59/32 , C08L23/00 , C08L23/02 , C08L53/02 , C08L63/00 , C08L77/00 , C08L81/02
Abstract: Disclosed is a polyphenylene sulfide composition having excellent impact characteristics, melt flow characteristics and flexibility which comprises, as indispensable components, (A) a polyphenylene sulfide, (B) an epoxy group-containing olefinic polymer, and (C) at least one elastomer selected from ethylene/propylene copolymers, ethylene/butene copolymers, ethylene/propylene/diene copolymers, hydrogenated styrene/butadiene/styrene block copolymers, copolymers of ethylene with a monomer selected from acrylic acid, methacrylic acid and alkyl esters and metal salts thereof, and polyamide elastomers.
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公开(公告)号：CA2224948A1
公开(公告)日：1998-06-16
申请号：CA2224948
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： TATEYAMA MASARU , KOBAYASHI KAZUHIKO , SHIMASAKI NORIO , ISHIO ATSUSHI
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers, in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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公开(公告)号：CA2220449A1
公开(公告)日：1998-05-08
申请号：CA2220449
申请日：1997-11-07
Applicant: TORAY INDUSTRIES
Inventor： OHNO KATSUYA , KOBAYASHI KAZUHIKO , ISHIO ATSUSHI , TATEYAMA MASARU , SHIMASAKI NORIO , MATSUI KAZUFUMI , SHIMIZU SACHIO
Abstract: Multilayered moldings, which comprise a laminate structure of (A) a layer of a polyphenylene sulfide resin (hereinafter referred to as PPS resin) composition and (B) a layer of a thermoplastic resin except PPS resins and which are characterized in that the PPS resin composition constituting the layer (A) comprises (A1) 100 parts by weight of a PPS resin, (A2) from 1 to 80 parts by weight of a thermoplastic resin having at least one functional group selected from epoxy groups, acid anhydride groups, carboxyl group and its salts, and carboxylate groups, and (A3) from 5 to 80 parts by weight of a thermoplastic resin that is similar in kind to the thermoplastic resin constituting the layer (B), have good hot water resistance, antifreeze resistance, chemical resistance, heat resistance, abrasion resistance, gas permeation resistance and interlayer adhesion.
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公开(公告)号：SG166665A1
公开(公告)日：2010-12-29
申请号：SG2000033761
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers,in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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Patent Agency Ranking
公开(公告)号：SG166666A1
公开(公告)日：2010-12-29
申请号：SG2000033779
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers,in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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公开(公告)号：DE69736426D1
公开(公告)日：2006-09-14
申请号：DE69736426
申请日：1997-12-16
Applicant: TORAY INDUSTRIES
Inventor： ISHIO ATSUSHI , SHIMASAKI NORIO , TATEYAMA MASARU , KOBAYASHI KAZUHIKO
IPC: B32B27/00 , B29C49/00 , B29C49/22 , B32B1/08 , B32B27/08 , C08K3/04 , C08L81/04 , F16L11/118 , H01B1/20 , H01B1/22 , H01B1/24
Abstract: An electroconductive, multilayered hollow molding comprising at least two or more thermoplastic resin layers, in which at least one layer is a layer (a) of a polyphenylene sulfide resin or a thermoplastic resin composition consisting essentially of a polyphenylene sulfide resin, at least one layer is a layer (b) of a thermoplastic resin except polyphenylene sulfide resins or a thermoplastic resin composition consisting essentially of a thermoplastic resin except polyphenylene sulfide resins, and at least one of those layers (a) and (b) and other layers is a layer of an electroconductive, thermoplastic resin composition indispensably comprising an electroconductive filler and/or an electroconductive polymer, and a thermoplastic resin.
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8.发明专利
公开(公告)号：MY120010A
公开(公告)日：2005-08-30
申请号：MYPI9705258
申请日：1997-11-06
Applicant: TORAY INDUSTRIES
Inventor： TATEYAMA MASARU , MATSUI KAZUFUMI , SHIMIZU SACHIO , OHNO KATSUYA , SHIMASAKI NORIO , ISHIO ATSUSHI , KOBAYASHI KAZUHIKO
Abstract: MULTILAYERED MOLDINGS, WHICH COMPRISE A LAMINATE STRUCTURE OF (A) A LAYER OF A POLYPHENYLENE SULFIDE RESIN (HEREINAFTER REFERRED TO AS PPS RESIN) COMPOSITION AND (B) A LAYER OF A THERMOPLASTIC RESIN EXCEPT PPS RESINS AND WHICH ARE CHARACTERIZED IN THAT THE PPS RESIN COMPOSITION CONSTITUTING THE LAYER (A) COMPRISES (A1) 100 PARTS BY WEIGHT OF A PPS RESIN, (A2) FROM 1 TO 80 PARTS BY WEIGHT OF A THERMOPLASTIC RESIN HAVING AT LEAST ONE FUNCTIONAL GROUP SELECTED FROM EPOXY GROUPS, ACID ANHYDRIDE GROUPS, CARBOXYL GROUP AND ITS SALTS, AND CARBOXYLATE GROUPS, AND (A3) FROM 5 TO 80 PARTS BY WEIGHT OF A THERMOPLASTIC RESIN THAT IS SIMILAR IN KIND TO THE THERMOPLASTIC RESIN CONSTITUTING THE LAYER (B), HAVE GOOD HOT WATER RESISTANCE, ANTIFREEZE RESISTANCE, CHEMICAL RESISTANCE, HEAT RESISTANCE, ABRASION RESISTANCE, GAS PERMEATION RESISTANCE AND INTERLATER ADHESION.
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公开(公告)号：DE68923583T2
公开(公告)日：1996-01-11
申请号：DE68923583
申请日：1989-06-02
Applicant: TORAY INDUSTRIES
Inventor： KADOI SHO , SHIMASAKI NORIO
IPC: C08G59/00 , C08G59/18 , C08G59/32 , C08L23/00 , C08L23/02 , C08L53/02 , C08L63/00 , C08L77/00 , C08L81/02
Abstract: Disclosed is a polyphenylene sulfide composition having excellent impact characteristics, melt flow characteristics and flexibility which comprises, as indispensable components, (A) a polyphenylene sulfide, (B) an epoxy group-containing olefinic polymer, and (C) at least one elastomer selected from ethylene/propylene copolymers, ethylene/butene copolymers, ethylene/propylene/diene copolymers, hydrogenated styrene/butadiene/styrene block copolymers, copolymers of ethylene with a monomer selected from acrylic acid, methacrylic acid and alkyl esters and metal salts thereof, and polyamide elastomers.
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公开(公告)号：EP0900650A4
公开(公告)日：2003-05-21
申请号：EP97911470
申请日：1997-11-06
Applicant: TORAY INDUSTRIES
Inventor： TATEYAMA MASARU , MATSUI KAZUFUMI , SHIMIZU SACHIO , OHNO KATSUYA , SHIMASAKI NORIO , ISHIO ATSUSHI , KOBAYASHI KAZUHIKO
IPC: B32B1/08 , B32B27/08 , C08L81/02 , B29C47/06 , B29C49/22 , C08J3/20 , C08J5/00 , C08J5/12 , C08L63/00 , F16L9/12 , F16L11/14
CPC classification number: C08L81/02 , B32B1/08 , B32B27/08 , B32B27/286 , B32B27/32 , B32B27/34 , B32B27/36 , B32B2367/00 , B32B2377/00 , B32B2597/00 , C08L2666/02 , C08L2666/14
Abstract: Multi-layer moldings comprising (A) a layer made of a polyphenylene sulfide resin (hereinafter abbreviated to 'PPS resin') composition and (B) a layer made of thermoplastic resin other than the PPS resin which are laminated with each other, characterized in that the PPS resin composition forming the layer (A) is one comprising (A1) 100 parts by weight of a PPS resin, (A2) 1 to 80 parts by weight of a thermoplastic resin having at least one functional group selected among epoxy, acid anhydrides, carboxyl and salts thereof and carboxylate esters and (A3) 5 to 80 parts by weight of the same thermpolastic resin as that forming the layer (B). The moldings are excellent in resistance to hot water, antifreeze, chemicals, heat, wear and permeation of gases, and in tight adhesion between the layers.
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