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公开(公告)号:JPH1187961A
公开(公告)日:1999-03-30
申请号:JP24572497
申请日:1997-09-10
Applicant: TOSHIBA CORP
Inventor: KUNO KATSUMI , SADA YUTAKA , IWASAKI HIDEO , UBUKATA HIROSHI , MAKITA SADAO , TOMIOKA KENTARO
IPC: H05K7/20
Abstract: PROBLEM TO BE SOLVED: To enhance the heat sink property of an electronic device, which uses a high heating semiconductor element. SOLUTION: An air flow passage 20 is formed in the interior of a case body 1 and an air flow is formed in this air flow passage 20 by a fan 6. Heat, which is generated from a heating component mounted on a substrate 2, is conducted to a wall member 21, in which the air flow passage 20 is sectioned, through heat transfer members 3, such as heat pipes and is exhausted to the outside of the case body 10 using the air, which is made to flow in the air flow passage 20, as a medium.
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公开(公告)号:JPH10223365A
公开(公告)日:1998-08-21
申请号:JP2070697
申请日:1997-02-03
Applicant: TOSHIBA CORP , TOSHIBA AVE KK
Inventor: TANAKA TERUYA , IWASAKI HIDEO , KUNO KATSUMI , SATO SHOJIRO
IPC: H05B6/12
Abstract: PROBLEM TO BE SOLVED: To improve heating efficiency and enable heating of low resistance and a low magnetic permeation rate of aluminum or the like by constituting a heating coil element wire diameter by a litz wire of a specific diameter and molding it and generating a high-frequency magnetic field by a specific high-frequency current. SOLUTION: To heat a non-magnetic body or an aluminum pot with small resistance in a similar way as an iron pot, it is necessary to increase an input resistance to 20 times. Therefore, a heater coil winding has more turns than 20T for the iron pot, and an inverter frequency is increased. At this time, the inverter frequency is set to 40kHz or more, a heater coil is constituted by the litz wire of 0.2mm or less in heater coil element wire diameter to increase the input resistance, thereby ensure improvement in cooling capacity. A heating coil 2 is constituted by 119 stranded litz wire 1 of 0.2mm in element wire diameter and molded by a mold material 3. The mold material 3 is intruded to the inside of the heating coil 2, thermal conductivity is improved, and cooling capacity is improved.
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公开(公告)号:JPH1094026A
公开(公告)日:1998-04-10
申请号:JP24299996
申请日:1996-09-13
Applicant: TOSHIBA CORP
Inventor: KUNO KATSUMI , IWASAKI HIDEO
IPC: H04B1/08 , H04B1/38 , H04B1/3822 , H04Q7/32
Abstract: PROBLEM TO BE SOLVED: To allow the terminal equipment to be used safely even in a crowed. SOLUTION: The terminal equipment is provided with two voice input/output devices 5 placed in the vicinity of both ends of a case 3 and a telescopic antenna 7 contained one end of the case, and in the case that one of the two voice input/output devices 5 is used for a microphone, the other acts like a speaker.
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公开(公告)号:JPH08125746A
公开(公告)日:1996-05-17
申请号:JP26432894
申请日:1994-10-28
Applicant: TOSHIBA CORP
Inventor: ISHIZUKA MASARU , KUNO KATSUMI , IWASAKI HIDEO , SASAKI TOMIYA
Abstract: PURPOSE: To perform communication mutually between a normal telephone line and a computer network by performing constitution by a first terminal, a second terminal capable of transmitting and receiving signals through the computer network and a communication base station. CONSTITUTION: In the case of the communication from a terminal A which is a telephone set to the terminal B which is a personal computer, the signals from the terminal A are transmitted through the normal telephone line 1 to the communication base station 2 first. In the communication base station 2, after recording the signals from the terminal A, voice signals are converted to character/picture signals, the computer network 3 is accessed and the signals are transmitted to the terminal B. Also, inversely, when the communication from the terminal B to the terminal A is considered, the signals from the terminal B are transmitted through the computer network 3 to the communication base station 2, converted from the character/picture signals to the voice signals and then, transmitted through the telephone line 1 to the terminal A.
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公开(公告)号:JPH0888491A
公开(公告)日:1996-04-02
申请号:JP22377794
申请日:1994-09-19
Applicant: TOSHIBA CORP
Inventor: KUNO KATSUMI , SASAKI TOMIYA , IWASAKI HIDEO , ISHIZUKA MASARU
IPC: H05K7/20
Abstract: PURPOSE: To provide an electronic apparatus in which the high density mounting of an electronic component can be realized, and reduction in size, high performance and multi-functions can be provided. CONSTITUTION: The electronic apparatus comprises an electronic apparatus body 1 having a heat radiating terminal on an outer surface and means for guiding heat generated therein to the terminal, and an evaporation type radiator 2 detachably provided at the body 1 and having a refrigerant holding part for holding liquid refrigerant and evaporating it and thermally conducting with the holding part at the outer surface and having a heat absorbing terminal thermally connected to a heat radiating terminal when mounted on the body 1.
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公开(公告)号:JPH07200098A
公开(公告)日:1995-08-04
申请号:JP33546193
申请日:1993-12-28
Applicant: TOSHIBA CORP
Inventor: KUNO KATSUMI , SASAKI TOMIYA , IWASAKI HIDEO , ISHIZUKA MASARU
Abstract: PURPOSE:To provide an electronic equipment capable of easily and efficiently performing an operation while being held by a user. CONSTITUTION:A display 35 is provided on one surface 33 of two opposing surfaces 33 and 34 of a flat equipment frame 32 and an input pad 36 is provided on the other surface 34. By pressing the part corresponding to a character to be inputted of the input pad 36 while looking at a pseudo keyboard 44 displayed on the display 35, the corresponding character part of the pseudo keyboard 44 is mark displayed M and the character is inputted. Thus, at the time of performing input, a user can hold the appliance frame 32 with both hands and also perform the input by the input pad 36 based on contents displayed on the display 35 by using the fingers of both hands and the operation is easily and efficiently performed.
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公开(公告)号:JPH06196884A
公开(公告)日:1994-07-15
申请号:JP34697792
申请日:1992-12-25
Applicant: TOSHIBA CORP
Inventor: MONMA JUN , TAKAHASHI TAKASHI , SASAKI TOMIYA , KUNO KATSUMI , IWASAKI HIDEO , FUJIMORI YOSHINORI
IPC: C08K7/16 , H01L23/373 , H05K7/20
Abstract: PURPOSE:To provide a high-heat-conductivity composite capable of reducing the thermal resistance at the contact between a heat-generating body and a cooling device so as to improve cooling efficiency of the heat-generating body. CONSTITUTION:A high-heat-conductivity composite 16 comprises filler particles 12 dispersed in matrix resin 11, and the filler particles are fused through metal mesh 15. The filler particles 12 dispersed in the matrix are made of metallic or organic material having a higher melting point than the metal mesh 15.
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公开(公告)号:JPH04257765A
公开(公告)日:1992-09-11
申请号:JP1995991
申请日:1991-02-13
Applicant: TOSHIBA CORP
Inventor: KUNO KATSUMI
Abstract: PURPOSE:To perform heat exchange with high efficiency during a time between a stop and a high speed running. CONSTITUTION:During running at a high and a medium speed, the open air is taken in a main flow passage 6 through an intake port 4, heat exchange is carried out by means of heat exchangers 7 and 8, and the heat-exchanged open air is discharged through a discharge port 5. During a stop or during a low speed running, the open air taken in the main flow passage 6 or an auxiliary flow passage 11 is heat-exchanged by means of heat-exchangers 7 and 8. The heat-exchanged open air is forcibly discharged through the auxiliary flow passage 11 or the main flow passage 6 with the aid of a fan 12.
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公开(公告)号:JPH04184963A
公开(公告)日:1992-07-01
申请号:JP31291090
申请日:1990-11-20
Applicant: TOSHIBA CORP
Inventor: KUNO KATSUMI , SASAKI TOMIYA , IWASAKI HIDEO , ISHIZUKA MASARU
IPC: H01L23/36
Abstract: PURPOSE:To make it possible to connect reliably heating units to a heat dissipation means regardless of the sizes and inclination of the heating units by a method wherein with particles having a heat conductivity encapsulated between the heating units and the heat dissipation means, one part of an enclosure is formed into a flexible structure. CONSTITUTION:A heat sink 25 of a semiconductor package 15 is constituted of an insulating film 17, whose one part is flexible, and metallic particles 21, whose diameters are different from each other, and a heat transfer fluid 23 is filled in spaces 19 between the particles 21 between the film 17 and a cap 9. Heats of chips 1 are transferred to the particles 21 via the film 17 and after being transferred to the fellow particles 21, the heats are emitted to the outside through heat dissipation fins 11 via the cap 9. In this constitution, as one part of the film 17 is flexible, while an irregularity in the heights of the chips 1 above a substrate 3 and the inclination of the chips 1 are absorbed, the sink 25 can reliably come into contact to the back surfaces of the chips 1 and the heats of the chips 1 can be efficiently transferred to the sink 25.
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公开(公告)号:JP2015056562A
公开(公告)日:2015-03-23
申请号:JP2013189818
申请日:2013-09-12
Applicant: 株式会社東芝 , Toshiba Corp , 東芝メディカルシステムズ株式会社 , Toshiba Medical Systems Corp
Inventor: KADOTA TOMOKO , KUNO KATSUMI , KUGIMIYA TETSUYA , HIROHATA KENJI , HONGO TAKUYA , YAMAYORI YU
CPC classification number: H01L2224/48091 , H01L2224/48137 , H01L2224/48227 , H01L2224/49175 , H01L2224/73265 , H01L2924/13055 , H01L2924/00014 , H01L2924/00
Abstract: 【課題】熱疲労を低減することと、振動・衝撃・荷重から保護することとを両立させることができる半導体装置及び放射線装置を提供する。【解決手段】実施形態の半導体装置は、半導体素子と、ゲルと、鈍化部材と、を有する。ゲルは、半導体素子周辺を予め定められた強度で絶縁して封止する。鈍化部材は、ゲル内に設けられ、潜熱及び外部からの制御の少なくともいずれかにより、予め定められた温度範囲に対し、ゲルの温度の上昇及び下降における温度変化を鈍らせる。【選択図】図3
Abstract translation: 要解决的问题:提供一种可以实现热疲劳降低和防止振动,冲击和负载的半导体器件和辐射装置。解决方案:半导体器件具有半导体元件,凝胶和钝化元件 。 凝胶以预定强度绝缘并密封半导体元件的周边。 在凝胶体中设置有钝化部件,通过潜热和外部控制中的至少任意一种使凝胶的温度在预定温度范围的上升和下降之间变差。
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