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    21.
    发明专利
    未知

    公开(公告)号：DE60212906D1

    公开(公告)日：2006-08-17

    申请号：DE60212906

    申请日：2002-07-03

    Applicant: XEROX CORP

    Inventor： FORK DAVID K ,  CHUA CHRISTOPHER L

    IPC: B81B3/00 ,  F16F1/18 ,  G01R1/067 ,  G01R3/00 ,  H01H1/02 ,  H01L21/58 ,  H01L23/48 ,  H01R13/03 ,  H01R13/24 ,  H05K1/11 ,  H05K3/40

    Abstract: Methods are disclosed for fabricating spring structures (127) in which a passive, conductive coating (130) is deposited onto the spring structure (127) after release. A release layer (110) is deposited on a substrate (101) and then a spring metal layer (120) is formed thereon. A first mask is then used to etch the spring metal layer to form a spring metal finger (127). A second (release) mask is then deposited that defines a release window used to remove a portion of the release layer (110) and release a free end of the spring metal finger. The second mask is also used as a mask during the subsequent directional deposition of a conductive coating material (130) on the cantilevered tip of the finger (127). The second mask is then stripped, and the residual coating deposited thereon is lifted off. The resulting spring structure includes conductive coating (130) on the upper surface and front edge (128) of the finger tip.

    23.
    发明专利
    未知

    公开(公告)号：DE60206121D1

    公开(公告)日：2005-10-20

    申请号：DE60206121

    申请日：2002-10-02

    Applicant: XEROX CORP

    Inventor： ROMANO LINDA T ,  FORK DAVID K

    IPC: B81B3/00 ,  B81C1/00 ,  G01R1/067 ,  G01R3/00 ,  H01L21/60 ,  H01L23/12 ,  H01L23/32 ,  H05K3/40 ,  H01R13/22

    Abstract: A stress-balancing layer (130) is formed over portions (122) of a spring metal finger (120) that remain attached to an underlying substrate (101) to counter internal stresses inherently formed in the spring metal finger (120). The (e.g., positive) internal stress of the spring metal causes the claw (tip) (125) of the spring metal finger (120) to bend away from the substrate (101) when an underlying release material is removed. The stress-balancing pad (130) is formed on an anchor portion (122) of the spring metal finger (120), and includes an opposite (e.g., negative) internal stress that counters the positive stress of the spring metal finger (120). A stress-balancing layer (230) is either initially formed over the entire spring metal finger (120) and then partially removed (etched) from the claw portion (125), or selectively deposited only on the anchor portion (122) of the spring metal finger (120). An interposing etch stop layer (325-1) is used when the same material composition is used to form both the spring metal (220) and stress-balancing (230) layers.

    24.
    发明专利
    未知

    公开(公告)号：DE69920644T2

    公开(公告)日：2005-03-24

    申请号：DE69920644

    申请日：1999-12-22

    Applicant: XEROX CORP

    Inventor： BRINGANS ROSS D ,  NOOLANDI JAAN ,  BIEGELSEN DAVID K ,  FORK DAVID K ,  ELROD SCOTT A

    IPC: G03F7/00 ,  B41C1/10 ,  B41N1/14

    Abstract: A method and system for lithographic printing by controlling the surface energy of a printing plate (12) to affect its hydrophilic and hydrophobic properties. These properties enable the ink to be applied to the printing plate (12) in an imagewise manner and provides for rapid production of images on a recording medium. The lithographic printing plate (12) may be rewritten repeatedly between printing jobs or may even by rewritten between individual recording media.

    29.
    发明专利
    未知

    公开(公告)号：DE60212906T2

    公开(公告)日：2007-01-18

    申请号：DE60212906

    申请日：2002-07-03

    Applicant: XEROX CORP

    Inventor： FORK DAVID K ,  CHUA CHRISTOPHER L

    IPC: B81B3/00 ,  F16F1/18 ,  G01R1/067 ,  G01R3/00 ,  H01H1/02 ,  H01L21/58 ,  H01L23/48 ,  H01R13/03 ,  H01R13/24 ,  H05K1/11 ,  H05K3/40

    Abstract: Methods are disclosed for fabricating spring structures (127) in which a passive, conductive coating (130) is deposited onto the spring structure (127) after release. A release layer (110) is deposited on a substrate (101) and then a spring metal layer (120) is formed thereon. A first mask is then used to etch the spring metal layer to form a spring metal finger (127). A second (release) mask is then deposited that defines a release window used to remove a portion of the release layer (110) and release a free end of the spring metal finger. The second mask is also used as a mask during the subsequent directional deposition of a conductive coating material (130) on the cantilevered tip of the finger (127). The second mask is then stripped, and the residual coating deposited thereon is lifted off. The resulting spring structure includes conductive coating (130) on the upper surface and front edge (128) of the finger tip.

    30.
    发明专利
    未知

    公开(公告)号：DE60118127D1

    公开(公告)日：2006-05-11

    申请号：DE60118127

    申请日：2001-09-07

    Applicant: XEROX CORP

    Inventor： PEETERS ERIC ,  ROSA MICHEL A ,  FORK DAVID K

    IPC: G02B26/02 ,  G02B26/08 ,  B81B3/00 ,  G02B6/35

    Abstract: Optical cross-connect systems (100) involve the general concept of a two dimensional array of micro electromechanical systems (MEMS) tilt mirrors (104) being used to direct light coming from a first optical fiber (110) to a second optical fiber (111). Each MEMS tilt mirror in the two dimensional array can tilt about two non-colinear axes (x,y) and is suspended by a plurality of suspension arms (450) attached to a glass substrate

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