Abstract:
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
Abstract:
An optical cross switch including an improved system to align optical components is described. The system utilizes a highly transmissive sensor (170) positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor (170) to readjust elements (128,136) that maintain the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.
Abstract:
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
Abstract:
An out-of-plane micro-structure which can be used for on-chip integration of high-Q inductors and transformers places the magnetic field direction parallel to the substrate (14) plane without requiring high aspect ratio processing. The photolithographically patterned coil structure includes an elastic member (61 a) having an intrinsic stress profile. The intrinsic stress profile biases a free portion (11) away from the substrate (14) forming a loop winding (142). An anchor portion (12) remains fixed to the substrate (14). The free portion end becomes a second anchor portion (61 c) which may be connected to the substrate (14) via soldering or plating. A series of individual coil structures (140) can be joined via their anchor portions to form inductors and transformers.
Abstract:
AN OUT-OF-PLANE MICRO-STRUCTURE WHICH CAN BE USED FOR ON-CHIP INTEGRATION OF HIGH-Q INDUCTORS AND TRANSFORMERS PLACES THE MAGNETIC FIELD DIRECTION PARALLEL TO THE SUBSTRATE PLANE WITHOUT REQUIRING HIGH ASPECT RATIO PROCESSING. THE PHOTOLITHOGRAPHICALLY PATTERNED COIL STRUCTURE INCLUDES AN ELASTIC MEMBER HAVING AN INTRINSIC STRESS PROFILE. THE INTRINSIC STRESS PROFILE BIASES A FREE PORTION AWAY FROM THE SUBSTRATE FORMING A LOOP WINDING (105). AN ANCHOR PORTION (101) REMAINS FIXED TO THE SUBSTRATE. THE FREE PORTION END BECOMES A SECOND ANCHOR PORTION (103) WHICH MAY BE CONNECTED TO THE SUBSTRATE VIA SOLDERING OR PLATING. A SERIES OF INDIVIDUAL COIL STRUCTURES CAN BE JOINED VIA THEIR ANCHOR PORTIONS TO FORM INDUCTORS AND TRANSFORMERS.
Abstract:
An optical cross switch including an improved system to align optical components is described. The system utilizes a highly transmissive sensor (170) positioned in the optical path of an optical signal to determine the precise position of the optical signal. A feedback loop uses output from the highly transmissive sensor (170) to readjust elements (128,136) that maintain the optical signal in a desired position. The current system is particularly suitable for use in an optical cross switch.
Abstract:
A method and apparatus for reducing vertical leakage current in a high fill factor sensor array is described. Reduction of vertical leakage current is achieved by eliminating Schottky junction interfaces that occur between metal back contacts (46) and intrinsic amorphous silicon layers (50). One method of eliminating the Schottky junction uses an extra wide region of N doped amorphous silicon (48) to serve as a buffer between the metal back contact (46) and the intrinsic amorphous silicon layer (50). Another method of eliminating the Schottky junction completely replaces the metal back contact (46) and the N doped amorphous silicon layer (48) with a substitute material such as N doped poly-silicon (504, Figure 5).