Abstract:
PROBLEM TO BE SOLVED: To provide a laser diode having a stronger mode stability and a low threshold current operation. SOLUTION: The index guide type buried heterostructure nitride laser structure 100 has a ridge structure 111 having first, second and third faces, clad structures 121, 125 and a multiple quantum well structure 145 interposed between the clad structures 121, 125, and a buried layer 155 existing on the first, second and third faces of the ridge structure 111 and having an opening for electrical contact to the third face of the ridge structure 111.
Abstract:
PROBLEM TO BE SOLVED: To provide a nitride-based semiconductor laser structure where the number of p-type semiconductor layers is reduced. SOLUTION: A p-n tunnel junction 220 between a p-type semiconductor layer 216 and an n-type semiconductor layer 218 provides current injection for an edge light emitting nitride-based semiconductor laser structure 200. By the p-n tunnel junction 220, the number of p-type semiconductor layers in the nitride- based semiconductor laser structure is reduced. As a result, dispersion loss is reduced, threshold current density decreases, entire series resistance lowers, at the same time, a higher growth temperature is enabled, and the structural quality of a laser is improved. COPYRIGHT: (C)2003,JPO
Abstract:
PROBLEM TO BE SOLVED: To provide a dual III-V nitride laser structure in which thermal crosstalk is reduced. SOLUTION: This dual semiconductor laser structure is provided with a substrate 102, III-V nitride semiconductor current diffusion layers 202, 302 formed on the substrate, and a plurality of III-V nitride semiconductor layers formed on the current diffusion layers. At least one out of the plurality of III-V nitride semiconductor layers is provided with III-V nitride semiconductor layers 206, 306 forming active layers, and a trench 116 which penetrates the plurality of III-V nitride semiconductor layers, is stretched penetrating a part of the current diffusion layers and forms a first laser 200 and a second laser 300 from the plurality of III-V nitride semiconductor layers. Thermal crosstalk between the first and the second lasers is reduced by depth of the trench and thickness of the current diffusion layers.
Abstract:
PROBLEM TO BE SOLVED: To provide a laser diode having a stronger mode stability and a low threshold current operation. SOLUTION: The index guide type heterostructure nitride laser structure 100 has a first waveguide layer, a second waveguide layer, a multiple quantum well structure 145 interposed between the first and second waveguide layers, a ridge structure 111 having first, second and third faces, and a buried layer 155 existing on the first, second and third faces of the ridge structure 111.
Abstract:
PROBLEM TO BE SOLVED: To provide a nitride based semiconductor laser structure which is decreased in number of p-type semiconductor layers. SOLUTION: A p-n tunnel junction 220 between a p-type semiconductor layer 216 and an n-type semiconductor layer 218 provides current injection for an edge-emitting nitride based semiconductor laser structure 200. The number of p-type semiconductor layers in the nitride based semiconductor laser structure 200 is decreased by the p-n tunnel junction 220 to reduce dispersion loss, threshold current density thereby decreases to lower total series resistance, and higher growth temperature is obtained to improve structural quality of a laser. COPYRIGHT: (C)2011,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a monolithic multiple laser structure which has the capability of emitting a multiple wavelength laser beam of close intervals in a wide wavelength spectrum range from infrared to red and blue wavelengths. SOLUTION: A red/infrared parallel type laser structure 100 is bonded to a blue laser structure 200 with solder bumps 402, 404 by flip-chip bonding to form a red/blue/infrared integrated laser structure 400 integrated by a hybrid method. The method allows a laser array structure having laser elements of different wavelengths to be manufactured, even in a semiconductor materials which are not suitable for a manufacturing method based on etching and regrowth. COPYRIGHT: (C)2010,JPO&INPIT
Abstract:
PROBLEM TO BE SOLVED: To provide a laser diode structure where an enhanced coefficient of transverse optical confinement and a low series resistance are realized, and whose absorption loss due to a p-electrode can be controlled. SOLUTION: An InGaN laser diode structure 100 is equipped with an upper waveguide layer 170 above an MQW(multi-quantum well) region 150, and above this, is equipped with an upper cladding structure 180 composed of a metal oxide of ITO(indum tin oxide). An SiO 2 isolation structure 185, whose refractive index is lower than that of the ITO clad structure 180, is formed so as to face each other, sandwiching the ITO upper cladding structure 180. COPYRIGHT: (C)2005,JPO&NCIPI
Abstract:
PROBLEM TO BE SOLVED: To provide a blue color laser in which variations of output power due to transient heating are reduced. SOLUTION: A blue color laser diode comprising III-V group nitride in the short periodic table includes an amplification region 116 and a modulation region 118. The amplification region 116 allows a constant current to flow therethrough, and hereby the region is kept near a lasing threshold. The modulation region 118 has a variable small forward current or back bias voltage for controlling an optical output of the laser. Since consumed electric power of the two region blue color laser diode is very sharply reduced, compared with that of a direct modulation type laser, transient heating and attenuation of the optical output are reduced.
Abstract:
PROBLEM TO BE SOLVED: To obtain a substrate having a high thermal conductivity and a structural integrality with a thick board, related to a semiconductor device. SOLUTION: The substrate 100 includes a body 11 having an upper surface 114 and a bottom surface 112 opposite to the upper surface 114 and having the first thermal conductivity, a cavity 116 defined by an inner surface 113 of the body 110 and opened at least on the bottom surface 112, and at least one material 120 disposed in the cavity 116 having the second thermal conductivity higher than the first thermal conductivity and coming into contact with at least a part of the inner surface 113.