PHOTONIC INTEGRATED CIRCUIT (PIC), PRESSURE SENSING SYSTEM COMPRISING SUCH A PIC AND METHOD FOR PRESSURE SENSING USING SUCH A PRESSURE SENSING SYSTEM
    24.
    发明申请
    PHOTONIC INTEGRATED CIRCUIT (PIC), PRESSURE SENSING SYSTEM COMPRISING SUCH A PIC AND METHOD FOR PRESSURE SENSING USING SUCH A PRESSURE SENSING SYSTEM 审中-公开
    光电集成电路(PIC),包括这种PIC的压力传感系统以及使用这种压力传感系统进行压力传感的方法

    公开(公告)号:WO2017069620A1

    公开(公告)日:2017-04-27

    申请号:PCT/NL2016/050718

    申请日:2016-10-19

    Applicant: TECHNATON B.V.

    CPC classification number: G01L11/02 B81B2201/04 G01B11/161 G01D3/0365 G01L1/24

    Abstract: The invention relates to a photonic integrated circuit (PIC) for use in a pressure sensing system comprising an integrated photonic component (IPC), configured to be exposed to an external pressure and to generate a wavelength response based on deformation, wherein the wavelength response comprises a pressure-induced wavelength response and a temperature-induced wavelength response. The pressure sensing system further comprises an incoming waveguide for coupling a light source to an optical input of the IPC and an outgoing waveguide for coupling an optical output of the IPC to analysis means. The pressure sensing system further comprises temperature correction means, wherein the temperature correction means provide information relating to the temperature-induced wavelength response. The present invention further relates to a pressure sensing system comprising a PICas described above. The present invention further relates to a method for pressure sensing using a pressure sensing system as described above.

    Abstract translation: 本发明涉及一种用于压力传感系统中的光子集成电路(PIC),其包括集成光子器件(IPC),该集成光子器件被配置为暴露于外部压力并产生基于波长响应 其中所述波长响应包括压力引起的波长响应和温度引起的波长响应。 压力感测系统还包括用于将光源耦合到IPC的光输入端的输入波导管和用于将IPC的光输出端耦合到分析装置的输出波导管。 压力传感系统还包括温度校正装置,其中温度校正装置提供与温度引起的波长响应有关的信息。 本发明还涉及一种包括上述PICas的压力传感系统。 本发明还涉及一种使用如上所述的压力感测系统进行压力感测的方法。

    Optical device
    28.
    发明授权

    公开(公告)号:US11733509B2

    公开(公告)日:2023-08-22

    申请号:US16625695

    申请日:2018-07-06

    Abstract: An optical device includes an elastic support portion which includes a torsion bar which extends along a second direction perpendicular to a first direction and a nonlinearity relaxation spring which is connected between the torsion bar and a movable portion. The nonlinearity relaxation spring is configured so that a deformation amount of the nonlinearity relaxation spring around the second direction is smaller than a deformation amount of the torsion bar around the second direction and a deformation amount of the nonlinearity relaxation spring in a third direction perpendicular to the first direction and the second direction is larger than a deformation amount of the torsion bar in the third direction while the movable portion moves in the first direction. A comb electrode is disposed along an outer edge of the movable portion.

    SYSTEM AND METHODS FOR HIGHLY INTEGRATED OPTICAL READOUT MEMS SENSORS
    30.
    发明申请
    SYSTEM AND METHODS FOR HIGHLY INTEGRATED OPTICAL READOUT MEMS SENSORS 有权
    用于高度集成的光读出MEMS传感器的系统和方法

    公开(公告)号:US20160320180A1

    公开(公告)日:2016-11-03

    申请号:US14721914

    申请日:2015-05-26

    Abstract: System and methods for highly integrated optical readout MEMS sensors are provided. In one embodiment, a method for an integrated waveguide optical-pickoff sensor comprises: launching a laser beam generated by a laser light source into an integrated waveguide optical-pickoff monolithically fabricated within a first substrate, the integrated waveguide optical-pickoff including an optical input port, a coupling port, and an optical output port; and detecting an amount of coupling of the laser beam from the coupling port to a sensor component separated from the coupling port by a gap by measuring an attenuation of the laser beam at the optical output port.

    Abstract translation: 提供了高集成度光读出MEMS传感器的系统和方法。 在一个实施例中,一种用于集成波导光学传感器传感器的方法包括:将由激光光源产生的激光束发射到在第一衬底内单片制造的集成波导光学传感器中,所述集成波导光学传感器包括光输入 端口,耦合端口和光输出端口; 以及通过测量光输出端口处的激光束的衰减来检测激光束从耦合端口到与耦合端口分离的传感器部件之间的间隙的耦合量。

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