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公开(公告)号：WO2016188840A1
公开(公告)日：2016-12-01
申请号：PCT/EP2016/061222
申请日：2016-05-19
Applicant: TAMPERE UNIVERSITY OF TECHNOLOGY
Inventor： SAKETI, Pooya , KALLIO, Pasi
CPC classification number: B25J13/082 , B25J7/00 , B25J15/00 , B25J15/0028 , B81B2201/0292 , B81C99/002 , B81C2201/032
Abstract: The invention is related to a micro handling device for handling micro objects and for measuring forces exerted on said micro objects, including a micro gripper and a force sensor connected to said micro gripper, In order to provide such handling device which is rather simple and rugged in construction, less expensive than other typical devices used for such purpose and still useful and easily adaptable in measuring linear forces in the range of 10 μΝ to 1000 mN under relative displacements up to 1 mm or more, the device being applicable to a wide area of materials and components having micro-scale dimensions the present invention proposes that the device comprises a micro spring as the force sensor.
Abstract translation: 本发明涉及一种用于处理微物体和用于测量施加在所述微物体上的力的微处理装置，包括微型夹持器和连接到所述微型夹具的力传感器。为了提供这种相当简单和坚固的处理装置 在结构上，比用于这种目的的其它典型装置便宜，并且在相对位移高达1mm或更大的情况下在10μN至1000mN范围内的线性力测量中仍然有用且易于适应，该装置适用于广泛的区域 具有微尺寸尺寸的材料和部件本发明提出该装置包括作为力传感器的微弹簧。
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公开(公告)号：WO01037045A1
公开(公告)日：2001-05-25
申请号：PCT/EP2000/011447
申请日：2000-11-17
CPC classification number: B81C99/008 , B81B2201/034 , B81C2201/032 , G03F7/00 , G03F7/0035 , H01F17/0006 , H01F41/042
Abstract: The invention relates to a flat coil and to a lithographic method for producing microcomponents with metal component structures in the sub-millimeter range. According to the inventive method, a resist material is structured by means of selective exposition and removing the unexposed zones and filling in the gaps between the resist structures with metal by means of a galvanic method to produce the metal component structures. The aim of the invention is to improve such a method so that the microcomponents can be subdivided during said process. To this end, a structured three-dimensional sacrificial metal layer is produced during the production of the microcomponent, said sacrificial layer delimiting the microcomponent and being removed once the microcomponent is due to be subdivided. The invention also relates to a method for producing microcomponents with component structures of cross-linkable resist material and to a flat coil for micromotors with at least one coil layer with strip conductors in the sub-millimeter range.
Abstract translation: 公开的是一种扁平线圈和用于在亚毫米范围内生产具有金属部件的结构的微平版印刷方法，其中，抗蚀剂材料通过选择性曝光的装置构造并溶解出来的未曝光区域，并通过电镀工艺与金属之间的间隙中的抗蚀剂结构用于形成金属 器件结构被填充。 此方法应允许微部件的处理固有的分离成为可能。 这是在该微一个三维结构的金属牺牲层被制造，这限制了微组件的制备过程中实现，并且，对于微元件的分离，所述牺牲层被除去。 还提供了一种用于生产具有交联性的部件结构的微抗蚀剂微型电动机材料和扁平线圈与具有导体路径中所描述的亚毫米范围内的至少一个绕组层的方法。
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公开(公告)号：WO1996041368A1
公开(公告)日：1996-12-19
申请号：PCT/US1996007109
申请日：1996-05-16
Applicant: THE REGENTS OF THE UNIVERSITY OF CALIFORNIA
IPC: H01L21/00
CPC classification number: B81C1/00246 , A61K9/0024 , A61K9/0097 , B01D39/1692 , B01D39/20 , B01D67/0058 , B01D67/0069 , B01D67/0072 , B01D67/0083 , B01D69/02 , B01D69/12 , B01D71/02 , B01D2323/24 , B01D2325/04 , B01D2325/26 , B81C99/0085 , B81C2201/032 , B81C2203/0728 , C23C16/01 , G03F7/00
Abstract: This invention relates to the area of microelectromechanical systems in which electronic circuits and mechanical devices are integrated on the same silicon chip. The method taught herein allows the fabrication of thin film structures (2) in excess of 150 microns in height using thin film deposition processes. Wafers may be employed as reusable molds for efficient production of such structures. Various material properties may be varied within the structures to produce electrical, mechanical or electromechanical devices.
Abstract translation: 本发明涉及电子电路和机械装置集成在同一硅芯片上的微机电系统的面积。 本文教导的方法允许使用薄膜沉积工艺制造高度超过150微米的薄膜结构（2）。 可以将晶片用作可重复使用的模具，以有效地生产这种结构。 各种材料性质可以在结构内变化以产生电气，机械或机电装置。
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公开(公告)号：KR1020010005994A
公开(公告)日：2001-01-15
申请号：KR1019997009072
申请日：1998-04-03
Applicant: 유니버시티 오브 써던 캘리포니아
Inventor： 코헨아담엘.
IPC: C25D5/02
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: a) 제 1 기판(4)을기판및 기판상의패턴내에배치된유연한(conformable) 마스크를포함하는제 2 전기도금아티클(4)에접촉시키는단계와, b) 금속이온의소스인전기도금조(58)로부터의제 1 금속을유연한마스크패턴의보충물과대응하는제 1 패턴내의제 1 기판상에전기도금하는단계와, c) 제 1 기판으로부터제 1 아티클을제거하는단계를포함하는도금방법을개시한다. 이방법은최소화된장치의미세구조내에서사용될수 있다. 전기도금아티클들및 전기도금장치들또한개시된다.
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25.发明申请公开(公告)号：US20180309216A1
公开(公告)日：2018-10-25
申请号：US15961140
申请日：2018-04-24
Applicant: ADVANCED-CONNECTEK INC.
Inventor： Kuo-Ching Lee , Ta-Teh Meng , Cheng-Feng Yu
IPC: H01R12/85 , B81B3/00 , B81C99/00 , H01R12/71 , H01R13/20 , H01R43/16 , H01R13/11 , H01R13/115 , H01R13/627
CPC classification number: H01R12/85 , B81B3/0054 , B81B2201/014 , B81C99/0085 , B81C2201/032 , H01R12/718 , H01R12/73 , H01R13/111 , H01R13/115 , H01R13/20 , H01R13/6278 , H01R43/16
Abstract: A micro-electro-mechanical systems (MEMS) terminal structure of board-to-board electrical connector and manufacturing method thereof are provided. The terminal of the terminal structure includes a side arm, a bent portion, and a flexible arm integrally formed as one component. The flexible arm includes a first portion and a second portion. The first portion and the side arm form an insertion space. The second portion and the side arm form a locking space. The second portion of the flexible arm has a contact portion. The insertion space is greater than the locking space. The terminal has curved and locking features to extend the moment arm of the terminal for improving the terminal flexibility. The terminal contacts a mating terminal through multiple points, thereby improving the contact stability and providing the locking function. Furthermore, by using the MEMS techniques for semiconductor industries, the terminal of micro board-to-board electrical connector can be manufactured.
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Patent Agency Ranking
公开(公告)号：US20160108544A1
公开(公告)日：2016-04-21
申请号：US14880329
申请日：2015-10-12
Applicant: Nivarox-FAR S.A.
Inventor： Philippe DUBOIS , Christian Charbon
CPC classification number: C25D21/04 , B81B2201/035 , B81C1/00674 , B81C2201/032 , C22C19/03 , C22C45/04 , C25D1/003 , G04B1/145 , G04B13/02 , G04B15/00 , G04B15/14 , G04B37/22 , G04D3/0074
Abstract: The invention relates to a one-piece metal component including an electroformed metal body, the external surface of the body including, only over or to a predetermined depth, less trapped hydrogen than the rest of the electroformed metal body causing a hardening relative to the rest of the body in order to improve the wear resistance of the one-piece component while preserving a relative magnetic permeability of less than 10 and the ability to be driven or pressed fit.
Abstract translation: 本发明涉及一种包括电铸金属体的一体式金属组件，其主体的外表面仅包含在超过或达到预定深度的电池中，比电铸金属体的其余部分所捕获的氢少，导致相对于其余部分的硬化 以提高一体成分的耐磨性，同时保持小于10的相对导磁率和被驱动或压配合的能力。
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公开(公告)号：US20100264037A1
公开(公告)日：2010-10-21
申请号：US12789704
申请日：2010-05-28
Applicant: Adam L. Cohen
Inventor： Adam L. Cohen
IPC: C25D5/02
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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公开(公告)号：US07618525B2
公开(公告)日：2009-11-17
申请号：US11927287
申请日：2007-10-29
Applicant: Adam L. Cohen
Inventor： Adam L. Cohen
IPC: C25D5/02
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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公开(公告)号：US07338753B2
公开(公告)日：2008-03-04
申请号：US11503303
申请日：2006-08-14
Applicant: Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
Inventor： Jun Yorita , Yoshihiro Hirata , Tsuyoshi Haga
IPC: G03F7/039
CPC classification number: B81C99/0085 , B81C2201/032 , C25D1/003 , H01L21/4821 , H05K3/202 , H05K3/205
Abstract: A method of manufacturing a metal microstructure (1) by using a resin mold (13). In order to provide a method in which a mild manufacturing condition which causes less damage to the resin mold (13) can be set and the high-precision metal microstructure (1) can be mass-produced by uniform electroforming, the method of manufacturing the metal microstructure (1) according to the present invention includes the steps of: fixing on a conductive substrate (11) the resin mold (13) having a vacant portion penetrating in the direction of thickness, by interposing a photosensitive polymer (12) having a chemical composition changed by an electron beam, ultraviolet radiation or visible radiation so as to form a layered structure (2) having the resin mold (13); exposing the layered structure (2) having the resin mold (13) to an electron beam, ultraviolet radiation or visible radiation; removing an exposed photosensitive polymer (12c) existing at the vacant portion of the resin mold (13); and filling with a metal (14) the vacant portion of the layered structure (2) having the resin mold (13) by electroforming.
Abstract translation: 一种通过使用树脂模具（13）制造金属微结构（1）的方法。 为了提供可以设定对树脂模具（13）造成较小损害的温和制造条件并且可以通过均匀电铸来大量生产高精度金属微结构（1）的方法，制造 根据本发明的金属微结构（1）包括以下步骤：通过插入具有一个或多个金属微结构（1）的光敏聚合物（12）将具有穿过厚度方向的空白部分的树脂模具（13）固定在导电基板（11）上， 化学成分由电子束，紫外线辐射或可见光辐射而变化，形成具有树脂模具（13）的层状结构（2）。 将具有树脂模具（13）的层状结构（2）暴露于电子束，紫外线或可见光; 去除存在于树脂模具（13）的空缺部分的暴露的光敏聚合物（12c）; 并通过电铸将金属（14）填充到具有树脂模具（13）的层状结构（2）的空位部分上。
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公开(公告)号：US20070181430A1
公开(公告)日：2007-08-09
申请号：US11622279
申请日：2007-01-11
Applicant: Adam Cohen
Inventor： Adam Cohen
IPC: C25D5/02
CPC classification number: C25D5/10 , B33Y10/00 , B33Y70/00 , B81C1/00126 , B81C2201/0181 , B81C2201/0197 , B81C2201/032 , C25D1/00 , C25D1/003 , C25D5/022 , C25D5/12 , C25D5/22 , C25D17/06 , H01L21/2885 , H05K3/241 , Y10T428/12486 , Y10T428/239
Abstract: An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed.
Abstract translation: 一种电镀方法，包括：a）使第一衬底与第一制品接触，所述第一制品包括衬底和以衬底形式设置的贴合掩模; b）以第一图案将来自金属离子源的第一金属电镀到所述第一基板上，所述第一图案对应于所述适形掩模图案的所述补体; 和c）从第一基板上去除第一制品。 还公开了电镀制品和电镀装置。
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