-
公开(公告)号:CN107036715A
公开(公告)日:2017-08-11
申请号:CN201710202166.5
申请日:2017-03-30
Applicant: 智来光电科技(苏州)有限公司
Inventor: 刘志杰
CPC classification number: G01J5/00 , G01J5/10 , G01J5/20 , G01J2005/0048 , G01J2005/106 , G01J2005/204
Abstract: 本发明公开了一种红外图像无挡片非均匀性校正装置及其校正方法,首先在高低温箱中分别让机芯裸露和装入外壳中进行两种方法标定,获取两种情况下不同环境温度对应的机芯的响应,并记录响应对应的探测器衬底温度和结构温度;然后在对着黑体标定高温两帧图像,计算非均匀性校正参数K,并将K和无挡片标定的结果存入FLASH中;工作时根据衬底温度读出FLASH模块中的背景值再计算出当前衬底和结构温度对应的背景,再对输入图像进行非均匀性校正输出。本发明所达到的有益效果:在模拟红外成像系统工作时的情况,完成无挡片的标定;工作时实时插值计算背景参数,在无需挡片的情况下,完成图像的非均匀性校正,提升图像质量的同时减少机械结构,降低系统功耗和噪声。
-
公开(公告)号:CN101627290B
公开(公告)日:2015-04-01
申请号:CN200780038817.6
申请日:2007-10-17
Applicant: 传感电子公司 , 中央佛罗里达大学研究基金公司
IPC: G01J5/20
CPC classification number: G01J5/20 , G01J2005/204
Abstract: 本发明可提供用于红外微辐射热测定计传感器的一种传导结构以及用于感测电磁辐射的一种方法。该微辐射热测定计可以包括一个第一导体层(64)和一个第二导体层(68)。该微辐射热测定计可以进一步包括位于该第一导体层与第二导体层之间的一个辐射热测定计层(62)。
-
公开(公告)号:CN103930755A
公开(公告)日:2014-07-16
申请号:CN201280044662.8
申请日:2012-07-13
Applicant: 中央科学研究中心 , 法国宇航院 , 原子能和替代能源专员署
CPC classification number: G01J5/20 , G01J5/08 , G01J5/0853 , G01J2005/204 , H01L27/14685 , H04N5/33
Abstract: 本发明是有关对给定光谱带的光辐射进行热探测的微测热辐射计阵列,包括一个支撑衬底和给定规模的微测热辐射计阵列(300),排列成阵列。每一个上述的微测热辐射计包括一个悬挂于上述支撑衬底之上的隔膜(301),所述隔膜包括一个吸收入射辐射的元件(305)和一个与吸收器热接触的测温元件(304),与上述吸收元件电绝缘。吸收元件包括至少一个第一金属/绝缘体/金属(MIM)结构,包括多个三层亚微细粒厚度的膜,即,第一金属膜(311),电介质膜(310),和第二金属膜(309),上述MIM结构具有对上述光谱带中的至少一种波长的入射辐射的谐振吸收。微测热辐射计像素被上述隔膜(301)覆盖的区域小于或等于整个微测热辐射计像素区域的一半。
-
公开(公告)号:CN101688810B
公开(公告)日:2013-09-18
申请号:CN200880023504.8
申请日:2008-05-28
Applicant: 派洛斯有限公司
CPC classification number: G01J5/34 , G01J5/00 , G01J5/0205 , G01J5/0225 , G01J5/023 , G01J5/04 , G01J5/041 , G01J5/045 , G01J5/14 , G01J5/22 , G01J2005/0077 , G01J2005/204 , G01N2021/0106 , H01L27/14683 , H01L41/0973 , Y10T156/10
Abstract: 本发明涉及一种用于检测热辐射的装置,其包括:至少一个膜,上面安装用于将所述热辐射转换为电信号的至少一个热检测器元件;以及至少一个电路支撑件,其用于承载所述膜且用于承载用于读出所述电信号的至少一个读出电路,所述检测器元件和所述读出电路通过穿过所述膜的电触点电连接在一起。另外,提供一种制造所述装置的方法,其具有以下方法步骤:a)提供具有所述检测器元件的所述膜和至少一个电直通连接,且提供所述电路支撑件,和b)以所述检测器元件和所述读出电路通过穿过所述膜的电触点电连接在一起的方式将所述膜和所述电路支撑件合在一起。更好以晶圆级实施制造活动:将经功能化的硅衬底堆叠在彼此上,彼此稳固地接合,且随后被分割为个别元件。更好地,所述检测器元件包括热电检测器元件。所述装置适用于运动检测器、存在检测器和热成像照相机。
-
公开(公告)号:WO2015195560A1
公开(公告)日:2015-12-23
申请号:PCT/US2015/035845
申请日:2015-06-15
Applicant: THE GOVERNMENT OF THE UNITED STATES OF AMERICA, as represented by THE SECRETARY OF THE NAVY , WHEELER, Virginia, D. , KUB, Francis, J. , EDDY, Charles, R. Jr. , TADJER, Marko, J.
Inventor: WHEELER, Virginia, D. , KUB, Francis, J. , EDDY, Charles, R. Jr. , TADJER, Marko, J.
CPC classification number: G01J5/20 , C23C16/45525 , G01J5/024 , G01J5/0275 , G01J5/084 , G01J5/0853 , G01J5/089 , G01J2005/204 , G02B1/10 , G02B1/11 , G02B1/14 , G02B1/18 , G02B5/003 , G02F1/0147 , H01L37/00 , Y10T156/10
Abstract: A smart window comprising a transparent substrate, a transparent low emittance layer on the transparent substrate, a variable emittance material layer on the substrate or transparent low emittance layer, and a protection material layer on the variable emittance material layer.
Abstract translation: 一种智能窗,包括透明基板,透明基板上的透明低辐射层,基板上的可变散射材料层或透明低辐射率层,以及可变发射体材料层上的保护材料层。
-
公开(公告)号:EP2732253A1
公开(公告)日:2014-05-21
申请号:EP12742821.7
申请日:2012-07-13
Applicant: Centre National de la Recherche Scientifique (CNRS) , Office National d'Etudes et de Recherches Aérospatiales , Commissariat à l'Énergie Atomique et aux Énergies Alternatives
Inventor: KOECHLIN, Charlie , BOUCHON, Patrick , HAIDAR, Riad , PELOUARD, Jean-Luc , YON, Jean-Jacques , DESCHAMPS, Joël , PARDO, Fabrice , COLLIN, Stéphane
CPC classification number: G01J5/20 , G01J5/08 , G01J5/0853 , G01J2005/204 , H01L27/14685 , H04N5/33
Abstract: According to one aspect, the invention relates to a microbolometer array for thermal detection of light radiation in a given spectral band, comprising a supporting substrate and an array of microbolometers (300) of given dimensions, arranged in an array. Each of said microbolometers comprises a membrane (301) suspended above said supporting substrate, said membrane consisting of an element (305) for absorbing the incident radiation and a thermometric element (304) in thermal contact with the absorber, electrically insulated from said absorber element. The absorber element comprises at least one first metal/insulator/metal (MIM) structure comprising a multilayer of three superposed films of submicron-order thickness i.e. a first metallic film (311), a dielectric film (310), and a second metallic film (309), said MIM structure being able to have a resonant absorption of said incident radiation at at least one wavelength in said spectral band. The area of the microbolometer pixel covered by said membrane (301) is less than or equal to half of the total area of the microbolometer pixel.
-
公开(公告)号:EP0526551A4
公开(公告)日:1993-06-30
申请号:EP91908757
申请日:1991-04-24
Inventor: LIDDIARD, KEVIN, CHARLES
CPC classification number: G01J5/20 , G01J2005/204
Abstract: A thermal infrared detector comprising a dielectric pellicle (5) suspended over a cavity in a substrate (6), the pellicle supporting a detector element (1) comprising a heat sensitive semiconductor layer (3) between a pair of thin film metallic contacts (2, 4), these being deposited on the pellicle, the cavity being formed by etching and removal of the substrate material through holes or slots (8) in the surface of the substrate.
-
公开(公告)号:US11906363B2
公开(公告)日:2024-02-20
申请号:US17347470
申请日:2021-06-14
Inventor: Kouhei Takahashi , Naoki Tambo , Kunihiko Nakamura , Masaki Fujikane , Yasuyuki Naito
CPC classification number: G01J5/22 , H01L31/095 , H01L31/20 , G01J2005/204
Abstract: An infrared sensor includes: a base substrate; a bolometer infrared receiver; a first beam; and a second beam. Each of the first and second beams has a connection portion connected to the base substrate and/or a member on the base substrate and a separated portion away from the base substrate, and is physically joined to the infrared receiver at the separated portion. The infrared receiver is supported by the first and second beams to be away from the base substrate. The infrared receiver includes a resistance change portion including a resistance change material the electrical resistance of which changes with temperature. The resistance change portion includes an amorphous semiconductor, and the first and second beams include a crystalline semiconductor made of the same base material as the resistance change material, and is electrically connected to the resistance change portion at the separated portion.
-
公开(公告)号:US09791321B2
公开(公告)日:2017-10-17
申请号:US13902529
申请日:2013-05-24
Applicant: California Institute of Technology
Inventor: Goutam Chattopadhyay , Ken B. Cooper , Emmanuel Decrossas , John J. Gill , Cecile Jung-Kubiak , Choonsup Lee , Robert Lin , Imran Mehdi , Alejandro Peralta , Theodore Reck , Jose Siles
CPC classification number: G01J5/20 , G01J2005/0077 , G01J2005/204 , G01S7/02 , G01S7/036 , G01S13/887 , G01S13/89
Abstract: A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.
-
公开(公告)号:US20160273968A1
公开(公告)日:2016-09-22
申请号:US14658242
申请日:2015-03-16
Applicant: Vlad Joseph Novotny
Inventor: Vlad Joseph Novotny
CPC classification number: B81C1/00285 , B81B2201/0207 , B81B2203/0109 , B81B2207/015 , B81C1/00333 , B81C2203/0136 , B81C2203/0145 , G01J5/024 , G01J5/045 , G01J5/24 , G01J2005/204 , H01L27/14643
Abstract: The architecture, design and fabrication of array of suspended micro-elements with individual seals are described. Read out integrated circuit is integrated monolithically with the suspended elements for low parasitics and high signal to noise ratio detection of changes of their electrical resistance. Array of individually sealed, suspended micro-elements is combined with signal processing chip that contains nonvolatile memory with sensitivity calibration of all elements and interpolation between non-functional elements. When the micro-elements are infrared light absorbers, image analysis and recognition is embedded in the processing chip to form the infrared imaging solution for infrared cameras.
Abstract translation: 描述了具有单独密封件的悬浮微型元件阵列的架构,设计和制造。 读出集成电路与悬挂元件整体集成,用于低寄生效应和高信噪比检测其电阻变化。 单独密封的悬浮微元件阵列与包含非易失性存储器的信号处理芯片组合,具有所有元件的灵敏度校准和非功能元件之间的插值。 当微元件是红外光吸收器时,图像分析和识别被嵌入处理芯片中,以形成用于红外相机的红外成像解决方案。
-
-
-
-
-
-
-
-
-