公开(公告)号：US09791321B2

公开(公告)日：2017-10-17

申请号：US13902529

申请日：2013-05-24

Applicant: California Institute of Technology

Inventor： Goutam Chattopadhyay ,  Ken B. Cooper ,  Emmanuel Decrossas ,  John J. Gill ,  Cecile Jung-Kubiak ,  Choonsup Lee ,  Robert Lin ,  Imran Mehdi ,  Alejandro Peralta ,  Theodore Reck ,  Jose Siles

IPC: G01J5/20 ,  G01S7/02 ,  G01S13/88 ,  G01S13/89 ,  G01J5/00 ,  G01S7/03

CPC classification number: G01J5/20 ,  G01J2005/0077 ,  G01J2005/204 ,  G01S7/02 ,  G01S7/036 ,  G01S13/887 ,  G01S13/89

Abstract: A multi-pixel terahertz transceiver is constructed using a stack of semiconductor layers that communicate using vias defined within the semiconductor layers. By using a stack of semiconductor layers, the various electrical functions of each layer can be tested easily without having to assemble the entire transceiver. In addition, the design allows the production of a transceiver having pixels set 10 mm apart.