Abstract:
The invention relates to a method for producing a semiconductor structure comprising a superficial layer (20'), at least one embedded layer (36, 46), and a support (30), which method comprises: a step of forming, on a first support, patterns (23) in a first material, a step of forming a semiconductor layer, between and on said patterns, a step of assembling said semiconductor layer with a second support (30).
Abstract:
Microfluidic devices having wall structures comprised of sintered glass frit and further including a glass, glass-ceramic or ceramic membrane structure sealed by a sintered seal to said wall structures, such that a a fluid passage or chamber is defined at least in part by the wall structures and said membrane structure. This allows for changes in pressure within the fluid passage or chamber to cause deflections of the membrane structure, providing for direct measurement of pressure within the device. The microfluidic device may have both floors and walls of sintered frit, or may have only walls of sintered frit, with planar floor-like substrate structures, thicker than the membrane structure defining the vertical boundaries of the internal passages. The device may include multiple fluid passages or chambers each defined at least in part by a membrane structure. Multiple membrane structures may be used in a single device, and one single membrane structure may be used for multiple passages or chamber.
Abstract:
A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. No groove to receive the hollow filament is arranged on the first support.
Abstract:
A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and at least one hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system. A second support may be disposed on the first support and the hollow filament.
Abstract:
A support unit for a microfluidic system includes a first support; a first adhesive layer provided on a surface of the first support; and a hollow filament laid on a surface of the first adhesive layer to have an arbitrary shape and functioning as a flow channel layer of the microfluidic system.
Abstract:
A method of manufacturing a vertical comb structure for a microelectromechanical (MEMS) device. Tooth structures are formed on a first wafer. A second water is then bonded to the tooth structures of the first wafer. The tooth structures are then released to form a comb structure. Forming the tooth structures on the first wafer includes using oxidation, photolithography, etching, epitaxy, and chemical and mechanical polishing to create the tooth structures on the first wafer.
Abstract:
A micro fluidic device comprises a laminate structure, comprising a plurality of individual layers. At least one layer (1) comprises a micro fluidic structure or micro fluidic channel (3) and at least on one side of said layer a further layer (11) is arranged comprising a three-dimensional (3D) structure (13) such, that the 3D-structure is influencing a flow characteristic of a fluid within the micro fluidic channel (3).
Abstract:
A multi-layer device comprises a first layer with a micro-mechanical component formed thereon. There are also first and second sealing layers, with the first layer sandwiched between the first and second sealing layers and anodically bonded thereto to define a cavity therein as is provided within the cavity together with an electrode for reducing UV emission, the electrode formed on at least a part of a surface of the second sealing layer internal to the cavity and arranged to be in electrical contact, in use, with the first layer.
Abstract:
The present invention relates to a method of anodic bonding a first structure (14) to a glass layer (12). The method comprises the steps of arranging a conductive pattern (11) on a substrate, providing the glass layer on said conductive pattern (11), providing said first structure on said glass layer (12), providing an electrode on one side of said first structure, and applying a voltage to said conductive pattern and said electrode to obtain an electrical field across said first structure and said glass layer, between said conductive pattern (11) and said electrode (15) produce an anodic bonding between said first structure and said glass layer.
Abstract:
The presently disclosed subject matter provides functional perfluoropolyether (PFPE) materials for use in fabricating and utilizing microscale devices, such as a microfluidic device. The functional PFPE materials can be used to adhere layers of PFPE materials to one another or to other substrates to form a microscale device. Further, the presently disclosed subject matter provides a method for functionalizing the interior surface of a microfluidic channel and/or a microtiter well. Also the presently disclosed subject matter provides a method for fabricating a microscale structure through the use of a sacrificial layer of a degradable material.