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    Silicon / metal composite micromechanical component and a method of manufacturing the same
    306.
    发明专利
    Silicon / metal composite micromechanical component and a method of manufacturing the same 有权

    公开(公告)号：JP2011514846A

    公开(公告)日：2011-05-12

    申请号：JP2010533559

    申请日：2008-11-12

    Applicant: ニヴァロックス−ファー ソシエテ アノニム

    Inventor： ヴェラルド，マルコ ,  コーヌス，ティエリー ,  ティーボー，ジャン−フィリップ ,  ピータース，ジャン−バーナード ,  フィアッカブリーノ，ジャン−チャールズ

    IPC: B81C1/00 ,  B81C99/00 ,  G04B13/02

    CPC classification number: F16H55/06 ,  B81B2201/035 ,  B81C99/0095 ,  B81C2201/0197 ,  C25D1/08 ,  C25D5/02 ,  C25D5/10 ,  G04B13/02 ,  G04B13/022 ,  G04B19/042 ,  Y10T74/1987

    Abstract: The process for manufacturing a micromechanical component made of silicon/metal composite, comprises selectively carving a cavity in an upper layer (5) of a substrate (3) to define a pattern of a silicon part (53) of the component, carving a cavity in an intermediate layer (9) of the substrate, growing a metallic layer from a portion of the cavities (37, 45) to form a metal part along the thickness of the component, and removing the silicon/metal composite micromechanical component from the substrate. The intermediate layer extends between the upper layer and a lower silicon layer (7). The process for manufacturing a micromechanical component made of silicon/metal composite, comprises selectively carving a cavity in an upper layer (5) of a substrate (3) to define a pattern of a silicon part (53) of the component, carving a cavity in an intermediate layer (9) of the substrate, growing a metallic layer from a portion of the cavities (37, 45) to form a metal part along the thickness of the component, and removing the silicon/metal composite micromechanical component from the substrate. The intermediate layer extends between the upper layer and a lower silicon layer (7) of the substrate. The metallic layer is developed by covering the top of the substrate by a photosensitive resin, selectively carrying out a photolithography process on the photosensitive resin according to the predetermined pattern of the metal part, placing a metallic layer in an upper conductive surface of the lower silicon layer by electroplating process, and removing the photostructured resin from the substrate. The upper surface of the lower layer is made conductive by doping the bottom layer and/or by placing a conductive layer on the upper surface. The photostructured resin makes protrusion in the upper layer of the substrate to continue the growth of a layer by electroplating and to prepare a second metal part of the micromechanical component above the silicon part. The upper side of the substrate is made to a level of the metal layer at a height same as the upper end of the photostructured resin, after forming the metal layer. A cavity is carved in the lower layer of the substrate to form a second silicon part of the micromechanical component according to a predetermined form and thickness, before removing the silicon/metal composite micromechanical component from the substrate. An independent claim is included for a micromechanical component made of silicon/metal composite.

    Composite micromechanical component and method for manufacturing the same
    308.
    发明专利
    Composite micromechanical component and method for manufacturing the same 有权
    复合微生物组分及其制备方法

    公开(公告)号：JP2010284794A

    公开(公告)日：2010-12-24

    申请号：JP2010131758

    申请日：2010-06-09

    Applicant: Nivarox-Far Sa ,  ニヴァロックス−ファー ソシエテ アノニム

    Inventor： CUSIN PIERRE ,  THIEBAUD JEAN-PHILIPPE

    IPC: B81C1/00 ,  B81B1/00

    CPC classification number: B81C99/008 ,  B81B3/0075 ,  B81B2201/035 ,  B81C1/00031 ,  B81C1/00087 ,  B81C1/00119 ,  B81C2201/0132 ,  B81C2201/032 ,  C25D1/003 ,  C25D1/20 ,  C25D5/022 ,  G04B13/022 ,  G04B13/026 ,  G04D3/0069

    Abstract: PROBLEM TO BE SOLVED: To provide a composite micromechanical component whose part requiring tribological property is coated with a better tribological material than a micromachinable substrate material, and a method for manufacturing the composite micromechanical component.
    SOLUTION: The method for manufacturing the composite micromechanical component 41 includes (a) preparing an SOI (silicon on insulator) substrate, (b) etching at least one pattern that penetrates as far as an intermediate layer 22 of the SOI substrate to form at least one cavity in the substrate, (c) coating the outer peripheral part with silicon dioxide having tribological property, and further etching it to form a vertical wall 52 which is the part requiring tribological property, and (d) forming a second level 45 having a level difference in a region that includes the cavity by electroforming.
    COPYRIGHT: (C)2011,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种复合微机械部件，其需要摩擦学特性的部分被涂覆有比可微加工的基底材料更好的摩擦学材料，以及用于制造复合微机械部件的方法。 ＆lt; P＆gt;解决方案：复合微机电部件41的制造方法包括：（a）制备SOI（绝缘体上硅）基板，（b）蚀刻至少一个贯穿至SOI基板的中间层22的图案， 在基板中形成至少一个空腔，（c）用具有摩擦学性质的二氧化硅涂覆外周部分，并进一步蚀刻以形成需要摩擦学性能的部分的垂直壁52，以及（d）形成第二层 45通过电铸在包括腔的区域中具有水平差。 版权所有（C）2011，JPO＆INPIT

    Manufacturing method for mechanical part
    310.
    发明专利
    Manufacturing method for mechanical part 有权
    机械部件制造方法

    公开(公告)号：JP2010017845A

    公开(公告)日：2010-01-28

    申请号：JP2009163495

    申请日：2009-07-10

    Applicant: Swatch Group Research & Development Ltd ,  ザ・スウォッチ・グループ・リサーチ・アンド・ディベロップメント・リミテッド

    Inventor： DINGER RUDOLF ,  RAVENEL THIERRY

    IPC: B81C1/00 ,  G04B15/14 ,  G04D3/00

    CPC classification number: B81C99/008 ,  B81B2201/035 ,  B81C1/00674 ,  B81C2201/112 ,  G04B13/02 ,  G04D3/0069 ,  Y10T29/49579

    Abstract: PROBLEM TO BE SOLVED: To provide a method for easily manufacturing a high quality micro-mechanical part applicable to almost all mechanical clock parts in the clock manufacturing field. SOLUTION: The invention relates to a method of manufacturing (1) the mechanical part (51) including the following steps: (a) providing (3) a substrate (53) made of micro-machinable material; and (b) etching (5), with help of photolithography, a pattern (50) that includes the mechanical part (51) through the entire substrate. The method further includes the following steps: (c) mounting (7) the etched substrate on a support (55') so as to leave the top and bottom surfaces of the substrate accessible; (d) depositing (9, C') a coating of better tribological quality than the micro-machinable material on the outer surface of the part; and (e) releasing (11) the part from the substrate. COPYRIGHT: (C)2010,JPO&INPIT

    Abstract translation: 要解决的问题：提供一种用于容易地制造适用于时钟制造领域中的几乎所有机械时钟部件的高质量微机械部件的方法。 解决方案：本发明涉及一种制造（1）机械部件（51）的方法，包括以下步骤：（a）提供（3）由可微加工材料制成的基底（53）; 和（b）通过光刻法蚀刻（5）通过整个基板包括机械部件（51）的图案（50）。 该方法还包括以下步骤：（c）将蚀刻的衬底安装（7）到支撑体（55'）上，以使得衬底的顶表面和底表面可接近; （d）在零件的外表面上沉积（9，C'）更好的摩擦学质量的涂层; 和（e）从衬底释放（11）该部件。 版权所有（C）2010，JPO＆INPIT

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